Publikationer av Frank Niklaus

Refereegranskade

Artiklar

[1]

L.-L. Lai et al., "3D Printing of Glass Micro-Optics with Subwavelength Features on Optical Fiber Tips," ACS Nano, vol. 18, no. 16, s. 10788-10797, 2024.

[2]

A. Enrico et al., "Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors," Advanced Science, 2024.

[3]

S. Pagliano et al., "3D Printing by Two-Photon Polymerization of Polyimide Objects and Demonstration of a 3D-printed Micro-Hotplate," Advanced Materials Technologies, vol. 8, no. 19, 2023.

[4]

D. E. Marschner et al., "A methodology for two-photon polymerization micro 3D printing of objects with long overhanging structures," Additive Manufacturing, vol. 66, 2023.

[5]

Y. Li et al., "Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process," Nanoscale, 2023.

[6]

N. Quack et al., "Integrated silicon photonic MEMS," MICROSYSTEMS & NANOENGINEERING, vol. 9, no. 1, 2023.

[7]

S. Buchmann et al., "Probabilistic cell seeding and non-autofluorescent 3D-printed structures as scalable approach for multi-level co-culture modeling," Materials Today Bio, vol. 21, s. 100706-100706, 2023.

[8]

X. Fan et al., "Resonant Transducers Consisting of Graphene Ribbons with Attached Proof Masses for NEMS Sensors," ACS Applied Nano Materials, vol. 7, no. 1, s. 102-109, 2023.

[9]

T. Last et al., "Scaling toward Diminutive MEMS : Dust-Sized Spray Chips for Aerosolized Drug Delivery to the Lung," Advanced Materials Technologies, vol. 8, no. 7, 2023.

[10]

S. Jain et al., "Sensing of protein and DNA complexes using solid-state nanopores," Biophysical Journal, vol. 122, no. 3S1, 2023.

[11]

P.-H. Huang et al., "Three-dimensional printing of silica glass with sub-micrometer resolution," Nature Communications, vol. 14, no. 1, 2023.

[12]

A. Enrico et al., "Ultrafast and Resist-Free Nanopatterning of 2D Materials by Femtosecond Laser Irradiation," ACS Nano, vol. 17, no. 9, s. 8041-8052, 2023.

[13]

P. Edinger et al., "Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase," Optics Express, vol. 31, no. 4, s. 6540-6551, 2023.

[14]

A. Enrico et al., "3D Microvascularized Tissue Models by Laser-Based Cavitation Molding of Collagen," Advanced Materials, vol. 34, no. 11, 2022.

[15]

D. Moreno-Garcia et al., "A Resonant Graphene NEMS Vibrometer," Small, vol. 18, no. 28, 2022.

[16]

X. Fan och F. Niklaus, "Deformation Behavior and Mechanical Properties of Suspended Double-Layer Graphene Ribbons Induced by Large Atomic Force Microscopy Indentation Forces," Advanced Engineering Materials, vol. 24, no. 3, s. 2100826, 2022.

[17]

S. Pagliano et al., "Micro 3D printing of a functional MEMS accelerometer," MICROSYSTEMS & NANOENGINEERING, vol. 8, no. 1, 2022.

[18]

G. Jo et al., "Wafer-level hermetically sealed silicon photonic MEMS," Photonics Research, vol. 10, no. 2, s. A14-A21, 2022.

[19]

S. Schröder et al., "A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system," Microsystems and Nanoengineering, vol. 7, no. 1, 2021.

[20]

A. Quellmalz et al., "Large-area integration of two-dimensional materials and their heterostructures by wafer bonding," Nature Communications, vol. 12, no. 1, 2021.

[21]

C. Chen et al., "Bactericidal surfaces prepared by femtosecond laser patterning andlayer-by-layer polyelectrolyte coating," Journal of Colloid and Interface Science, vol. 575, s. 286-297, 2020.

[22]

X. Fan et al., "Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.

[23]

M. C. Lemme et al., "Nanoelectromechanical Sensors Based on Suspended 2D Materials," RESEARCH, vol. 2020, 2020.

[24]

S. Rana et al., "Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory," Nature Communications, vol. 11, no. 1, 2020.

[25]

X. Fan et al., "Rapid and Large-Area Visualization of Grain Boundaries in MoS2 on SiO2 Using Vapor Hydrofluoric Acid," ACS Applied Materials and Interfaces, vol. 12, no. 30, s. 34049-34057, 2020.

[26]

F. Ribet et al., "Vertical integration of microchips by magnetic assembly and edge wire bonding," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.

[27]

M. Laakso et al., "Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses," Optics Express, vol. 28, no. 2, s. 1394-1408, 2020.

[28]

A. D. Smith et al., "Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks : Present and Future Development," Sensors, vol. 19, no. 19, 2019.

[29]

X. Fan et al., "Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers," Nature Electronics, vol. 2, no. 9, s. 394-404, 2019.

[30]

X. Shi et al., "Quantitative assessment of structural and compositional colors induced by femtosecond laser : A case study on 301LN stainless steel surface," Applied Surface Science, vol. 484, s. 655-662, 2019.

[31]

A. Enrico et al., "Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography," ACS Applied Materials and Interfaces, vol. 11, no. 8, s. 8217-8226, 2019.

[32]

X. Fan et al., "Suspended Graphene Membranes with Attached Silicon Proof Masses as Piezoresistive Nanoelectromechanical Systems Accelerometers," Nano letters (Print), vol. 19, no. 10, s. 6788-6799, 2019.

[33]

X. Wang et al., "Transfer printing of nanomaterials and microstructures using a wire bonder," Journal of Micromechanics and Microengineering, vol. 29, no. 12, 2019.

[34]

X. Wang et al., "Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages," Journal of microelectromechanical systems, vol. 28, no. 3, s. 460-471, 2019.

[35]

M. Parrilla et al., "Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection," Analytical Chemistry, vol. 91, no. 2, s. 1578-1586, 2019.

[36]

X. Fan et al., "Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure," Science Advances, vol. 4, no. 5, 2018.

[37]

X. Fan et al., "Humidity and CO₂ gas sensing properties of double-layer graphene," Carbon, vol. 127, s. 576-587, 2018.

[38]

A. Quellmalz et al., "Influence of Humidity on Contact Resistance in Graphene Devices," ACS Applied Materials and Interfaces, vol. 10, no. 48, s. 41738-41746, 2018.

[39]

V. J. Dubois et al., "Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices," Nature Communications, vol. 9, 2018.

[40]

T. Qin et al., "Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays," IEEE Access, vol. 6, s. 15997-16009, 2018.

[41]

V. J. Dubois et al., "Scalable Manufacturing of Nanogaps," Advanced Materials, vol. 30, no. 46, 2018.

[42]

M. J. Laakso et al., "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires," IEEE Access, vol. 6, s. 44306-44317, 2018.

[43]

S. J. Bleiker et al., "Adhesive wafer bonding with ultra-thin intermediate polymer layers," Sensors and Actuators A-Physical, vol. 260, s. 16-23, 2017.

[44]

V. J. Dubois, F. Niklaus och G. Stemme, "Design and fabrication of crack-junctions," MICROSYSTEMS & NANOENGINEERING, vol. 3, 2017.

[45]

A. D. Smith et al., "Graphene-based CO2 sensing and its cross-sensitivity with humidity," RSC Advances, vol. 7, no. 36, s. 22329-22339, 2017.

[46]

B. Khorramdel et al., "Inkjet printing technology for increasing the I/O density of 3D TSV interposers," Microsystems & Nanoengineering, vol. 3, s. 17002, 2017.

[47]

M. Asiatici et al., "Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications," Journal of microelectromechanical systems, vol. 26, no. 1, s. 158-168, 2017.

[48]

X. Wang et al., "Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint," Journal of microelectromechanical systems, vol. 26, no. 2, s. 357-365, 2017.

[49]

M. Asiatici et al., "Capacitive inertial sensing at high temperatures of up to 400 degrees C," Sensors and Actuators A-Physical, vol. 238, s. 361-368, 2016.

[50]

S. J. Bleiker et al., "Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding," Micromachines, vol. 7, no. 10, s. 192, 2016.

[51]

V. Dubois, F. Niklaus och G. Stemme, "Crack-defined electronic nanogaps," Advanced Materials, vol. 28, no. 11, s. 2178-2182, 2016.

[52]

F. J. Aparicio et al., "Dye-based photonic sensing systems," Sensors and actuators. B, Chemical, vol. 228, s. 649-657, 2016.

[53]

S. Schröder et al., "Fabrication of an Infrared Emitter using a Generic Integration Platform Based on Wire Bonding," Journal of Micromechanics and Microengineering, vol. 26, no. 11, 2016.

[54]

M. Rajabi et al., "Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing," PLOS ONE, vol. 11, no. 12, 2016.

[55]

A. D. Smith et al., "Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors," ACS Nano, vol. 10, no. 11, s. 9879-9886, 2016.

[56]

F. Forsberg et al., "CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration," IEEE Journal of Selected Topics in Quantum Electronics, vol. 21, no. 4, s. 1-11, 2015.

[57]

S. J. Bleiker et al., "High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, s. 21-27, 2015.

[58]

A. C. Fischer et al., "Integrating MEMS and ICs," Microsystems & Nanoengineering, vol. 1, no. 1, s. 1-16, 2015.

[59]

C. Errando-Herranz et al., "Low-power microelectromechanically tunable silicon photonic ring resonator add-drop filter," Optics Letters, vol. 40, no. 15, s. 3556-3559, 2015.

[60]

C. L. Ayala et al., "Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts," Solid-State Electronics, vol. 113, s. 157-166, 2015.

[61]

A. D. Smith et al., "Resistive graphene humidity sensors with rapid and direct electrical readout," Nanoscale, vol. 7, no. 45, s. 19099-19109, 2015.

[62]

S. Schröder et al., "Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment," Journal of microelectromechanical systems, vol. 24, no. 4, s. 781-789, 2015.

[63]

H. K. Gatty et al., "Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive," ECS Journal of Solid State Science and Technology, vol. 3, no. 5, s. P115-P121, 2014.

[64]

F. Forsberg et al., "A Comparative study of the bonding energy in adhesive wafer bonding," Journal of Micromechanics and Microengineering, vol. 23, no. 8, s. 1-7, 2013.

[65]

F. Saharil et al., "Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer," Journal of Micromechanics and Microengineering, vol. 23, no. 2, s. 025021, 2013.

[66]

A. Smith et al., "Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes," Nano letters (Print), vol. 13, no. 7, s. 3237-3242, 2013.

[67]

F. Forsberg et al., "Heterogeneous 3D integration of 17 mu m pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems," Journal of Micromechanics and Microengineering, vol. 23, no. 4, s. 045017, 2013.

[68]

M. Lapisa et al., "Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon," Journal of Micromechanics and Microengineering, vol. 23, no. 7, s. 075003, 2013.

[69]

A. D. Smith et al., "Pressure sensors based on suspended graphene membranes," Solid-State Electronics, vol. 88, s. 89-94, 2013.

[70]

A. C. Fischer et al., "Unconventional applications of wire bonding create opportunities for microsystem integration," Journal of Micromechanics and Microengineering, vol. 23, no. 8, s. 083001, 2013.

[71]

F. Forsberg et al., "Very Large Scale Heterogeneous Integration (VLSHI) and Wafer-Level Vacuum Packaging for Infrared Bolometer Focal Plane Arrays," Infrared physics & technology, vol. 60, s. 251-259, 2013.

[72]

M. Antelius et al., "Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps," Journal of microelectromechanical systems, vol. 22, no. 6, s. 1347-1353, 2013.

[73]

M. Lapisa et al., "Wafer-Level capping and sealing of heat sensitive substances and liquids with gold gaskets," Sensors and Actuators A-Physical, vol. 201, s. 154-163, 2013.

[74]

A. C. Fischer et al., "3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching," Advanced Functional Materials, vol. 22, no. 19, s. 4004-4008, 2012.

[75]

F. Forsberg et al., "Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes," Journal of microelectromechanical systems, vol. 21, no. 5, s. 1077-1083, 2012.

[76]

M. Lapisa et al., "Drift-free micromirror arrays made of monocrystalline silicon for adaptive optics applications," Journal of microelectromechanical systems, vol. 21, no. 4, s. 959-970, 2012.

[77]

M. Antelius et al., "Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level," Journal of Micromechanics and Microengineering, vol. 22, no. 4, s. 045021, 2012.

[78]

K. B. Gylfason et al., "Process considerations for layer-by-layer 3D patterning of silicon, using ion implantation, silicon deposition, and selective silicon etching," Journal of Vacuum Science & Technology B, vol. 30, no. 6, s. 06FF05, 2012.

[79]

A. C. Fischer et al., "Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires," Journal of Micromechanics and Microengineering, vol. 22, no. 10, s. 105001, 2012.

[80]

A. C. Fischer et al., "Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates," Journal of Micromechanics and Microengineering, vol. 22, no. 5, s. 055025, 2012.

[81]

F. Zimmer et al., "One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration," Journal of microelectromechanical systems, vol. 20, no. 3, s. 564-572, 2011.

[82]

M. Antelius, G. Stemme och F. Niklaus, "Small footprint wafer-level vacuum packaging using compressible gold sealing rings," Journal of Micromechanics and Microengineering, vol. 21, no. 8, s. 085011, 2011.

[83]

M. Lapisa, G. Stemme och F. Niklaus, "Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS," IEEE Journal of Selected Topics in Quantum Electronics, vol. 17, no. 3, s. 629-644, 2011.

[84]

A. C. Fischer et al., "Wire-bonded through-silicon vias with low capacitive substrate coupling," Journal of Micromechanics and Microengineering, vol. 21, no. 8, s. 085035, 2011.

[85]

A. Decharat et al., "Room-Temperature Sealing of Microcavities by Cold Metal Welding," Journal of microelectromechanical systems, vol. 18, no. 6, s. 1318-1325, 2009.

[86]

F. Niklaus et al., "Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs," Sensors and Actuators A-Physical, vol. 154, no. 1, s. 180-186, 2009.

[87]

F. Niklaus et al., "Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure," Infrared physics & technology, vol. 51, no. 3, s. 168-177, 2008.

[88]

F. Niklaus et al., "Adhesive wafer bonding," Journal of Applied Physics, vol. 99, no. 3, 2006.

[89]

F. Niklaus et al., "Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration," Journal of the Electrochemical Society, vol. 153, no. 4, s. G291-G295, 2006.

[90]

J. Oberhammer, F. Niklaus och G. Stemme, "Sealing of adhesive bonded devices on wafer level," Sensors and Actuators A-Physical, vol. 110, no. 1-3, s. 407-412, 2004.

[91]

F. Niklaus et al., "A method to maintain wafer alignment precision during adhesive wafer bonding," Sensors and Actuators A-Physical, vol. 107, no. 3, s. 273-278, 2003.

[92]

F. Niklaus, S. Haasl och G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding," Journal of microelectromechanical systems, vol. 12, no. 4, s. 465-469, 2003.

[93]

J. Oberhammer, F. Niklaus och G. Stemme, "Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities," Sensors and Actuators A-Physical, vol. 105, no. 3, s. 297-304, 2003.

[94]

H. Andersson et al., "Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels," Sensors and actuators. B, Chemical, vol. 75, no. 1-2, s. 136-141, 2001.

[95]

F. Niklaus et al., "Low temperature full wafer adhesive bonding of structured wafers," Sensors and Actuators A-Physical, vol. 92, no. 03-jan, s. 235-241, 2001.

[96]

F. Niklaus et al., "Low-temperature full wafer adhesive bonding," Journal of Micromechanics and Microengineering, vol. 11, no. 2, s. 100-107, 2001.

[97]

F. Niklaus et al., "Low-temperature wafer-level transfer bonding," Journal of microelectromechanical systems, vol. 10, no. 4, s. 525-531, 2001.

[98]

F. Niklaus, E. Kälvesten och G. Stemme, "Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays," Journal of Micromechanics and Microengineering, vol. 11, no. 5, s. 509-513, 2001.

Konferensbidrag

[99]

S. Pagliano et al., "A 3D-Printed Functional Mems Accelerometer," i 2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2023, s. 594-597.

[100]

Y. Li et al., "Design and fabrication of a 4-terminal in-plane nanoelectromechanical relay," i Transducers2023 - The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Kyoto, June 25-29, 2023, 2023.

[101]

U. Khan et al., "Low power actuators for programmable photonic processors," i AI and Optical Data Sciences IV, 2023.

[102]

L.-L. Lai et al., "Picoliter-volume refractive index sensor 3D-printed in silica glass on an optical fiber tip," i 2023 Conference on Lasers and Electro-Optics, CLEO 2023, 2023.

[103]

W. Bogaerts et al., "Scaling programmable silicon photonics circuits," i Silicon Photonics XVIII, 2023.

[104]

N. Negm et al., "Graphene waveguide-integrated thermal infrared emitter," i Device Research Conference - Conference Digest, DRC, 2022.

[105]

U. Khan et al., "Large scale programmable photonic circuits using silicon photonic MEMS," i 2022 Conference on Lasers and Electro-Optics, CLEO 2022 : Proceedings, 2022.

[106]

U. Khan et al., "Large scale programmable photonic circuits using silicon photonic MEMS," i Optics InfoBase Conference Papers, 2022.

[107]

P.-S. Lin et al., "Low-concentration detection of CO₂ using suspended silicon waveguides in the mid-IR," i 2022 Conference on Lasers and Electro-Optics, CLEO 2022 : Proceedings, 2022.

[108]

P.-S. Lin et al., "Low-concentration detection of CO₂ using suspended silicon waveguides in the mid-IR," i Optics InfoBase Conference Papers, 2022.

[109]

U. Khan et al., "MORPHIC : MEMS enhanced silicon photonics for programmable photonics," i Integrated Photonics Platforms Ii, 2022.

[110]

W. Bogaerts et al., "Programmable Photonic Circuits powered by Silicon Photonic MEMS Technology," i Photonic Networks and Devices, Networks 2022, 2022.

[111]

W. Bogaerts et al., "Programmable silicon photonic circuits powered by MEMS," i Proceedings of SPIE - The International Society for Optical Engineering, 2022.

[112]

A. Quellmalz et al., "Wafer-scale integration of layered 2D materials by adhesive wafer bonding," i Proceedings of SPIE - The International Society for Optical Engineering, 2022.

[113]

X. Fan och F. Niklaus, "NEMS Sensors Based on Suspended Graphene," i 2021 IEEE 16Th International Conference On Nano/Micro Engineered And Molecular Systems (Nems), 2021, s. 1169-1172.

[114]

W. Bogaerts et al., "Programmable photonic circuits using silicon photonic MEMS," i Optics InfoBase Conference Papers, 2021.

[115]

D. Moreno et al., "Proof of concept of a graphene-based resonant accelerometer," i 2021 34th IEEE international conference on micro electro mechanical systems (MEMS 2021), 2021, s. 838-840.

[116]

N. Quack et al., "Scalable Nano-Opto-Electromechanical Systems in Silicon Photonics," i 2021 IEEE Photonics Conference, IPC 2021 - Proceedings, 2021.

[117]

A. Quellmalz et al., "Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding," i 2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings, 2021.

[118]

A. Quellmalz et al., "Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding," i CLEO: Science and Innovations 2021, 2021.

[119]

A. Quellmalz et al., "Stacking of two-dimensional materials to large-area heterostructures by wafer bonding," i Optics InfoBase Conference Papers, 2021.

[120]

K. Rajendran et al., "Thermo-mechanical Noise Measurement of Sealed Nanobeams on a Silicon Photonics-MEMS Platform," i 2021 IEEE 17Th International Conference On Group Iv Photonics (GFP 2021), 2021.

[121]

A. Quellmalz et al., "Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding," i 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems, 2020.

[122]

S. Pagliano et al., "Feedback-Free Electromigrated Tunneling Junctions from Crack-Defined Gold Nanowires," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 365-367.

[123]

A. Enrico et al., "Manufacturing of Sub-20 NM Wide Single Nanowire Devices using Conventional Stepper Lithography," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 244-247.

[124]

N. Quack et al., "Silicon Photonic MEMS : Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits," i 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2019.

[125]

N. Quack et al., "Silicon photonic MEMS : Exploiting mechanics at the nanoscale to enhance photonic integrated circuits," i Optics InfoBase Conference Papers, 2019.

[126]

A. Quellmalz et al., "Wafer-Scale Transfer of Graphene by Adhesive Wafer Bonding," i 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 257-259.

[127]

S. J. Bleiker et al., "Adhesive Wafer Bonding for Heterogeneous System Integration," i ECS Meeting Abstracts, 2018.

[128]

S. Redzwan et al., "Initial in-vitro trial for intra-cranial pressure monitoring using subdermal proximity-coupled split-ring resonator," i IMBioc 2018 - 2018 IEEE/MTT-S International Microwave Biomedical Conference, 2018, s. 73-75.

[129]

C. Errando-Herranz et al., "New dynamic silicon photonic components enabled by MEMS technology," i Proceedings Volume 10537, Silicon Photonics XIII, 2018.

[130]

S. Schröder et al., "A low-cost nitric oxide gas sensor based on bonded gold wires," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 1457-1460.

[131]

S. Schröder et al., "A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 315-318.

[132]

V. Dubois, F. Niklaus och G. Stemme, "Design optimization and characterization of nanogap crack-junctions," i 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS), Las Vegas, USA, 22-26 January 2017, 2017, s. 644-647.

[133]

M. Laakso et al., "Maskless Manufacturing of Through Glass Vias (TGVs) and Their Test Structures," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2017, s. 753-756.

[134]

X. Wang et al., "Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 423-426.

[135]

F. Niklaus och A. C. Fischer, "Heterogeneous 3D integration of MOEMS and ICs," i International Conference on Optical MEMS and Nanophotonics, 2016.

[136]

S. J. Bleiker, A. C. Fischer och F. Niklaus, "High-speed Metal-filling of Through-Silicon Vias (TSVs) by Parallelized Magnetic Assembly of Micro-Wires," i 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, s. 577-580.

[137]

A. D. Smith et al., "Toward Effective Passivation of Graphene to Humidity Sensing Effects," i 2016 46TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC), 2016, s. 299-302.

[138]

C. Errando-Herranz et al., "A Low-power MEMS Tunable Photonic Ring Resonator for Reconfigurable Optical Networks," i Proceedings of The 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Estoril, Portugal. Jan 2015, 2015, s. 53-56.

[139]

C. Errando-Herranz et al., "A MEMS tunable photonic ring resonator with small footprint and large free spectral range," i Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on, 2015, s. 1001-1004.

[140]

F. Forsberg et al., "Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation," i 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2015), 2015, s. 280-283.

[141]

A. D. Smith et al., "Biaxial strain in suspended graphene membranes for piezoresistive sensing," i 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, s. 1055-1058.

[142]

A. D. Smith et al., "Graphene-based piezoresistive pressure sensing for uniaxial and biaxial strains," i 2014 Silicon Nanoelectronics Workshop, SNW 2014, 2014.

[143]

A. C. Fischer et al., "3D printing of silicon micro and nano structures by ion implantation, silicon deposition, and selective silicon etching," i Technical Paper - Society of Manufacturing Engineers, 2013.

[144]

G. Stemme och F. Niklaus, "Cost effective MEMS integration for complex device applications," i Conference on Micro- and Nano- Engineering : MNE 2013, London, 2013, s. 17-17.

[145]

F. Forsberg et al., "Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 342-346.

[146]

S. Schröder et al., "Stress-minimized packaging of inertial sensors using wire bonding," i 2013 Transducers & Eurosensors XXVII : The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013, s. 1962-1965.

[147]

H. K. Gatty et al., "Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 381-384.

[148]

S. Schröder et al., "Very high aspect ratio through silicon vias (TSVs) using wire bonding," i Transducers & Eurosensors XXVII : The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013, 2013, s. 167-170.

[149]

M. Karlsson (Hillmering) et al., "High-resolution micropatterning of off-stochiometric thiol-enes (OSTE) via a novel lithography mechanism," i 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences (microTAS 2012), 2012, s. 225-227.

[150]

A. C. Fischer et al., "Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching," i 12th IEEE Conference on Nanotechnology (IEEE-NANO), 2012, 2012, s. 1-4.

[151]

G. Malm et al., "Quantum Mechanical TCAD Study of Epitaxial SiGe Thermistor Layers," i International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, 2012, s. 173-176.

[152]

F. Niklaus et al., "Wafer-level heterogeneous 3D integration for MEMS and NEMS," i Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, 2012, s. 247-252.

[153]

A. C. Fischer et al., "high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires," i Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 2012, s. 541-547.

[154]

A. C. Fischer et al., "Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires," i Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, 2011, s. 37-40.

[155]

F. Forsberg et al., "HETEROGENEOUS INTEGRATION TECHNOLOGY FOR COMBINATION OF DIFFERENT WAFER SIZES USING AN EXPANDABLE HANDLE SUBSTRATE," i PROC IEEE MICR ELECT : IEEE MICRO ELECTRO MECHANICAL SYSTEMS, 2011, s. 268-271.

[156]

M. A. Lapisa et al., "Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers," i 2011 IEEE 24th International Conference On Micro Electro Mechanical Systems (MEMS), 2011, s. 696-699.

[157]

F. Forsberg et al., "High-Performance Infrared Micro-Bolometer Arrays Manufactured Using Very Large Scale Heterogeneous Integration," i OMN2011 : 16TH INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS, 2011, s. 9-10.

[158]

P. Ericsson et al., "Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays," i Infrared Technology and Applications XXXVII : Proc. of SPIE, Vol. 8012, 2011, s. 801216-1-801216-9.

[159]

F. Zimmer et al., "Very large scale heterogeneous system integration for 1-megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics," i 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011, s. 736-739.

[160]

A. C. Fischer et al., "Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology," i 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE, 2011, s. 348-351.

[161]

N. Lietaer et al., "Wafer-level packaged MEMS switch with TSV," i International Wafer-Level Packaging Conference, Santa Clara, CA, USA 2011, 2011, s. 1-10.

[162]

F. Niklaus, "Adhesive Wafer Bonding, Applications and Trends," i Semiconductor Wafer Bonding 11 : Science, Technology, And Applications - In Honor Of Ulrich Gosele, 2010, s. 273-286.

[163]

A. C. Fischer et al., "Heterogeneous Integration for Optical MEMS," i 2010 23RD ANNUAL MEETING OF THE IEEE PHOTONICS SOCIETY, 2010, s. 487-488.

[164]

F. Saharil et al., "LOW-TEMPERATURE CMOS-COMPATIBLE 3D-INTEGRATION OF MONOCRYSTALLINE-SILICON BASED PZT RF MEMS SWITCH ACTUATORS ON RF SUBSTRATES," i MEMS 2010 : 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, s. 47-50.

[165]

A. C. Fischer et al., "Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling," i MEMS 2010 : 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, s. 480-483.

[166]

A. C. Fischer et al., "Low-cost Through Silicon Vias (Tsvs) with wire-bonded metal cores and low capacitive substratecoupling : ," i Proceedings : 8th Micronano System Technology Event (MSW 2010), 2010, s. 30-30.

[167]

N. Roxhed et al., "Low-cost uncooled microbolometers for thermal imaging," i OPTICAL SENSING AND DETECTION, 2010, s. 772611.

[168]

A. C. Fischer et al., "Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures : ," i Proceedings : Micronano System Technology Event MSW 2010, 2010, s. 86.

