IL2226 Embedded System Design 7.5 credits

Konstruktion av inbyggda system

Offering and execution

Course offering missing for current semester as well as for previous and coming semesters

Course information

Content and learning outcomes

Course contents *

This course focuses on system level dimensioning and trade-offs aspects of Systems-on-Chip (FPGA or ASIC) design. The students study the system properties of the main SoC components, which are computation, memory and interconnect. The student learns how the components are put together into a complete system with all the important trade-offs, that have to be considered.

1. System Level Components

a. Computation

i. Software–Superscalar, VLIW, ASIPs, Multi-core–homogeneous, heterogeneous

ii. Hardware–ASIC, FPGAs and the emerging CGRAs

b. Storage

i. SRAM, DRAM, Flash and emerging memory technologies

ii. Register Files vs. SRAMs

iii. Centralized vs. Distributed

iv. On chip vs. off chip. Cache

c. Interconnect

i. Interconnect hierarchy and layers

ii. Bus types and topologies

iii. NOC

d. System Level Power Management

i. Clock Domains

ii. Power Domains

iii. DVFS

iv. Hibernation and Power gating

2. System Level Design Trade-offs

a. Power, Energy, Performance and Area.

b. The three VLSI walls–frequency, memory and power

c. Productivity, Reusability

3. Clocking and Synchronisation Issues

4. VLSI Physical Design

5. ATPG, DFT – Scan and BIST

Intended learning outcomes *

- All the main components in an SoC: different types of memories, computational units, interconnect, I/O blocks, arbiters, power management, etc. The components non-functional properties with respect to performance, power and area are understood.

- Aanalyse the non-functional properties of s system: performance, power, cost.

- Dimension the components and the complete system with respect to given requirements in terms of performance, power consumption and cost.

- Design the system level clocking architecture

- Concepts and methods of testing and test pattern generation, physcial design and floorplaning, IP reuse and platform based design.

Course Disposition

No information inserted

Literature and preparations

Specific prerequisites *

120 university credits (hp) in engineering or natural sciences and documented proficiency in English corresponding to English A.
Embedded Hardware Design in ASIC and FPGA

Recommended prerequisites

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Lecture notes

Examination and completion

If the course is discontinued, students may request to be examined during the following two academic years.

Grading scale *

A, B, C, D, E, FX, F

Examination *

  • LAB1 - Laboratory Work, 3.0 credits, Grading scale: P, F
  • TEN1 - Examination, 4.5 credits, Grading scale: A, B, C, D, E, FX, F

Based on recommendation from KTH’s coordinator for disabilities, the examiner will decide how to adapt an examination for students with documented disability.

The examiner may apply another examination format when re-examining individual students.

Other requirements for final grade *

- Written examination, TEN1 (4.5 hp, A-F)

- Laboratory work, LAB1 (3.0, P/F)

Opportunity to complete the requirements via supplementary examination

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Opportunity to raise an approved grade via renewed examination

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Zhonghai Lu

Ethical approach *

  • All members of a group are responsible for the group's work.
  • In any assessment, every student shall honestly disclose any help received and sources used.
  • In an oral assessment, every student shall be able to present and answer questions about the entire assignment and solution.

Further information

Course web

Further information about the course can be found on the Course web at the link below. Information on the Course web will later be moved to this site.

Course web IL2226

Offered by


Main field of study *

Electrical Engineering

Education cycle *

Second cycle

Add-on studies

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