Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
11481 | 1 | CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM | 1006 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | CONDUCTIVE ADHESIVE | authKW | 1528531 | 7% | 73% | 67 |
2 | ANISOTROPIC CONDUCTIVE FILM ACF | authKW | 1183708 | 5% | 82% | 46 |
3 | ANISOTROPIC CONDUCTIVE FILM | authKW | 1144800 | 4% | 89% | 41 |
4 | ELECTRICALLY CONDUCTIVE ADHESIVES | authKW | 1053148 | 4% | 78% | 43 |
5 | ANISOTROPIC CONDUCTIVE ADHESIVE | authKW | 953002 | 3% | 89% | 34 |
6 | ANISOTROPIC CONDUCTIVE ADHESIVE ACA | authKW | 720528 | 2% | 100% | 23 |
7 | ISOTROPIC CONDUCTIVE ADHESIVES | authKW | 390375 | 2% | 69% | 18 |
8 | CHIP ON GLASS COG | authKW | 370975 | 1% | 79% | 15 |
9 | FLIP CHIP | authKW | 305492 | 8% | 12% | 80 |
10 | ELECTRONICALLY CONDUCTIVE ADHESIVES | authKW | 291581 | 1% | 85% | 11 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Materials Science, Multidisciplinary | 7603 | 60% | 0% | 607 |
2 | Engineering, Manufacturing | 6797 | 15% | 0% | 146 |
3 | Engineering, Electrical & Electronic | 6045 | 46% | 0% | 461 |
4 | Physics, Applied | 2189 | 31% | 0% | 316 |
5 | Nanoscience & Nanotechnology | 1863 | 16% | 0% | 156 |
6 | Engineering, Chemical | 527 | 11% | 0% | 109 |
7 | Metallurgy & Metallurgical Engineering | 477 | 8% | 0% | 82 |
8 | Mechanics | 445 | 8% | 0% | 83 |
9 | Materials Science, Composites | 224 | 2% | 0% | 24 |
10 | Polymer Science | 184 | 6% | 0% | 63 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | NANO PACKAGING INTERCONNECT | 195188 | 1% | 69% | 9 |
2 | KEY STATE NEW DISPLAYS SYST PLICAT | 189520 | 1% | 55% | 11 |
3 | ELECT PROD | 153486 | 1% | 35% | 14 |
4 | NTNU NANOMECH | 139307 | 1% | 34% | 13 |
5 | NSF PACKAGING | 100246 | 0% | 80% | 4 |
6 | AUTOMAT MECH ENGN | 74308 | 1% | 22% | 11 |
7 | MODULES COMPONENTS | 70485 | 0% | 75% | 3 |
8 | MAT SCI ENGN PACKAGING | 62655 | 0% | 100% | 2 |
9 | MECH AERONAUT ENGN ADV MAT PROC | 62655 | 0% | 100% | 2 |
10 | STOD ASSEMBLY TECHNOL FI | 62655 | 0% | 100% | 2 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 129678 | 7% | 6% | 69 |
2 | JOURNAL OF ELECTRONICS MANUFACTURING | 82952 | 2% | 13% | 20 |
3 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 82945 | 3% | 8% | 33 |
4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 39037 | 2% | 6% | 22 |
5 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 36746 | 4% | 3% | 41 |
6 | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 31329 | 6% | 2% | 59 |
7 | MICROELECTRONICS RELIABILITY | 27157 | 8% | 1% | 80 |
8 | JOURNAL OF ELECTRONIC PACKAGING | 25277 | 3% | 3% | 32 |
9 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 16005 | 1% | 4% | 14 |
10 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 15478 | 1% | 4% | 14 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |