Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
13 | 3 | PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON | 136516 |
197 | 2 | IEEE TRANSACTIONS ON ELECTRON DEVICES//MOSFET//FLASH MEMORY | 20765 |
4663 | 1 | HOT CARRIERS//HOT CARRIER DEGRADATION//HOT CARRIER EFFECT | 1771 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | HOT CARRIERS | authKW | 377195 | 6% | 20% | 108 |
2 | HOT CARRIER DEGRADATION | authKW | 293573 | 2% | 50% | 33 |
3 | HOT CARRIER EFFECT | authKW | 236462 | 2% | 36% | 37 |
4 | IEEE TRANSACTIONS ON ELECTRON DEVICES | journal | 214845 | 25% | 3% | 435 |
5 | CHARGE PUMPING | authKW | 207165 | 2% | 31% | 38 |
6 | CHARGE PUMPING CP | authKW | 202181 | 1% | 45% | 25 |
7 | CHANNEL INITIATED SECONDARY ELECTRON CHISEL | authKW | 161765 | 1% | 91% | 10 |
8 | GIDL | authKW | 140598 | 1% | 44% | 18 |
9 | IEEE ELECTRON DEVICE LETTERS | journal | 122670 | 14% | 3% | 253 |
10 | CHANNEL HOT ELECTRON CHE | authKW | 110867 | 1% | 69% | 9 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 33095 | 78% | 0% | 1390 |
2 | Physics, Applied | 18099 | 64% | 0% | 1132 |
3 | Nanoscience & Nanotechnology | 2793 | 14% | 0% | 255 |
4 | Physics, Condensed Matter | 825 | 13% | 0% | 233 |
5 | Physics, Multidisciplinary | 52 | 4% | 0% | 76 |
6 | Computer Science, Hardware & Architecture | 43 | 1% | 0% | 21 |
7 | Optics | 39 | 4% | 0% | 62 |
8 | Materials Science, Coatings & Films | 7 | 1% | 0% | 17 |
9 | COMPUTER APPLICATIONS & CYBERNETICS | 5 | 0% | 0% | 1 |
10 | Computer Science, Interdisciplinary Applications | 1 | 1% | 0% | 15 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | EXPLORATORY DEVICE | 71177 | 0% | 100% | 4 |
2 | FLORIDA SOLID STATE ELECT | 58230 | 0% | 55% | 6 |
3 | PROC DEV IMPLEMENTAT | 47449 | 0% | 67% | 4 |
4 | PHYS COMPOSANTS SEMICONDUCTEURS | 40036 | 0% | 75% | 3 |
5 | MECHATON TECHNOL | 35589 | 0% | 100% | 2 |
6 | MICROELECT SEMICOND DEVICE PHYS | 35589 | 0% | 100% | 2 |
7 | PHYS COMPOSANTS SEMICONDUCT | 35589 | 0% | 100% | 2 |
8 | RM DEV | 35589 | 0% | 100% | 2 |
9 | SEMICOND TECHNOL PLICAT GRP | 26682 | 0% | 25% | 6 |
10 | INTEGRATED CIRCUIT FAILURE ANAL RELIABIL | 26542 | 1% | 15% | 10 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTRON DEVICES | 214845 | 25% | 3% | 435 |
2 | IEEE ELECTRON DEVICE LETTERS | 122670 | 14% | 3% | 253 |
3 | MICROELECTRONICS RELIABILITY | 64884 | 9% | 2% | 164 |
4 | SOLID-STATE ELECTRONICS | 48448 | 9% | 2% | 165 |
5 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 18203 | 2% | 3% | 34 |
6 | MICROELECTRONIC ENGINEERING | 6305 | 3% | 1% | 61 |
7 | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2244 | 4% | 0% | 64 |
8 | ELECTRON DEVICE LETTERS | 2116 | 0% | 2% | 6 |
9 | JAPANESE JOURNAL OF APPLIED PHYSICS | 1749 | 2% | 0% | 41 |
10 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1605 | 2% | 0% | 28 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |