IL2208 Electronic System Packaging 7.5 credits

Electronic System Packaging

Offering and execution

Course offering missing for current semester as well as for previous and coming semesters

Course information

Content and learning outcomes

Course contents *

This course provides a unified view of physical architecture of electronic systems from chip to cabinet via focus to interconnectivity and interconnections and their impact to performance and signal integrity and signal couplings. Our aim is to provide a coherent and pragmatic view for understanding the system performance constraints and their dependencies of the underlying technologies in order to define physical architecture of mixed signal systems. During the course we will

  • Summarize the key interconnection technologies from chip to system with focus on the underlying principles and new technologies which will remain the basic for electronic design and manufacturing through the next decade
  • Emphasize the interaction of chip and higher packaging level technologies for mixed signal system electrical design and system partitioning to different packaging technologies
  • Analyse systematically the key electrical phenomena at chip, package and interconnection substrate levels defining the system signal integrity and robustness properties in order to define the future constraints to integration for communication and consumer electronic products.
  • Emphasize the impact of deep sub micron CMOS technologies to system partitioning and packaging technologies.
  • Introduce the early conceptual design for partitioning of the complex system to different packaging and interconnect hierarchies.

Intended learning outcomes *

The objective of this course is to provide a coherent and pragmatic overview of relevant issues of physical architecture design of complex electronic system presented in such way that practicing electronics designers can communicate with experts in other fields and extract relevant design data for circuit and system design.

Course Disposition

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Literature and preparations

Specific prerequisites *

No information inserted

Recommended prerequisites

Basic knowledge on circuit theory such as IF1204, IL1203 or IL2227


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Stephen H. Hall et al: High-Speed Digital System Design, Wiley Publishers, ISBN: 0-471-36090-2

Examination and completion

Grading scale *

A, B, C, D, E, FX, F

Examination *

  • LAB1 - Laboration Course, 3.0 credits, Grading scale: P, F
  • TEN1 - Examination, 4.5 credits, Grading scale: A, B, C, D, E, FX, F

Based on recommendation from KTH’s coordinator for disabilities, the examiner will decide how to adapt an examination for students with documented disability.

The examiner may apply another examination format when re-examining individual students.

Other requirements for final grade *

Laboratory course (LAB1; 3 hp)
Examination (TEN1; 4,5 hp)

Opportunity to complete the requirements via supplementary examination

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Opportunity to raise an approved grade via renewed examination

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Lirong Zheng

Further information

Course web

Further information about the course can be found on the Course web at the link below. Information on the Course web will later be moved to this site.

Course web IL2208

Offered by


Main field of study *

Electrical Engineering

Education cycle *

Second cycle

Add-on studies

No information inserted


Qiang Chen (

Ethical approach *

  • All members of a group are responsible for the group's work.
  • In any assessment, every student shall honestly disclose any help received and sources used.
  • In an oral assessment, every student shall be able to present and answer questions about the entire assignment and solution.