Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
13 | 3 | PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON | 136516 |
389 | 2 | MICROCRYSTALLINE SILICON//JOURNAL OF NON-CRYSTALLINE SOLIDS//AMORPHOUS SILICON | 17376 |
36059 | 1 | LADDER SILICONE SPIN ON GLASS LS SOG//POLYSILOXENE BASED FILM//REACTIVE HYDROGEN PLASMA SPUTTERING | 104 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | LADDER SILICONE SPIN ON GLASS LS SOG | authKW | 606097 | 2% | 100% | 2 |
2 | POLYSILOXENE BASED FILM | authKW | 606097 | 2% | 100% | 2 |
3 | REACTIVE HYDROGEN PLASMA SPUTTERING | authKW | 606097 | 2% | 100% | 2 |
4 | SIO2 PATTERN GENERATION | authKW | 606097 | 2% | 100% | 2 |
5 | SOG FILMS | authKW | 606097 | 2% | 100% | 2 |
6 | MICROELE SYST | address | 404064 | 2% | 67% | 2 |
7 | TOPOGRAPHY PLANARIZATION | authKW | 404064 | 2% | 67% | 2 |
8 | DEPOSITION ETCHING | authKW | 303049 | 1% | 100% | 1 |
9 | DIODE TYPE REACTOR | authKW | 303049 | 1% | 100% | 1 |
10 | EB INDUCED REACTION | authKW | 303049 | 1% | 100% | 1 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Physics, Applied | 855 | 58% | 0% | 60 |
2 | Materials Science, Ceramics | 282 | 11% | 0% | 11 |
3 | Physics, Condensed Matter | 234 | 26% | 0% | 27 |
4 | Materials Science, Coatings & Films | 210 | 11% | 0% | 11 |
5 | COMPUTER APPLICATIONS & CYBERNETICS | 114 | 1% | 0% | 1 |
6 | Materials Science, Multidisciplinary | 26 | 14% | 0% | 15 |
7 | Engineering, Electrical & Electronic | 19 | 11% | 0% | 11 |
8 | Nanoscience & Nanotechnology | 13 | 5% | 0% | 5 |
9 | Instruments & Instrumentation | 9 | 4% | 0% | 4 |
10 | Chemistry, Physical | 7 | 9% | 0% | 9 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | MICROELE SYST | 404064 | 2% | 67% | 2 |
2 | COMP SCI ELE | 30303 | 1% | 10% | 1 |
3 | ST | 3403 | 1% | 1% | 1 |
4 | CAMD | 2597 | 2% | 0% | 2 |
5 | MICROMFG | 2430 | 2% | 0% | 2 |
6 | PL ELECT | 779 | 2% | 0% | 2 |
7 | MFG | 213 | 1% | 0% | 1 |
8 | BIOSCI BIOENGN | 130 | 1% | 0% | 1 |
9 | BECKMAN ADV SCI TECHNOL | 110 | 1% | 0% | 1 |
10 | ELECT COMP SCI | 67 | 1% | 0% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS | 10864 | 4% | 1% | 4 |
2 | JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 4907 | 13% | 0% | 14 |
3 | OPTOELECTRONICS-DEVICES AND TECHNOLOGIES | 3292 | 1% | 1% | 1 |
4 | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2187 | 14% | 0% | 15 |
5 | INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2044 | 2% | 0% | 2 |
6 | APPLICATIONS OF SURFACE SCIENCE | 2006 | 2% | 0% | 2 |
7 | JAPAN ANNUAL REVIEWS IN ELECTRONICS COMPUTERS & TELECOMMUNICATIONS | 1720 | 1% | 1% | 1 |
8 | JOURNAL OF NON-CRYSTALLINE SOLIDS | 1305 | 10% | 0% | 10 |
9 | INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE | 1005 | 1% | 0% | 1 |
10 | SOLID STATE COMMUNICATIONS | 747 | 8% | 0% | 8 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |