Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 21084 | 1 | TIN WHISKERS//SN WHISKER//WHISKER GROWTH | 457 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | TIN WHISKERS | authKW | 5057937 | 19% | 82% | 89 |
| 2 | SN WHISKER | authKW | 1699321 | 7% | 79% | 31 |
| 3 | WHISKER GROWTH | authKW | 1043061 | 5% | 69% | 22 |
| 4 | TIN PLATING | authKW | 574683 | 3% | 56% | 15 |
| 5 | METAL WHISKERS | authKW | 310333 | 1% | 75% | 6 |
| 6 | MAT SEMICOND STRUCT | address | 215507 | 1% | 63% | 5 |
| 7 | WHISKER | authKW | 209255 | 12% | 5% | 56 |
| 8 | AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNOL | address | 206891 | 1% | 100% | 3 |
| 9 | ELECTROPLATED TIN | authKW | 206891 | 1% | 100% | 3 |
| 10 | SN PLATING | authKW | 206891 | 1% | 100% | 3 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Materials Science, Multidisciplinary | 3094 | 57% | 0% | 262 |
| 2 | Metallurgy & Metallurgical Engineering | 2931 | 27% | 0% | 124 |
| 3 | Physics, Applied | 1768 | 41% | 0% | 186 |
| 4 | Engineering, Manufacturing | 1591 | 11% | 0% | 48 |
| 5 | Engineering, Electrical & Electronic | 935 | 28% | 0% | 128 |
| 6 | Materials Science, Coatings & Films | 466 | 8% | 0% | 35 |
| 7 | Nanoscience & Nanotechnology | 449 | 12% | 0% | 53 |
| 8 | Mining & Mineral Processing | 114 | 2% | 0% | 8 |
| 9 | Physics, Condensed Matter | 84 | 9% | 0% | 42 |
| 10 | Mineralogy | 55 | 2% | 0% | 8 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MAT SEMICOND STRUCT | 215507 | 1% | 63% | 5 |
| 2 | AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNOL | 206891 | 1% | 100% | 3 |
| 3 | IMPLEMENTAT PROD | 183900 | 1% | 67% | 4 |
| 4 | ISG GRP | 137927 | 0% | 100% | 2 |
| 5 | MARITIME MISSION | 137927 | 0% | 100% | 2 |
| 6 | ORBITER SUSTAINING ENGN OFF | 137927 | 0% | 100% | 2 |
| 7 | CORROS STUDIES | 91950 | 0% | 67% | 2 |
| 8 | PACKAGING FINISHING TECHNOL | 91950 | 0% | 67% | 2 |
| 9 | ADV ELECT JOINING MAT | 68964 | 0% | 100% | 1 |
| 10 | AUTOMOT ELECT ENGN ASSEMBLY INTERCONNECT TECHNO | 68964 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 189589 | 7% | 8% | 33 |
| 2 | JOURNAL OF ELECTRONIC MATERIALS | 18838 | 12% | 1% | 53 |
| 3 | MICROELECTRONICS RELIABILITY | 9557 | 7% | 0% | 32 |
| 4 | CIRCUIT WORLD | 7899 | 1% | 2% | 5 |
| 5 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 5814 | 2% | 1% | 11 |
| 6 | TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 3509 | 2% | 1% | 8 |
| 7 | JOURNAL OF MATERIALS RESEARCH | 2992 | 5% | 0% | 23 |
| 8 | GALVANOTECHNIK | 2651 | 0% | 4% | 1 |
| 9 | JOURNAL OF THE JAPAN INSTITUTE OF METALS | 1943 | 3% | 0% | 13 |
| 10 | JOM | 1924 | 2% | 0% | 8 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | TIN WHISKERS | 5057937 | 19% | 82% | 89 | Search TIN+WHISKERS | Search TIN+WHISKERS |
| 2 | SN WHISKER | 1699321 | 7% | 79% | 31 | Search SN+WHISKER | Search SN+WHISKER |
| 3 | WHISKER GROWTH | 1043061 | 5% | 69% | 22 | Search WHISKER+GROWTH | Search WHISKER+GROWTH |
| 4 | TIN PLATING | 574683 | 3% | 56% | 15 | Search TIN+PLATING | Search TIN+PLATING |
| 5 | METAL WHISKERS | 310333 | 1% | 75% | 6 | Search METAL+WHISKERS | Search METAL+WHISKERS |
| 6 | WHISKER | 209255 | 12% | 5% | 56 | Search WHISKER | Search WHISKER |
| 7 | ELECTROPLATED TIN | 206891 | 1% | 100% | 3 | Search ELECTROPLATED+TIN | Search ELECTROPLATED+TIN |
| 8 | SN PLATING | 206891 | 1% | 100% | 3 | Search SN+PLATING | Search SN+PLATING |
| 9 | TIN ELECTROPLATING | 183900 | 1% | 67% | 4 | Search TIN+ELECTROPLATING | Search TIN+ELECTROPLATING |
| 10 | LEADFRAME PACKAGE | 155167 | 1% | 75% | 3 | Search LEADFRAME+PACKAGE | Search LEADFRAME+PACKAGE |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |