Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
13 | 3 | PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON | 136516 |
197 | 2 | IEEE TRANSACTIONS ON ELECTRON DEVICES//MOSFET//FLASH MEMORY | 20765 |
9421 | 1 | EFFECTIVE CHANNEL LENGTH//LOW TEMPERATURE ELECTRONICS//CRYOGENIC CMOS | 1190 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | EFFECTIVE CHANNEL LENGTH | authKW | 265549 | 2% | 53% | 19 |
2 | LOW TEMPERATURE ELECTRONICS | authKW | 161401 | 1% | 38% | 16 |
3 | CRYOGENIC CMOS | authKW | 132416 | 0% | 100% | 5 |
4 | SOLID-STATE ELECTRONICS | journal | 112739 | 17% | 2% | 206 |
5 | RSCE | authKW | 110345 | 0% | 83% | 5 |
6 | IEEE TRANSACTIONS ON ELECTRON DEVICES | journal | 108948 | 21% | 2% | 254 |
7 | C R METHOD | authKW | 79449 | 0% | 100% | 3 |
8 | CHANNEL LENGTH EXTRACTION | authKW | 79449 | 0% | 100% | 3 |
9 | DOPANT PILE UP | authKW | 79449 | 0% | 100% | 3 |
10 | DRAIN SOURCE RESISTANCE | authKW | 79449 | 0% | 100% | 3 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 20395 | 75% | 0% | 896 |
2 | Physics, Applied | 9705 | 57% | 0% | 684 |
3 | Physics, Condensed Matter | 1852 | 22% | 0% | 262 |
4 | Computer Science, Hardware & Architecture | 655 | 4% | 0% | 53 |
5 | Thermodynamics | 227 | 4% | 0% | 49 |
6 | Nanoscience & Nanotechnology | 164 | 5% | 0% | 60 |
7 | Computer Science, Interdisciplinary Applications | 143 | 4% | 0% | 43 |
8 | Instruments & Instrumentation | 102 | 4% | 0% | 45 |
9 | Physics, Multidisciplinary | 48 | 5% | 0% | 56 |
10 | Engineering, General | 13 | 1% | 0% | 16 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | ADV LOG SRAM ALS | 26483 | 0% | 100% | 1 |
2 | ARCHITECTURE IC DESIGN EMBEDDED SOFTWARE | 26483 | 0% | 100% | 1 |
3 | CENT INTEGRAT | 26483 | 0% | 100% | 1 |
4 | CNRSUMR 5130IMEP LAHC | 26483 | 0% | 100% | 1 |
5 | CORP DEV VLSI TECHNOL | 26483 | 0% | 100% | 1 |
6 | CUSTOMER INTEGRAT ENGN | 26483 | 0% | 100% | 1 |
7 | DMEL CEA TECHNOL AVANCES LETI | 26483 | 0% | 100% | 1 |
8 | DRAM TD TEAM | 26483 | 0% | 100% | 1 |
9 | ELE O ACOUST ELE ON DEVICE MODELLING | 26483 | 0% | 100% | 1 |
10 | ELE ON ESTADO SOLIDO | 26483 | 0% | 100% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | SOLID-STATE ELECTRONICS | 112739 | 17% | 2% | 206 |
2 | IEEE TRANSACTIONS ON ELECTRON DEVICES | 108948 | 21% | 2% | 254 |
3 | IEEE ELECTRON DEVICE LETTERS | 20522 | 7% | 1% | 85 |
4 | CRYOGENICS | 12322 | 4% | 1% | 48 |
5 | IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION | 10088 | 1% | 2% | 16 |
6 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 7646 | 3% | 1% | 38 |
7 | ELECTRON DEVICE LETTERS | 5615 | 1% | 3% | 8 |
8 | IEE PROCEEDINGS-G CIRCUITS DEVICES AND SYSTEMS | 3545 | 1% | 1% | 10 |
9 | MICROELECTRONICS RELIABILITY | 2577 | 2% | 0% | 27 |
10 | ELECTRONICS LETTERS | 2559 | 5% | 0% | 63 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |