FEK3310 System Integration for MEMS and NEMS 4.5 credits

Systemintegration för MEMS och NEMS

Micro and nanoelectromechanical Systems (MEMS/NEMS) are enabling devices in a number of new consumer and mobile-electronics products such as in the motion-based controllers of the Nintendo Wii game console and in the Apple iPhone. To serve the needs of seamless consumer and industrial products of the future, the MEMS/NEMS devices have to be highly integrated and packaged in a cost-efficient way. More and more advanced signal processing functionality (ICs) is being moved from external components into the MEMS/NEMS component to provide added value for the customers implementing the MEMS/NEMS component in their products. There are various ways on how to integrate and package MEMS/NEMS in System-On-Chip (SoC) and 3D System-In-Package (SiP) solutions. This course is concerned with the various approaches for integrating and packaging of MEMS/NEMS and combining it with ICs. The scientific literature in the field of MEMS/NEMS integration and packaging will be critically reviewed and assessed by the course participants during the course.

Offering and execution

Course offering missing for current semester as well as for previous and coming semesters

Course information

Content and learning outcomes

Course contents *

Course main content:

Lectures:

The course consists of one lecture at the course start, which presents a classification of different MEMS/NEMS integration and packaging approaches. In addition, the students will attend presentations on details of specific MEMS/NEMS integration and packaging approaches given by the other course participants. All course moments have mandatory participation.

Homework:

MEMS/NEMS integration and packaging can be categorized in a number of different approaches. At the start of the course each student will be assigned two or three different approaches for MEMS/NEMS integration and/or packaging. Related to the assigned approaches, the student will review the scientific literature and summarize the important underlying concepts (3-4 pages for each integration/packaging approach). All summary reports from the students will be assembled by the course leader in form of a review report. Each student will then assess the assembled report. The students (including the course leader) will present and discuss in a group session with all course participants, their respective comments and based on this feed-back each student will re-work and res-submit their respective summary report. The feed-back and re-work process will be iterated until all summary reports reach a good quality. The process will result in a final state-of-the-art “review report”.

Other:

At least one group discussion with all course participants and the course leader will take place, in which the participants provide constructive feed-back on the summaries of the other course participants. Mandatory participation.

Presentations:

Each student will give a presentation to all course participants related to two or three MEMS/NEMS integration/packaging approaches, and subsequently a group discussion related to the presentation will take place.  Mandatory participation.

Other:

At least one group discussion with all course participants and the course leader will take place, in which the participants provide constructive feed-back on the summaries of the other course participants. Mandatory participation.

Presentations:

Each student will give a presentation to all course participants related to two or three MEMS/NEMS integration/packaging approaches, and subsequently a group discussion related to the presentation will take place.  Mandatory participation.

Intended learning outcomes *

After the course, the students should be able to:

  • Select one or more suitable MEMS/NEMS integration and packaging approaches for a given application.
  • Correctly motivate the choice of MEMS/NEMS integration and packaging approach for the specific device and target application, based on application and environmental constrains, such as target-cost for the application, economic and technological framework and available infrastructure.
  • Independently collect and review the scientific literature for a specific topic.
  • Critically analyze the scientific literature for a specific topic, extract the important underlying issues and principles and summarize them in a structured way (creating a “synthesis” of the data), thereby possibly also challenging unsubstantiated statements in the scientific literature.

Course Disposition

Based on the understanding of the subject demonstrated in the presentations and based on the respective summary report, each student will receive the grade “pass” or “fail”. This course does not have a written exam.

Literature and preparations

Specific prerequisites *

EK2350 Microsystem technology or similar course.

Recommended prerequisites

EK2350 Microsystem technology or similar course.

Equipment

N/A

Literature

As part of the course activities, the students will review and analyze the scientific literature in the area of MEMS/NEMS integration and packaging. No specific course book is used within this course.

Examination and completion

If the course is discontinued, students may request to be examined during the following two academic years.

Grading scale *

P, F

Examination *

    Based on recommendation from KTH’s coordinator for disabilities, the examiner will decide how to adapt an examination for students with documented disability.

    The examiner may apply another examination format when re-examining individual students.

    Other requirements for final grade *

    Pass grade for presentation and written summary report.

    Opportunity to complete the requirements via supplementary examination

    No information inserted

    Opportunity to raise an approved grade via renewed examination

    No information inserted

    Examiner

    Frank Niklaus

    Ethical approach *

    • All members of a group are responsible for the group's work.
    • In any assessment, every student shall honestly disclose any help received and sources used.
    • In an oral assessment, every student shall be able to present and answer questions about the entire assignment and solution.

    Further information

    Course web

    No information inserted

    Offered by

    EECS/Micro and Nano Systems

    Main field of study *

    No information inserted

    Education cycle *

    Third cycle

    Add-on studies

    No information inserted

    Contact

    Frank Niklaus

    Supplementary information

    After the course, the students should be able to:

    • Select one or more suitable MEMS/NEMS integration and packaging approaches for a given application.
    • Correctly motivate the choice of MEMS/NEMS integration and packaging approach for the specific device and target application, based on application and environmental constrains, such as target-cost for the application, economic and technological framework and available infrastructure.
    • Independently collect and review the scientific literature for a specific topic.
    • Critically analyze the scientific literature for a specific topic, extract the important underlying issues and principles and summarize them in a structured way (creating a “synthesis” of the data), thereby possibly also challenging unsubstantiated statements in the scientific literature.

    Course main content:

    Lectures:

    The course consists of one lecture at the course start, which presents a classification of different MEMS/NEMS integration and packaging approaches. In addition, the students will attend presentations on details of specific MEMS/NEMS integration and packaging approaches given by the other course participants. All course moments have mandatory participation.

    Homework:

    MEMS/NEMS integration and packaging can be categorized in a number of different approaches. At the start of the course each student will be assigned two or three different approaches for MEMS/NEMS integration and/or packaging. Related to the assigned approaches, the student will review the scientific literature and summarize the important underlying concepts (3-4 pages for each integration/packaging approach). All summary reports from the students will be assembled by the course leader in form of a review report. Each student will then assess the assembled report. The students (including the course leader) will present and discuss in a group session with all course participants, their respective comments and based on this feed-back each student will re-work and res-submit their respective summary report. The feed-back and re-work process will be iterated until all summary reports reach a good quality. The process will result in a final state-of-the-art “review report”.

    Other:

    At least one group discussion with all course participants and the course leader will take place, in which the participants provide constructive feed-back on the summaries of the other course participants. Mandatory participation.

    Presentations:

    Each student will give a presentation to all course participants related to two or three MEMS/NEMS integration/packaging approaches, and subsequently a group discussion related to the presentation will take place.  Mandatory participation.

    Postgraduate course

    Postgraduate courses at EECS/Micro and Nano Systems