Class information for:
Level 2: WAFER BONDING//ANODIC BONDING//DIRECT BONDING

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
13 3       PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON 136516
3171 2             WAFER BONDING//ANODIC BONDING//DIRECT BONDING 2326
4923 1                   WAFER BONDING//ANODIC BONDING//DIRECT BONDING 1730
23885 1                   ANAL STRUCT MAT//UNITE RECH PHYS SOLIDE//PHYS MATIERE CONDENSEE NANOSCI LR ES 40 11 354
32118 1                   MAT SCI TECHNOL VITREOUS MAT//ISOPLANAR OPTICAL SYSTEM//EIKONAL THEORY 156
37235 1                   MAKYOH TOPOGRAPHY//SURFACE FLATNESS//MAKYOH 86

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 WAFER BONDING authKW 808803 7% 34% 174
2 ANODIC BONDING authKW 670152 4% 57% 87
3 DIRECT BONDING authKW 223939 2% 42% 39
4 LOW TEMPERATURE BONDING authKW 193087 1% 49% 29
5 SILICON WAFER BONDING authKW 182536 1% 84% 16
6 ROOM TEMPERATURE BONDING authKW 180627 1% 67% 20
7 SURFACE ACTIVATED BONDING authKW 162564 1% 67% 18
8 MAKYOH TOPOGRAPHY authKW 136607 0% 92% 11
9 ANAL STRUCT MAT address 121932 0% 100% 9
10 HERMETICITY authKW 121914 1% 50% 18

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 15871 53% 0% 1230
2 Engineering, Electrical & Electronic 6841 33% 0% 767
3 Instruments & Instrumentation 5558 16% 0% 371
4 Nanoscience & Nanotechnology 5010 17% 0% 387
5 Materials Science, Multidisciplinary 4974 34% 0% 792
6 Materials Science, Coatings & Films 2751 8% 0% 191
7 Physics, Condensed Matter 1136 13% 0% 312
8 Electrochemistry 750 5% 0% 127
9 Optics 628 8% 0% 191
10 Metallurgy & Metallurgical Engineering 521 6% 0% 138

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ANAL STRUCT MAT 121932 0% 100% 9
2 MAT SCI TECHNOL VITREOUS MAT 86704 0% 80% 8
3 UNITE RECH PHYS SOLIDE 66381 0% 70% 7
4 WAFER BONDING 54188 0% 67% 6
5 PHYS MATIERE CONDENSEE NANOSCI LR ES 40 11 40644 0% 100% 3
6 TECHNOL SILICIUM 34672 0% 32% 8
7 ADV MICROSYST INTEGRAT PACKAGING 27096 0% 100% 2
8 FUNDAMENTAL SCI NOVEL MICRO NANO DEV 27096 0% 100% 2
9 OPTOELECT OKI 27096 0% 100% 2
10 SCI GENIE MAT SIM 27096 0% 100% 2

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 27624 5% 2% 108
2 SENSORS AND ACTUATORS A-PHYSICAL 26118 6% 1% 140
3 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 20853 3% 2% 76
4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 18107 3% 2% 61
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 8999 1% 3% 26
6 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 7678 1% 2% 29
7 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 5467 5% 0% 113
8 PHILIPS JOURNAL OF RESEARCH 4037 0% 3% 10
9 JOURNAL OF ELECTRONIC MATERIALS 3213 2% 0% 50
10 APPLIED PHYSICS LETTERS 3080 7% 0% 165

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 WAFER BONDING 808803 7% 34% 174 Search WAFER+BONDING Search WAFER+BONDING
2 ANODIC BONDING 670152 4% 57% 87 Search ANODIC+BONDING Search ANODIC+BONDING
3 DIRECT BONDING 223939 2% 42% 39 Search DIRECT+BONDING Search DIRECT+BONDING
4 LOW TEMPERATURE BONDING 193087 1% 49% 29 Search LOW+TEMPERATURE+BONDING Search LOW+TEMPERATURE+BONDING
5 SILICON WAFER BONDING 182536 1% 84% 16 Search SILICON+WAFER+BONDING Search SILICON+WAFER+BONDING
6 ROOM TEMPERATURE BONDING 180627 1% 67% 20 Search ROOM+TEMPERATURE+BONDING Search ROOM+TEMPERATURE+BONDING
7 SURFACE ACTIVATED BONDING 162564 1% 67% 18 Search SURFACE+ACTIVATED+BONDING Search SURFACE+ACTIVATED+BONDING
8 MAKYOH TOPOGRAPHY 136607 0% 92% 11 Search MAKYOH+TOPOGRAPHY Search MAKYOH+TOPOGRAPHY
9 HERMETICITY 121914 1% 50% 18 Search HERMETICITY Search HERMETICITY
10 WAFER DIRECT BONDING 109019 1% 62% 13 Search WAFER+DIRECT+BONDING Search WAFER+DIRECT+BONDING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 2


rank cluster_id2 link
1 3314 CLEANROOM//PHOTORESIST REMOVAL//MINIENVIRONMENT
2 535 LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY
3 276 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//SENSORS AND ACTUATORS A-PHYSICAL
4 2824 ENERGIA SOLAR//MULTIJUNCTION SOLAR CELLS//INTERMEDIATE BAND
5 1481 TRANSIENT ENHANCED DIFFUSION//NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS//ION IMPLANTATION
6 893 SIGE//STRAINED SI//GERMANIUM
7 2484 TWO PHOTON POLYMERIZATION//MICROLENS ARRAY//MICROLENS
8 1594 POLYCRYSTALLINE SILICON//POLY SI//THIN FILM TRANSISTORS
9 2516 NANOIMPRINT//NANOIMPRINT LITHOGRAPHY//IMPRINT LITHOGRAPHY
10 1480 PLASMA ETCHING//ELECT DEVICES MAT TECHNOL//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

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