Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
521 | 3 | SILICON CARBIDE//4H SIC//SIC | 21253 |
1718 | 2 | IGBT//LDMOS//POWER MOSFET | 6942 |
14701 | 1 | COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT//DYNAMIC THERMAL MANAGEMENT DTM | 783 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | COMPACT THERMAL MODEL | authKW | 503109 | 3% | 63% | 20 |
2 | DYNAMIC THERMAL MANAGEMENT | authKW | 482987 | 2% | 67% | 18 |
3 | DYNAMIC THERMAL MANAGEMENT DTM | authKW | 335413 | 1% | 83% | 10 |
4 | THERMAL SPREADING RESISTANCE | authKW | 250783 | 1% | 69% | 9 |
5 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | journal | 218478 | 10% | 7% | 79 |
6 | THERMAL PLACEMENT | authKW | 167706 | 1% | 83% | 5 |
7 | ELECTROMAGNETIC COMPATIBILITY EMC SCREEN | authKW | 120750 | 0% | 100% | 3 |
8 | LEAKAGE TEMPERATURE DEPENDENCY | authKW | 120750 | 0% | 100% | 3 |
9 | TEMPERATURE DEPENDENT LEAKAGE POWER | authKW | 120750 | 0% | 100% | 3 |
10 | THERMAL MANAGEMENT | authKW | 107296 | 6% | 5% | 50 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Computer Science, Hardware & Architecture | 14558 | 24% | 0% | 191 |
2 | Engineering, Electrical & Electronic | 9151 | 63% | 0% | 491 |
3 | Engineering, Manufacturing | 3746 | 12% | 0% | 96 |
4 | Engineering, Mechanical | 1264 | 14% | 0% | 107 |
5 | Materials Science, Multidisciplinary | 877 | 26% | 0% | 202 |
6 | Nanoscience & Nanotechnology | 735 | 11% | 0% | 89 |
7 | Computer Science, Software Engineering | 690 | 7% | 0% | 57 |
8 | Thermodynamics | 631 | 8% | 0% | 61 |
9 | Computer Science, Interdisciplinary Applications | 443 | 7% | 0% | 55 |
10 | Computer Science, Theory & Methods | 184 | 5% | 0% | 38 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | DRTS | 72448 | 0% | 60% | 3 |
2 | MICROELECT COMP SCI | 57939 | 2% | 12% | 12 |
3 | MINIST EDUC CHINA DESIGN ELE OMAG | 53665 | 0% | 67% | 2 |
4 | PHYS ELE OTECHNOL | 48590 | 1% | 15% | 8 |
5 | MICROELECT HEAT TRANSFER | 41077 | 1% | 15% | 7 |
6 | ADV ELECT PACKAGING | 40250 | 0% | 100% | 1 |
7 | ADV LOG BEOL INTEGRAT | 40250 | 0% | 100% | 1 |
8 | ADV OPT MAT | 40250 | 0% | 100% | 1 |
9 | ADV PROD DESIGN DEV | 40250 | 0% | 100% | 1 |
10 | ADV RELIBIL METHODS | 40250 | 0% | 100% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 218478 | 10% | 7% | 79 |
2 | JOURNAL OF ELECTRONIC PACKAGING | 92605 | 7% | 4% | 54 |
3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 87189 | 4% | 7% | 29 |
4 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 29901 | 4% | 2% | 31 |
5 | MICROELECTRONICS JOURNAL | 26613 | 7% | 1% | 51 |
6 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 16367 | 6% | 1% | 45 |
7 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 16165 | 3% | 2% | 24 |
8 | IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS | 15115 | 5% | 1% | 37 |
9 | SUSTAINABLE COMPUTING-INFORMATICS & SYSTEMS | 13495 | 1% | 5% | 7 |
10 | ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS | 9712 | 2% | 2% | 14 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |