Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 30739 | 1 | ACOUSTIC MICRO IMAGING//DRIVING PATTERN SIMULATION//OPEN BUMPS | 179 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | ACOUSTIC MICRO IMAGING | authKW | 880361 | 3% | 100% | 5 |
| 2 | DRIVING PATTERN SIMULATION | authKW | 352144 | 1% | 100% | 2 |
| 3 | OPEN BUMPS | authKW | 352144 | 1% | 100% | 2 |
| 4 | QUALITY SIGNATURE | authKW | 352144 | 1% | 100% | 2 |
| 5 | SOLDER BUMP INSPECTION | authKW | 352144 | 1% | 100% | 2 |
| 6 | FLEX CRACKS | authKW | 234762 | 1% | 67% | 2 |
| 7 | MICROELECTRONIC PACKAGES | authKW | 234762 | 1% | 67% | 2 |
| 8 | SOLDER BUMP | authKW | 209717 | 5% | 13% | 9 |
| 9 | 3D LAMINOGRAPHY | authKW | 176072 | 1% | 100% | 1 |
| 10 | ACOUSTIC GIGAHERTZ MICROSCOPY | authKW | 176072 | 1% | 100% | 1 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Materials Science, Characterization, Testing | 673 | 8% | 0% | 14 |
| 2 | Engineering, Manufacturing | 447 | 9% | 0% | 16 |
| 3 | Engineering, Electrical & Electronic | 397 | 29% | 0% | 52 |
| 4 | Nanoscience & Nanotechnology | 264 | 14% | 0% | 25 |
| 5 | Transportation Science & Technology | 209 | 4% | 0% | 8 |
| 6 | Engineering, Mechanical | 207 | 12% | 0% | 21 |
| 7 | Instruments & Instrumentation | 139 | 9% | 0% | 17 |
| 8 | Materials Science, Multidisciplinary | 133 | 22% | 0% | 39 |
| 9 | Physics, Applied | 128 | 20% | 0% | 35 |
| 10 | Acoustics | 112 | 5% | 0% | 9 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | CHEM ENGN OXIDE MAT | 176072 | 1% | 100% | 1 |
| 2 | ELECT ULTRASON ENGN GRP | 176072 | 1% | 100% | 1 |
| 3 | TAHGSHAN MECHATRON | 176072 | 1% | 100% | 1 |
| 4 | TANGSHAN MECH | 176072 | 1% | 100% | 1 |
| 5 | TANGSHAN MECHATRON | 176072 | 1% | 100% | 1 |
| 6 | GEN ENGN | 102179 | 9% | 4% | 16 |
| 7 | NEW E OCEAN | 88035 | 1% | 50% | 1 |
| 8 | PACKAGE ENGN TEAM | 88035 | 1% | 50% | 1 |
| 9 | SAE TECHNOL | 88035 | 1% | 50% | 1 |
| 10 | DELPHI ELECT SAFETY | 44017 | 1% | 25% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 21030 | 6% | 1% | 11 |
| 2 | MICROELECTRONICS RELIABILITY | 6899 | 9% | 0% | 17 |
| 3 | JOURNAL OF ELECTRONIC PACKAGING | 4995 | 3% | 0% | 6 |
| 4 | INTERNATIONAL JOURNAL OF VEHICLE DESIGN | 4101 | 3% | 0% | 6 |
| 5 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 3821 | 3% | 0% | 5 |
| 6 | MATERIALS EVALUATION | 3766 | 3% | 0% | 6 |
| 7 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 3068 | 3% | 0% | 5 |
| 8 | ASSEMBLY AUTOMATION | 2413 | 2% | 0% | 3 |
| 9 | NDT & E INTERNATIONAL | 2410 | 3% | 0% | 5 |
| 10 | MACHINE DESIGN | 1933 | 1% | 1% | 1 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |