Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
13 | 3 | PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON | 136516 |
197 | 2 | IEEE TRANSACTIONS ON ELECTRON DEVICES//MOSFET//FLASH MEMORY | 20765 |
33621 | 1 | DEUTERIUM ANNEALING//SID4//ADSORPTION HYDROGEN PASSIVATION | 136 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | DEUTERIUM ANNEALING | authKW | 308989 | 1% | 67% | 2 |
2 | SID4 | authKW | 308989 | 1% | 67% | 2 |
3 | ADSORPTION HYDROGEN PASSIVATION | authKW | 231743 | 1% | 100% | 1 |
4 | CMOS HOT ELECTRON RELIABILITY | authKW | 231743 | 1% | 100% | 1 |
5 | CPU TECH TEAM | address | 231743 | 1% | 100% | 1 |
6 | DANGLING BOND PASSIVATION | authKW | 231743 | 1% | 100% | 1 |
7 | DEUTERIUM D 2 | authKW | 231743 | 1% | 100% | 1 |
8 | DEUTERIUM MATERIALS DEVICES | authKW | 231743 | 1% | 100% | 1 |
9 | DEUTERIUM PASSIVATION ELECTROCHEMICAL REACTIONS | authKW | 231743 | 1% | 100% | 1 |
10 | FOWLER NORDHEIM ELECTRON INJECTION | authKW | 231743 | 1% | 100% | 1 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Physics, Applied | 1165 | 59% | 0% | 80 |
2 | Engineering, Electrical & Electronic | 310 | 29% | 0% | 40 |
3 | Materials Science, Coatings & Films | 58 | 5% | 0% | 7 |
4 | Nanoscience & Nanotechnology | 47 | 7% | 0% | 10 |
5 | Physics, Condensed Matter | 34 | 10% | 0% | 14 |
6 | Computer Science, Hardware & Architecture | 16 | 2% | 0% | 3 |
7 | Computer Science, Software Engineering | 15 | 3% | 0% | 4 |
8 | Materials Science, Ceramics | 12 | 2% | 0% | 3 |
9 | Mathematical & Computational Biology | 5 | 1% | 0% | 2 |
10 | Materials Science, Multidisciplinary | 5 | 8% | 0% | 11 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | CPU TECH TEAM | 231743 | 1% | 100% | 1 |
2 | LINUX SOFTWARE DEV | 231743 | 1% | 100% | 1 |
3 | NANOSCALE SCIENEC ENGN | 231743 | 1% | 100% | 1 |
4 | NAREGI PROJECT | 231743 | 1% | 100% | 1 |
5 | SERVER SYST UNIT | 231743 | 1% | 100% | 1 |
6 | TECHNOL DEV PROJECT TEAM | 231743 | 1% | 100% | 1 |
7 | IMAGING SOLUT GRP | 115870 | 1% | 50% | 1 |
8 | MICROMAGNET ELECT DEVICES | 84267 | 1% | 18% | 2 |
9 | BECKMAN COULTER INC | 77246 | 1% | 33% | 1 |
10 | GLOBAL SCI COMP | 77246 | 1% | 33% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | AMERICAN JOURNAL OF PHARMACOGENOMICS | 6814 | 1% | 3% | 1 |
2 | IEEE ELECTRON DEVICE LETTERS | 3010 | 8% | 0% | 11 |
3 | LECTURE NOTES IN BIOINFORMATICS | 2969 | 1% | 1% | 1 |
4 | APPLIED PHYSICS LETTERS | 1992 | 23% | 0% | 31 |
5 | FRONTIERS OF COMPUTER SCIENCE IN CHINA | 1465 | 1% | 1% | 1 |
6 | IEEE TRANSACTIONS ON ELECTRON DEVICES | 1465 | 7% | 0% | 10 |
7 | ELECTROCHEMICAL AND SOLID STATE LETTERS | 1349 | 4% | 0% | 5 |
8 | JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY | 1275 | 2% | 0% | 3 |
9 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 819 | 1% | 0% | 2 |
10 | INTERNATIONAL JOURNAL OF ELECTRONIC COMMERCE | 633 | 1% | 0% | 1 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |