Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
13 | 3 | PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON | 136516 |
197 | 2 | IEEE TRANSACTIONS ON ELECTRON DEVICES//MOSFET//FLASH MEMORY | 20765 |
3071 | 1 | STRESS INDUCED LEAKAGE CURRENT//OXIDE RELIABILITY//OXIDE BREAKDOWN | 2101 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | STRESS INDUCED LEAKAGE CURRENT | authKW | 430425 | 2% | 74% | 39 |
2 | OXIDE RELIABILITY | authKW | 387869 | 2% | 63% | 41 |
3 | OXIDE BREAKDOWN | authKW | 365379 | 2% | 59% | 41 |
4 | SOFT BREAKDOWN | authKW | 361208 | 2% | 71% | 34 |
5 | DIELECTRIC BREAKDOWN | authKW | 291478 | 5% | 19% | 105 |
6 | TIME DEPENDENT DIELECTRIC BREAKDOWN TDDB | authKW | 259202 | 2% | 44% | 39 |
7 | HARD BREAKDOWN | authKW | 242982 | 1% | 90% | 18 |
8 | MOS DEVICES | authKW | 190199 | 3% | 20% | 65 |
9 | STRESS INDUCED LEAKAGE CURRENT SILC | authKW | 172466 | 1% | 50% | 23 |
10 | MICROELECTRONICS RELIABILITY | journal | 160815 | 13% | 4% | 281 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Physics, Applied | 28939 | 74% | 0% | 1547 |
2 | Engineering, Electrical & Electronic | 20062 | 57% | 0% | 1197 |
3 | Nanoscience & Nanotechnology | 9463 | 24% | 0% | 495 |
4 | Physics, Condensed Matter | 1447 | 15% | 0% | 325 |
5 | Materials Science, Coatings & Films | 775 | 5% | 0% | 101 |
6 | Optics | 377 | 7% | 0% | 147 |
7 | Materials Science, Ceramics | 208 | 2% | 0% | 49 |
8 | Materials Science, Multidisciplinary | 124 | 9% | 0% | 192 |
9 | Electrochemistry | 62 | 2% | 0% | 45 |
10 | Computer Science, Hardware & Architecture | 41 | 1% | 0% | 23 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | ZI ROUSSET | 83059 | 1% | 46% | 12 |
2 | AUTOMAT MICROELECT | 63510 | 1% | 35% | 12 |
3 | ENG ELECT | 41529 | 0% | 46% | 6 |
4 | PHYS COMPOSANTS SEMICOND | 36716 | 1% | 19% | 13 |
5 | ETUD MICROELECT MAT | 33746 | 0% | 75% | 3 |
6 | L2MP POLYTECH | 33746 | 0% | 75% | 3 |
7 | SEMICOND DEVICE RELIABIL | 33746 | 0% | 75% | 3 |
8 | CATANIA TECHNOL | 31242 | 0% | 42% | 5 |
9 | RM MON | 29998 | 0% | 100% | 2 |
10 | TECHNOL CHARACTERISAT MODELLING GRP | 29998 | 0% | 100% | 2 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | MICROELECTRONICS RELIABILITY | 160815 | 13% | 4% | 281 |
2 | IEEE TRANSACTIONS ON ELECTRON DEVICES | 47341 | 11% | 1% | 223 |
3 | SOLID-STATE ELECTRONICS | 33231 | 7% | 2% | 149 |
4 | MICROELECTRONIC ENGINEERING | 30742 | 7% | 1% | 146 |
5 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 30599 | 2% | 4% | 48 |
6 | IEEE ELECTRON DEVICE LETTERS | 23900 | 6% | 1% | 122 |
7 | JOURNAL OF APPLIED PHYSICS | 8144 | 12% | 0% | 245 |
8 | APPLIED PHYSICS LETTERS | 3443 | 8% | 0% | 165 |
9 | SOVIET MICROELECTRONICS | 2444 | 0% | 2% | 7 |
10 | SEMICONDUCTOR SCIENCE AND TECHNOLOGY | 1946 | 2% | 0% | 33 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |