Publications by Frank Niklaus
Peer reviewed
Articles
[1]
L.-L. Lai et al., "3D Printing of Glass Micro-Optics with Subwavelength Features on Optical Fiber Tips," ACS Nano, vol. 18, no. 16, pp. 10788-10797, 2024.
[2]
A. Enrico et al., "Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors," Advanced Science, 2024.
[3]
M. K. Kulsreshath et al., "Digital Nanoelectromechanical Non-Volatile Memory Cell," IEEE Electron Device Letters, vol. 45, no. 4, pp. 728-731, 2024.
[4]
S. N. Raja et al., "Electromigrated Gold Nanogap Tunnel Junction Arrays: Fabrication and Electrical Behavior in Liquid and Gaseous Media," ACS Applied Materials and Interfaces, 2024.
[5]
S. N. Raja et al., "High-bandwidth low-current measurement system for automated and scalable probing of tunnel junctions in liquids," Review of Scientific Instruments, vol. 95, no. 7, 2024.
[6]
S. Chen et al., "Ultrafast metal-free microsupercapacitor arrays directly store instantaneous high-voltage electricity from mechanical energy harvesters," Advanced Science, vol. 11, no. 22, 2024.
[7]
S. Pagliano et al., "3D Printing by Two-Photon Polymerization of Polyimide Objects and Demonstration of a 3D-printed Micro-Hotplate," Advanced Materials Technologies, vol. 8, no. 19, 2023.
[8]
D. E. Marschner et al., "A methodology for two-photon polymerization micro 3D printing of objects with long overhanging structures," Additive Manufacturing, vol. 66, 2023.
[9]
Y. Li et al., "Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process," Nanoscale, 2023.
[10]
N. Quack et al., "Integrated silicon photonic MEMS," MICROSYSTEMS & NANOENGINEERING, vol. 9, no. 1, 2023.
[11]
S. Buchmann et al., "Probabilistic cell seeding and non-autofluorescent 3D-printed structures as scalable approach for multi-level co-culture modeling," Materials Today Bio, vol. 21, pp. 100706-100706, 2023.
[12]
X. Fan et al., "Resonant Transducers Consisting of Graphene Ribbons with Attached Proof Masses for NEMS Sensors," ACS Applied Nano Materials, vol. 7, no. 1, pp. 102-109, 2023.
[13]
T. Last et al., "Scaling toward Diminutive MEMS : Dust-Sized Spray Chips for Aerosolized Drug Delivery to the Lung," Advanced Materials Technologies, vol. 8, no. 7, 2023.
[14]
S. Jain et al., "Sensing of protein and DNA complexes using solid-state nanopores," Biophysical Journal, vol. 122, no. 3S1, 2023.
[15]
P.-H. Huang et al., "Three-dimensional printing of silica glass with sub-micrometer resolution," Nature Communications, vol. 14, no. 1, 2023.
[16]
A. Enrico et al., "Ultrafast and Resist-Free Nanopatterning of 2D Materials by Femtosecond Laser Irradiation," ACS Nano, vol. 17, no. 9, pp. 8041-8052, 2023.
[17]
P. Edinger et al., "Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase," Optics Express, vol. 31, no. 4, pp. 6540-6551, 2023.
[18]
A. Enrico et al., "3D Microvascularized Tissue Models by Laser-Based Cavitation Molding of Collagen," Advanced Materials, vol. 34, no. 11, 2022.
[19]
[20]
X. Fan and F. Niklaus, "Deformation Behavior and Mechanical Properties of Suspended Double-Layer Graphene Ribbons Induced by Large Atomic Force Microscopy Indentation Forces," Advanced Engineering Materials, vol. 24, no. 3, pp. 2100826, 2022.
[21]
S. Pagliano et al., "Micro 3D printing of a functional MEMS accelerometer," MICROSYSTEMS & NANOENGINEERING, vol. 8, no. 1, 2022.
[22]
G. Jo et al., "Wafer-level hermetically sealed silicon photonic MEMS," Photonics Research, vol. 10, no. 2, pp. A14-A21, 2022.
[23]
S. Schröder et al., "A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system," Microsystems and Nanoengineering, vol. 7, no. 1, 2021.
[24]
A. Quellmalz et al., "Large-area integration of two-dimensional materials and their heterostructures by wafer bonding," Nature Communications, vol. 12, no. 1, 2021.
[25]
C. Chen et al., "Bactericidal surfaces prepared by femtosecond laser patterning andlayer-by-layer polyelectrolyte coating," Journal of Colloid and Interface Science, vol. 575, pp. 286-297, 2020.
[26]
X. Fan et al., "Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.
[27]
M. C. Lemme et al., "Nanoelectromechanical Sensors Based on Suspended 2D Materials," RESEARCH, vol. 2020, 2020.
[28]
S. Rana et al., "Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory," Nature Communications, vol. 11, no. 1, 2020.
[29]
X. Fan et al., "Rapid and Large-Area Visualization of Grain Boundaries in MoS2 on SiO2 Using Vapor Hydrofluoric Acid," ACS Applied Materials and Interfaces, vol. 12, no. 30, pp. 34049-34057, 2020.
[30]
F. Ribet et al., "Vertical integration of microchips by magnetic assembly and edge wire bonding," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.
[31]
M. Laakso et al., "Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses," Optics Express, vol. 28, no. 2, pp. 1394-1408, 2020.
[32]
A. D. Smith et al., "Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks : Present and Future Development," Sensors, vol. 19, no. 19, 2019.
[33]
X. Fan et al., "Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers," Nature Electronics, vol. 2, no. 9, pp. 394-404, 2019.
[34]
X. Shi et al., "Quantitative assessment of structural and compositional colors induced by femtosecond laser : A case study on 301LN stainless steel surface," Applied Surface Science, vol. 484, pp. 655-662, 2019.
[35]
A. Enrico et al., "Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography," ACS Applied Materials and Interfaces, vol. 11, no. 8, pp. 8217-8226, 2019.
[36]
X. Fan et al., "Suspended Graphene Membranes with Attached Silicon Proof Masses as Piezoresistive Nanoelectromechanical Systems Accelerometers," Nano letters (Print), vol. 19, no. 10, pp. 6788-6799, 2019.
[37]
X. Wang et al., "Transfer printing of nanomaterials and microstructures using a wire bonder," Journal of Micromechanics and Microengineering, vol. 29, no. 12, 2019.
[38]
X. Wang et al., "Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages," Journal of microelectromechanical systems, vol. 28, no. 3, pp. 460-471, 2019.
[39]
M. Parrilla et al., "Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection," Analytical Chemistry, vol. 91, no. 2, pp. 1578-1586, 2019.
[40]
X. Fan et al., "Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure," Science Advances, vol. 4, no. 5, 2018.
[41]
X. Fan et al., "Humidity and CO2 gas sensing properties of double-layer graphene," Carbon, vol. 127, pp. 576-587, 2018.
[42]
A. Quellmalz et al., "Influence of Humidity on Contact Resistance in Graphene Devices," ACS Applied Materials and Interfaces, vol. 10, no. 48, pp. 41738-41746, 2018.
[43]
V. J. Dubois et al., "Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices," Nature Communications, vol. 9, 2018.
[44]
T. Qin et al., "Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays," IEEE Access, vol. 6, pp. 15997-16009, 2018.
[45]
V. J. Dubois et al., "Scalable Manufacturing of Nanogaps," Advanced Materials, vol. 30, no. 46, 2018.
[46]
M. J. Laakso et al., "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires," IEEE Access, vol. 6, pp. 44306-44317, 2018.
[47]
S. J. Bleiker et al., "Adhesive wafer bonding with ultra-thin intermediate polymer layers," Sensors and Actuators A-Physical, vol. 260, pp. 16-23, 2017.
[48]
V. J. Dubois, F. Niklaus and G. Stemme, "Design and fabrication of crack-junctions," MICROSYSTEMS & NANOENGINEERING, vol. 3, 2017.
[49]
A. D. Smith et al., "Graphene-based CO2 sensing and its cross-sensitivity with humidity," RSC Advances, vol. 7, no. 36, pp. 22329-22339, 2017.
[50]
B. Khorramdel et al., "Inkjet printing technology for increasing the I/O density of 3D TSV interposers," Microsystems & Nanoengineering, vol. 3, pp. 17002, 2017.
[51]
M. Asiatici et al., "Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications," Journal of microelectromechanical systems, vol. 26, no. 1, pp. 158-168, 2017.
[52]
X. Wang et al., "Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint," Journal of microelectromechanical systems, vol. 26, no. 2, pp. 357-365, 2017.
[53]
M. Asiatici et al., "Capacitive inertial sensing at high temperatures of up to 400 degrees C," Sensors and Actuators A-Physical, vol. 238, pp. 361-368, 2016.
[54]
S. J. Bleiker et al., "Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding," Micromachines, vol. 7, no. 10, pp. 192, 2016.
[55]
V. Dubois, F. Niklaus and G. Stemme, "Crack-defined electronic nanogaps," Advanced Materials, vol. 28, no. 11, pp. 2178-2182, 2016.
[56]
F. J. Aparicio et al., "Dye-based photonic sensing systems," Sensors and actuators. B, Chemical, vol. 228, pp. 649-657, 2016.
[57]
S. Schröder et al., "Fabrication of an Infrared Emitter using a Generic Integration Platform Based on Wire Bonding," Journal of Micromechanics and Microengineering, vol. 26, no. 11, 2016.
[58]
M. Rajabi et al., "Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing," PLOS ONE, vol. 11, no. 12, 2016.
[59]
A. D. Smith et al., "Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors," ACS Nano, vol. 10, no. 11, pp. 9879-9886, 2016.
[60]
F. Forsberg et al., "CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration," IEEE Journal of Selected Topics in Quantum Electronics, vol. 21, no. 4, pp. 1-11, 2015.
[61]
S. J. Bleiker et al., "High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, pp. 21-27, 2015.
[62]
A. C. Fischer et al., "Integrating MEMS and ICs," Microsystems & Nanoengineering, vol. 1, no. 1, pp. 1-16, 2015.
[63]
C. Errando-Herranz et al., "Low-power microelectromechanically tunable silicon photonic ring resonator add-drop filter," Optics Letters, vol. 40, no. 15, pp. 3556-3559, 2015.
[64]
C. L. Ayala et al., "Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts," Solid-State Electronics, vol. 113, pp. 157-166, 2015.
[65]
A. D. Smith et al., "Resistive graphene humidity sensors with rapid and direct electrical readout," Nanoscale, vol. 7, no. 45, pp. 19099-19109, 2015.
[66]
S. Schröder et al., "Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment," Journal of microelectromechanical systems, vol. 24, no. 4, pp. 781-789, 2015.
[67]
H. K. Gatty et al., "Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive," ECS Journal of Solid State Science and Technology, vol. 3, no. 5, pp. P115-P121, 2014.
[68]
F. Forsberg et al., "A Comparative study of the bonding energy in adhesive wafer bonding," Journal of Micromechanics and Microengineering, vol. 23, no. 8, pp. 1-7, 2013.
[69]
F. Saharil et al., "Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer," Journal of Micromechanics and Microengineering, vol. 23, no. 2, pp. 025021, 2013.
[70]
A. Smith et al., "Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes," Nano letters (Print), vol. 13, no. 7, pp. 3237-3242, 2013.
[71]
F. Forsberg et al., "Heterogeneous 3D integration of 17 mu m pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems," Journal of Micromechanics and Microengineering, vol. 23, no. 4, pp. 045017, 2013.
[72]
M. Lapisa et al., "Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon," Journal of Micromechanics and Microengineering, vol. 23, no. 7, pp. 075003, 2013.
[73]
A. D. Smith et al., "Pressure sensors based on suspended graphene membranes," Solid-State Electronics, vol. 88, pp. 89-94, 2013.
[74]
A. C. Fischer et al., "Unconventional applications of wire bonding create opportunities for microsystem integration," Journal of Micromechanics and Microengineering, vol. 23, no. 8, pp. 083001, 2013.
[75]
F. Forsberg et al., "Very Large Scale Heterogeneous Integration (VLSHI) and Wafer-Level Vacuum Packaging for Infrared Bolometer Focal Plane Arrays," Infrared physics & technology, vol. 60, pp. 251-259, 2013.
[76]
M. Antelius et al., "Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps," Journal of microelectromechanical systems, vol. 22, no. 6, pp. 1347-1353, 2013.
[77]
M. Lapisa et al., "Wafer-Level capping and sealing of heat sensitive substances and liquids with gold gaskets," Sensors and Actuators A-Physical, vol. 201, pp. 154-163, 2013.
[78]
A. C. Fischer et al., "3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching," Advanced Functional Materials, vol. 22, no. 19, pp. 4004-4008, 2012.
[79]
F. Forsberg et al., "Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes," Journal of microelectromechanical systems, vol. 21, no. 5, pp. 1077-1083, 2012.
[80]
M. Lapisa et al., "Drift-free micromirror arrays made of monocrystalline silicon for adaptive optics applications," Journal of microelectromechanical systems, vol. 21, no. 4, pp. 959-970, 2012.
[81]
M. Antelius et al., "Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level," Journal of Micromechanics and Microengineering, vol. 22, no. 4, pp. 045021, 2012.
[82]
K. B. Gylfason et al., "Process considerations for layer-by-layer 3D patterning of silicon, using ion implantation, silicon deposition, and selective silicon etching," Journal of Vacuum Science & Technology B, vol. 30, no. 6, pp. 06FF05, 2012.
[83]
A. C. Fischer et al., "Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires," Journal of Micromechanics and Microengineering, vol. 22, no. 10, pp. 105001, 2012.
[84]
A. C. Fischer et al., "Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates," Journal of Micromechanics and Microengineering, vol. 22, no. 5, pp. 055025, 2012.
[85]
F. Zimmer et al., "One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration," Journal of microelectromechanical systems, vol. 20, no. 3, pp. 564-572, 2011.
[86]
M. Antelius, G. Stemme and F. Niklaus, "Small footprint wafer-level vacuum packaging using compressible gold sealing rings," Journal of Micromechanics and Microengineering, vol. 21, no. 8, pp. 085011, 2011.
[87]
M. Lapisa, G. Stemme and F. Niklaus, "Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS," IEEE Journal of Selected Topics in Quantum Electronics, vol. 17, no. 3, pp. 629-644, 2011.
[88]
A. C. Fischer et al., "Wire-bonded through-silicon vias with low capacitive substrate coupling," Journal of Micromechanics and Microengineering, vol. 21, no. 8, pp. 085035, 2011.
[89]
A. Decharat et al., "Room-Temperature Sealing of Microcavities by Cold Metal Welding," Journal of microelectromechanical systems, vol. 18, no. 6, pp. 1318-1325, 2009.
[90]
F. Niklaus et al., "Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs," Sensors and Actuators A-Physical, vol. 154, no. 1, pp. 180-186, 2009.
[91]
F. Niklaus et al., "Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure," Infrared physics & technology, vol. 51, no. 3, pp. 168-177, 2008.
[92]
[93]
F. Niklaus et al., "Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration," Journal of the Electrochemical Society, vol. 153, no. 4, pp. G291-G295, 2006.
[94]
J. Oberhammer, F. Niklaus and G. Stemme, "Sealing of adhesive bonded devices on wafer level," Sensors and Actuators A-Physical, vol. 110, no. 1-3, pp. 407-412, 2004.
[95]
F. Niklaus et al., "A method to maintain wafer alignment precision during adhesive wafer bonding," Sensors and Actuators A-Physical, vol. 107, no. 3, pp. 273-278, 2003.
[96]
F. Niklaus, S. Haasl and G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding," Journal of microelectromechanical systems, vol. 12, no. 4, pp. 465-469, 2003.
[97]
J. Oberhammer, F. Niklaus and G. Stemme, "Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities," Sensors and Actuators A-Physical, vol. 105, no. 3, pp. 297-304, 2003.
[98]
H. Andersson et al., "Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels," Sensors and actuators. B, Chemical, vol. 75, no. 1-2, pp. 136-141, 2001.
[99]
F. Niklaus et al., "Low temperature full wafer adhesive bonding of structured wafers," Sensors and Actuators A-Physical, vol. 92, no. 03-jan, pp. 235-241, 2001.
[100]
F. Niklaus et al., "Low-temperature full wafer adhesive bonding," Journal of Micromechanics and Microengineering, vol. 11, no. 2, pp. 100-107, 2001.
[101]
F. Niklaus et al., "Low-temperature wafer-level transfer bonding," Journal of microelectromechanical systems, vol. 10, no. 4, pp. 525-531, 2001.
[102]
F. Niklaus, E. Kälvesten and G. Stemme, "Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays," Journal of Micromechanics and Microengineering, vol. 11, no. 5, pp. 509-513, 2001.
Conference papers
[103]
P.-S. Lin et al., "Plasmon-enhanced graphene photothermoelectric detector for mid-IR sensing applications," in The 38th International Conference on Micro Electro Mechanical Systems, 2025.
[104]
G. Syriopoulos et al., "Design of a miniaturized MID-IR spectroscopy solution, based on a 400 nm SiPh platform, for the detection of CO2 and CH4," in Optical Sensing and Detection VIII, 2024.
[105]
P.-S. Lin et al., "Sensitivity-optimized waveguide-based methane gas sensor in the mid-IR," in CLEO: Science and Innovations, CLEO: S and I 2024 in Proceedings CLEO 2024, Part of Conference on Lasers and Electro-Optics, 2024.
[106]
P.-S. Lin et al., "Sensitivity-optimized waveguide-based methane gas sensor in the mid-IR," in 2024 Conference on Lasers and Electro-Optics, CLEO 2024, 2024.
[107]
P.-H. Huang et al., "3d Printing of Silica-HSQ Composites with Sub-Micrometer Resolution and Selectively Generated Silicon Nanocrystals," in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, 2023, pp. 433-436.
[108]
S. Pagliano et al., "A 3D-Printed Functional Mems Accelerometer," in 2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2023, pp. 594-597.
[109]
P. Edinger et al., "An Integrated Platform for Cavity Optomechanics with Vacuum-Sealed Silicon Photonic MEMS," in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, 2023, pp. 425-428.
[110]
Y. Li et al., "Design and Fabrication of A 4-Terminal In-Plane Nanoelectromechanical Relay," in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, 2023, pp. 824-826.
[111]
Y. Li et al., "Design and fabrication of a 4-terminal in-plane nanoelectromechanical relay," in Transducers2023 - The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Kyoto, June 25-29, 2023, 2023.
[112]
U. Khan et al., "Low power actuators for programmable photonic processors," in AI and Optical Data Sciences IV, 2023.
[113]
L.-L. Lai et al., "Picoliter-volume refractive index sensor 3D-printed in silica glass on an optical fiber tip," in 2023 Conference on Lasers and Electro-Optics, CLEO 2023, 2023.
[114]
L.-L. Lai et al., "Picoliter-volume refractive index sensor 3D-printed in silica glass on an optical fiber tip," in CLEO: Applications and Technology, CLEO:A and T 2023, 2023.
[115]
W. Bogaerts et al., "Scaling programmable silicon photonics circuits," in Silicon Photonics XVIII, 2023.
[116]
A. Enrico et al., "Ultrafast Direct Writing of Polymers as a Simple Fabrication Method for Organic Electrochemical Transistors," in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, 2023, pp. 1543-1546.
[117]
N. Negm et al., "Graphene waveguide-integrated thermal infrared emitter," in Device Research Conference - Conference Digest, DRC, 2022.
[118]
U. Khan et al., "Large scale programmable photonic circuits using silicon photonic MEMS," in 2022 Conference on Lasers and Electro-Optics, CLEO 2022 : Proceedings, 2022.
[119]
U. Khan et al., "Large scale programmable photonic circuits using silicon photonic MEMS," in Optics InfoBase Conference Papers, 2022.
[120]
P.-S. Lin et al., "Low-concentration detection of CO2 using suspended silicon waveguides in the mid-IR," in 2022 Conference on Lasers and Electro-Optics, CLEO 2022 : Proceedings, 2022.
[121]
P.-S. Lin et al., "Low-concentration detection of CO2 using suspended silicon waveguides in the mid-IR," in Optics InfoBase Conference Papers, 2022.
[122]
U. Khan et al., "MORPHIC : MEMS enhanced silicon photonics for programmable photonics," in Integrated Photonics Platforms Ii, 2022.
[123]
W. Bogaerts et al., "Programmable Photonic Circuits powered by Silicon Photonic MEMS Technology," in Photonic Networks and Devices, Networks 2022, 2022.
[124]
W. Bogaerts et al., "Programmable silicon photonic circuits powered by MEMS," in Proceedings of SPIE - The International Society for Optical Engineering, 2022.
[125]
A. Quellmalz et al., "Wafer-scale integration of layered 2D materials by adhesive wafer bonding," in Proceedings of SPIE - The International Society for Optical Engineering, 2022.
[126]
X. Fan and F. Niklaus, "NEMS Sensors Based on Suspended Graphene," in 2021 IEEE 16Th International Conference On Nano/Micro Engineered And Molecular Systems (Nems), 2021, pp. 1169-1172.
[127]
W. Bogaerts et al., "Programmable photonic circuits using silicon photonic MEMS," in Optics InfoBase Conference Papers, 2021.
[128]
D. Moreno et al., "Proof of concept of a graphene-based resonant accelerometer," in 2021 34th IEEE international conference on micro electro mechanical systems (MEMS 2021), 2021, pp. 838-840.
[129]
N. Quack et al., "Scalable Nano-Opto-Electromechanical Systems in Silicon Photonics," in 2021 IEEE Photonics Conference, IPC 2021 - Proceedings, 2021.
[130]
A. Quellmalz et al., "Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding," in 2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings, 2021.
[131]
A. Quellmalz et al., "Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding," in CLEO: Science and Innovations 2021, 2021.
[132]
A. Quellmalz et al., "Stacking of two-dimensional materials to large-area heterostructures by wafer bonding," in Optics InfoBase Conference Papers, 2021.
[133]
K. Rajendran et al., "Thermo-mechanical Noise Measurement of Sealed Nanobeams on a Silicon Photonics-MEMS Platform," in 2021 IEEE 17Th International Conference On Group Iv Photonics (GFP 2021), 2021.
[134]
A. Quellmalz et al., "Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding," in 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems, 2020.
[135]
S. Pagliano et al., "Feedback-Free Electromigrated Tunneling Junctions from Crack-Defined Gold Nanowires," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 365-367.
[136]
A. Enrico et al., "Manufacturing of Sub-20 NM Wide Single Nanowire Devices using Conventional Stepper Lithography," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 244-247.
[137]
N. Quack et al., "Silicon Photonic MEMS : Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits," in 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2019.
[138]
N. Quack et al., "Silicon photonic MEMS : Exploiting mechanics at the nanoscale to enhance photonic integrated circuits," in Optics InfoBase Conference Papers, 2019.
[139]
A. Quellmalz et al., "Wafer-Scale Transfer of Graphene by Adhesive Wafer Bonding," in 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 257-259.
[140]
S. J. Bleiker et al., "Adhesive Wafer Bonding for Heterogeneous System Integration," in ECS Meeting Abstracts, 2018.
[141]
S. Redzwan et al., "Initial in-vitro trial for intra-cranial pressure monitoring using subdermal proximity-coupled split-ring resonator," in IMBioc 2018 - 2018 IEEE/MTT-S International Microwave Biomedical Conference, 2018, pp. 73-75.
[142]
C. Errando-Herranz et al., "New dynamic silicon photonic components enabled by MEMS technology," in Proceedings Volume 10537, Silicon Photonics XIII, 2018.
[143]
S. Schröder et al., "A low-cost nitric oxide gas sensor based on bonded gold wires," in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, pp. 1457-1460.
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S. Schröder et al., "A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool," in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, pp. 315-318.
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