Class information for:
Level 1: CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
15 4 METALLURGY & METALLURGICAL ENGINEERING//MATERIALS SCIENCE, MULTIDISCIPLINARY//MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 827627
472 3       ENGINEERING, MANUFACTURING//INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE//CUTTING FORCE 25360
2541 2             CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL POLISHING CMP 4015
2447 1                   CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION 2277

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 CHEMICAL MECHANICAL POLISHING authKW 3773225 17% 71% 383
2 CMP authKW 1803395 10% 55% 237
3 CHEMICAL MECHANICAL PLANARIZATION authKW 1209498 5% 82% 107
4 CHEMICAL MECHANICAL POLISHING CMP authKW 1187050 6% 66% 129
5 CHEMICAL MECHANICAL PLANARIZATION CMP authKW 584849 2% 78% 54
6 POLISHING PAD authKW 332535 1% 83% 29
7 DISHING authKW 292351 1% 81% 26
8 NANO SOI PROC address 251159 1% 55% 33
9 REMOVAL RATE authKW 248246 3% 30% 59
10 PLANARIZATION authKW 238473 3% 28% 62

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Coatings & Films 26014 24% 0% 557
2 Engineering, Manufacturing 12798 13% 0% 302
3 Electrochemistry 8940 17% 0% 394
4 Physics, Applied 8302 40% 0% 902
5 Materials Science, Multidisciplinary 3813 31% 0% 697
6 Engineering, Mechanical 2243 11% 0% 248
7 Nanoscience & Nanotechnology 1910 11% 0% 246
8 Engineering, Electrical & Electronic 1855 19% 0% 428
9 Physics, Condensed Matter 1830 17% 0% 376
10 Engineering, Industrial 543 3% 0% 67

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 NANO SOI PROC 251159 1% 55% 33
2 FAB 173888 1% 74% 17
3 SHENZHEN MICRO NANO MFG 150691 1% 78% 14
4 ADV MAT PROC 121164 5% 8% 113
5 ENERGY OURCES TECHNOL 110693 1% 40% 20
6 STATE TRIBOL 78008 5% 5% 105
7 ADV SEMICOND MAT DEVICE DEV 72797 0% 48% 11
8 GP TECHNOL 69198 0% 100% 5
9 ADV SEMICOND MAT DEVICES DEV 62009 0% 41% 11
10 SEMICOND DISPLAY 44285 0% 80% 4

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 90052 4% 7% 98
2 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 55706 15% 1% 352
3 ELECTROCHEMICAL AND SOLID STATE LETTERS 34249 5% 2% 103
4 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 31063 3% 4% 60
5 MICROELECTRONIC ENGINEERING 27568 6% 1% 144
6 SOLID STATE TECHNOLOGY 19264 2% 3% 51
7 MICRO 13265 1% 7% 13
8 INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY 7800 0% 6% 10
9 CIRP ANNALS-MANUFACTURING TECHNOLOGY 5446 1% 1% 31
10 JAPANESE JOURNAL OF APPLIED PHYSICS 4367 3% 0% 73

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 CHEMICAL MECHANICAL POLISHING 3773225 17% 71% 383 Search CHEMICAL+MECHANICAL+POLISHING Search CHEMICAL+MECHANICAL+POLISHING
2 CMP 1803395 10% 55% 237 Search CMP Search CMP
3 CHEMICAL MECHANICAL PLANARIZATION 1209498 5% 82% 107 Search CHEMICAL+MECHANICAL+PLANARIZATION Search CHEMICAL+MECHANICAL+PLANARIZATION
4 CHEMICAL MECHANICAL POLISHING CMP 1187050 6% 66% 129 Search CHEMICAL+MECHANICAL+POLISHING+CMP Search CHEMICAL+MECHANICAL+POLISHING+CMP
5 CHEMICAL MECHANICAL PLANARIZATION CMP 584849 2% 78% 54 Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP
6 POLISHING PAD 332535 1% 83% 29 Search POLISHING+PAD Search POLISHING+PAD
7 DISHING 292351 1% 81% 26 Search DISHING Search DISHING
8 REMOVAL RATE 248246 3% 30% 59 Search REMOVAL+RATE Search REMOVAL+RATE
9 PLANARIZATION 238473 3% 28% 62 Search PLANARIZATION Search PLANARIZATION
10 POST CMP CLEANING 217963 1% 75% 21 Search POST+CMP+CLEANING Search POST+CMP+CLEANING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 8802 ABRASIVE FLOW MACHINING//MAGNETIC ABRASIVE FINISHING//BONNET POLISHING
2 30589 MAGNETIC COMPOUND FLUID MCF//MAGNETIC FLOAT POLISHING MFP//MAGNETIC COMPOUND FLUID
3 38423 AREAL SURFACE//FILAMENT TOOL//GUTTER BRUSHES
4 8199 NANOMETRIC CUTTING//WIRE SAWING//DUCTILE MODE MACHINING
5 10286 ELECTROCHEMICAL MACHINING//TOY GAME DESIGN//ELECTROCHEMICAL MICROMACHINING
6 33076 DEBRIS PARTICLES//UNIV BEREICH STADTMITTE//ENERGY OF TRANSFER
7 25310 DEVICE TECHNOL MODELING//NARROW CHANNEL TRANSISTOR//NOISE ADAPTABILITY
8 33159 TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS//COMBINATORIAL COMPUTATIONAL CHEMISTRY//TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS METHOD
9 18983 SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM
10 37185 DICING BLADE//DIAMOND CHARGING PROCESS//LAPPING PLATE TOPOGRAPHY

Go to start page