IL2208 Electronic System Packaging 7,5 hp

This course provides a unified view of physical architecture of electronic systems from chip to cabinet via focus to interconnectivity and interconnections and their impact to performance and signal integrity and signal couplings. Our aim is to provide a coherent and pragmatic view for understanding the system performance constraints and their dependencies of the underlying technologies in order to define physical architecture of mixed signal systems. During the course we will

• Summarize the key interconnection technologies from chip to system with focus on the underlying principles and new technologies which will remain the basic for electronic design and manufacturing through the next decade
• Emphasize the interaction of chip and higher packaging level technologies for mixed signal system electrical design and system partitioning to different packaging technologies
• Analyse systematically the key electrical phenomena at chip, package and interconnection substrate levels defining the system signal integrity and robustness properties in order to define the future constraints to integration for communication and consumer electronic products.
• Emphasize the impact of deep sub micron CMOS technologies to system partitioning and packaging technologies.
• Introduce the early conceptual design for partitioning of the complex system to different packaging and interconnect hierarchies.

The objective of this course is to provide a coherent and pragmatic overview of relevant issues of physical architecture design of complex electronic system presented in such way that practicing electronics designers can communicate with experts in other fields and extract relevant design data for circuit and system design.

Basic knowledge on circuit theory such as IE1204, IL1203 or IL2227

Stephen H. Hall et al: High-Speed Digital System Design, Wiley Publishers, ISBN: 0-471-36090-2

När kurs inte längre ges har student möjlighet att examineras under ytterligare två läsår.

• LAB1 - Laboration Course, 3,0 hp, betygsskala: P, F
• TEN1 - Examination, 4,5 hp, betygsskala: A, B, C, D, E, FX, F

Examinator beslutar, baserat på rekommendation från KTH:s handläggare av stöd till studenter med funktionsnedsättning, om eventuell anpassad examination för studenter med dokumenterad, varaktig funktionsnedsättning.

Examinator får medge annan examinationsform vid omexamination av enstaka studenter.

Laboratory course (LAB1; 3 hp)
Examination (TEN1; 4,5 hp)

Lirong Zheng

• Vid grupparbete har alla i gruppen ansvar för gruppens arbete.
• Vid examination ska varje student ärligt redovisa hjälp som erhållits och källor som använts.
• Vid muntlig examination ska varje student kunna redogöra för hela uppgiften och hela lösningen.