Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 515 | 3 | THERMAL CONDUCTIVITY//THERMAL DIFFUSIVITY//PHONON TRANSPORT | 21578 |
| 1075 | 2 | THERMAL CONDUCTIVITY//PHONON TRANSPORT//THERMAL DIFFUSIVITY | 10214 |
| 19378 | 1 | THERMAL CONTACT CONDUCTANCE//THERMAL CONTACT RESISTANCE//THERMAL PACKAGING | 532 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | THERMAL CONTACT CONDUCTANCE | authKW | 2013486 | 10% | 62% | 55 |
| 2 | THERMAL CONTACT RESISTANCE | authKW | 775163 | 11% | 22% | 59 |
| 3 | THERMAL PACKAGING | authKW | 299900 | 2% | 56% | 9 |
| 4 | CONTACT CONDUCTANCE | authKW | 197457 | 2% | 33% | 10 |
| 5 | COMPENSATION HEATER | authKW | 189570 | 1% | 80% | 4 |
| 6 | THERMAL CONTACT CONDUCTANCE TCC | authKW | 189570 | 1% | 80% | 4 |
| 7 | PARALLEL COLUMN MODEL | authKW | 177723 | 1% | 100% | 3 |
| 8 | THERMAL CONSTRICTION | authKW | 164554 | 1% | 56% | 5 |
| 9 | MICROELECT HEAT TRANSFER | address | 149320 | 2% | 23% | 11 |
| 10 | BN THIN FILM | authKW | 118482 | 0% | 100% | 2 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Thermodynamics | 27624 | 58% | 0% | 309 |
| 2 | Engineering, Mechanical | 14056 | 52% | 0% | 278 |
| 3 | Mechanics | 2733 | 25% | 0% | 135 |
| 4 | Energy & Fuels | 132 | 6% | 0% | 32 |
| 5 | Engineering, Manufacturing | 131 | 3% | 0% | 16 |
| 6 | Physics, Applied | 122 | 13% | 0% | 67 |
| 7 | Engineering, General | 85 | 4% | 0% | 19 |
| 8 | Engineering, Aerospace | 64 | 2% | 0% | 10 |
| 9 | Nuclear Science & Technology | 57 | 4% | 0% | 20 |
| 10 | Instruments & Instrumentation | 51 | 4% | 0% | 21 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MICROELECT HEAT TRANSFER | 149320 | 2% | 23% | 11 |
| 2 | OPTIMIZAT DEV ENERGY TECHNOL | 118482 | 0% | 100% | 2 |
| 3 | ADV THERMAL TECHNOL | 59241 | 0% | 100% | 1 |
| 4 | CRYOGEN FLUIDS BRANCH CODE 552 | 59241 | 0% | 100% | 1 |
| 5 | DEV PROD PACKAGING POWER COOLING GRP | 59241 | 0% | 100% | 1 |
| 6 | EA 387 GTE | 59241 | 0% | 100% | 1 |
| 7 | HEAD EXPT HEAT TRANSFER SECT | 59241 | 0% | 100% | 1 |
| 8 | HEAT TRANSFER 1 | 59241 | 0% | 100% | 1 |
| 9 | IND COMPONENTS EQUIPMENT | 59241 | 0% | 100% | 1 |
| 10 | INPG CNRS SOLS | 59241 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER | 87498 | 12% | 2% | 62 |
| 2 | JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 30744 | 11% | 1% | 58 |
| 3 | CRYOGENICS | 9396 | 5% | 1% | 28 |
| 4 | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 8500 | 10% | 0% | 51 |
| 5 | EXPERIMENTAL HEAT TRANSFER | 5552 | 2% | 1% | 8 |
| 6 | HEAT AND MASS TRANSFER | 2889 | 2% | 0% | 12 |
| 7 | APPLIED THERMAL ENGINEERING | 2256 | 4% | 0% | 20 |
| 8 | REVUE GENERALE DE THERMIQUE | 2171 | 1% | 1% | 4 |
| 9 | JOURNAL OF ELECTRONIC PACKAGING | 1673 | 1% | 0% | 6 |
| 10 | INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER | 1669 | 2% | 0% | 11 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |