IH2659 Nanofabrication Technologies 7.5 credits

Tillverkningstekniker för nanokomponenter

  • Education cycle

    Second cycle
  • Main field of study

    Electrical Engineering
  • Grading scale

    A, B, C, D, E, FX, F

Course offerings

Spring 19 for programme students

Spring 20 for programme students

Intended learning outcomes

After the course, the student should be able to review and discuss:

  1. Unit manufacturing processes for micro- and nanofabrication on wafers
  2. Moore's law and advanced process technologies
  3. Process integration examples.

The student will fabricate devices in a clean room (Electrum laboratory) and use a number of unit processes included in the course.

Course main content

The course covers process technologies that are used in micro- and nanofabrication of devices and systems on wafers. Applications include all technologies that are based on wafer scale fabrication such as integrated circuits, micro-electro-mechanical systems and optical devices. The basic unit processes deposition, patterning, etching, doping and heat treatment are covered, followed by process integration to build complex devices. Moore's law and the basic economics for integrated circuits are covered and examplified by reviewing the state-of-the art process technology nodes. The course gives the student basic understanding of the sustainability aspects in integrated circuit fabrication.

Eligibility

Courses on BSc the level or higher in solid state physics and semiconductor devices are recommended.

Literature

Fabrication engineering at the micro- and nanoscale, S. A. Campbell, Fourth Edition, Oxford University Press, 2013. 

Examination

  • LAB1 - Lab, 1.0, grading scale: P, F
  • TEN1 - Examination, 6.5, grading scale: A, B, C, D, E, FX, F

Requirements for final grade

Laboratory session and examination are compulsory for a pass final grade.

Offered by

EECS/Electronics and Embedded Systems

Contact

Per-Erik Hellström

Examiner

Mikael Östling <mostling@kth.se>

Version

Course syllabus valid from: Spring 2019.
Examination information valid from: Spring 2019.