EJ3318 Packaging of Power Semiconductor Devices 8.0 credits

Kapsling av effekthalvledarkomponenter

The course is intended mainly for PhD students whose research topic is within or related to power electronics or electrical drives. The course provides a deep understanding of electrical, thermal, and mechanical properties, and design of packaging technologies for power semiconductor devices.

  • Education cycle

    Third cycle
  • Main field of study

  • Grading scale

    P, F

Course offerings

Autumn 18 for programme students

  • Periods

    Autumn 18 P1 (8.0 credits)

  • Application code


  • Start date


  • End date


  • Language of instruction


  • Campus

    KTH Campus

  • Tutoring time


  • Form of study


  • Number of places

    No limitation

Intended learning outcomes

After completion of the course the student shall be able to

• explain how material choices of the package influence the thermal properties

• explain how material choices of the package influence the reliability

• explain why different designs may have different values of parasitic inductances

• explain the concepts of power cycling and thermal cycling

• explain how thermal cycling and power cycling affect the expected lifetime of a package

• explain the concepts of FIT rate and MTTF  

• calculate approximate values of thermal resistances and capacitances

• calculate approximate values of parasitic inductances

• calculate the junction temperature in steady state

• calculate transient junction temperatures

• calculate temperature variations due to power cycling

• describe the main design features of a discrete power device package, an industrial power module, and a press-pack device

• describe the different production steps of a discrete power device package, an industrial power module, and a press-pack device

• describe how different parasitic elements influence the properties of the package

• describe failure modes of different packages

• describe how the thermal resistance and capacitance can be determined for a given package

• describe methods for minimizing the effects of mismatch in thermal expansion coefficients

• describe the concept of electromigration

Course main content

Methods for design and analysis of packages for power semiconductor devices:

  • Design of discrete power devices packages, industrial power modules, and press-packs
  • Bonding, soldering, and molding
  • Thermal and mechanical design of packages
  • Electromigration
  • Parasitic inductances of packages
  • Power Cycling and Thermal cycling
  • Measurements of electrical and thermal quantities
  • Electrical isolation
  • Copper stud bumping design
  • Advanced modeling methods


Seminars, lectures, project work, written examination


PhD students at KTH and PhD students from other universities


Power Electronic Packaging

Design, Assemble Process, Reliability and Modeling

Liu, Y.

2012, XVIII, 594 p. Hardcover

ISBN: 978-1-4614-1052-2


  • EXA1 - Examination, 8.0, grading scale: P, F

During the seminars the students should show that they are able to absorb the content of a section of the book and then present it in a professional way for the other students. The students should also show that they are capable of taking part in an advanced scientific discussion on the subject.

The project work is a literature study which is presented in an essay. The written examination is a standard examination with the grades P or F.

Requirements for final grade

  • At least one approved seminar with oral presentation
  • An approved essay on a subject chosen by the examiner
  • An approved written examination.

Offered by

EECS/Electric Power and Energy Systems


Hans-Peter Nee <hansi@kth.se>


Course syllabus valid from: Spring 2018.
Examination information valid from: Spring 2019.