[169]

A. C. Fischer et al., "Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures," i MEMS 2010 : (MEMS), 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems, 2010, s. 472-475.

[170]

B. Mesgarzadeh et al., "A low-noise readout circuit in 0.35-ï¿œm CMOS for low-cost uncooled FPA infrared network camera," i Proceedings of SPIE - The International Society for Optical Engineering, 2009, s. 72982F.

[171]

N. Roxhed och F. Niklaus, "Adhesive Wafer Bonding and Applications," i Proceedings of Waferbond'09, 2009, s. 53-56.

[172]

M. Lapisa et al., "CMOS-integrable piston-type micro-mirror array for adaptive optics made of mono-crystalline silicon using 3-D integration," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, 2009, s. 1007-1010.

[173]

F. Zimmer et al., "Fabrication of large-scale mono-crystalline silicon micro-mirror arrays using adhesive wafer transfer bonding," i Proceedings of SPIE - The International Society for Optical Engineering, 2009, s. 720807.

[174]

F. Forsberg et al., "High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers," i TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, 2009, s. 2214-2217.

[175]

M. Lapisa, F. Niklaus och G. Stemme, "Room-temperature wafer-level hermetic sealing for liquid reservoirs by gold ring embossing," i TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, 2009, s. 833-836.

[176]

F. Niklaus, C. Vieider och H. Jakobsen, "MEMS-Based uncooled infrared bolometer Arrays : A review," i P SOC PHOTO-OPT INSTRUM ENG, 2008, s. D8360-D8360.

[177]

T. Kvisteroy et al., "Far infrared low-cost uncooled bolometer for automotive use," i Advanced Microsystems for Automotive Applications 2007, 2007, s. 265-278.

[178]

C. Vieider et al., "Low-cost far infrared bolometer camera for automotive use," i P SOC PHOTO-OPT INSTRUM ENG, 2007, s. 5421-5421.

[179]

A. Decharat et al., "Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding," i PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2007, s. 754-757.

[180]

M. Populin et al., "Thermosetting nano-imprint resists : Novel materials for adhesive wafer bonding," i PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2007, s. 390-393.

[181]

F. Niklaus et al., "Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere : Performance model and tradeoffs," i MEMS 2006 : 19th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest, 2007, s. M5421-M5421.

[182]

S. H. Lee et al., "Fine keyed alignment and bonding for wafer-level 3D ICs," i MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS : Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, 2006, s. 433-438.

[183]

J.-E. Källhammer et al., "Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets," i Photonics in the Automobile II, 2006, s. 19809-19809.

[184]

J. J. McMahon et al., "Unit processes for Cu/BCB redistribution layer bonding for 3D ICs," i Advanced Metallization Conference 2005 (AMC 2005), 2006, s. 179-183.

[185]

J. J. McMahon et al., "CMP compatibility of partially cured benzocyclobutene (BCB) for a via-first 3D IC process," i Chemical-Mechanical Planarization-Integration, Technology and Reliability, 2005, s. 63-68.

[186]

F. Niklaus et al., "Effects of bonding process parameters on wafer-to-wafer alignment accuracy in benzocyclobutene (BCB) dielectric wafer bonding," i Materials, Technology and Reliability of Advanced Interconnects-2005, 2005, s. 393-398.

[187]

F. Niklaus et al., "Characterization of transfer bonded silicon bolometer arrays," i INFRARED TECHNOLOGY AND APPLICATIONS XXX, 2004, s. 521-530.

[188]

S. Haasl, F. Niklaus och G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding : IEEE The sixteenth annual international conference on Micro Electro Mechanical Systems," i MEMS-03 : IEEE THE SIXTEENTH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2003, s. 271-274.

[189]

J. Oberhammer, F. Niklaus och G. Stemme, "Sealing of Adhesive Bonded Devices on Wafer Level," i Proc. Eurosensors XVI, 2002, s. 298-299.

[190]

F. Niklaus, E. Kälvesten och G. Stemme, "A new concept for CMOS-compatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding," i PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), 2001, s. 397-404.

[191]

J. Oberhammer, F. Niklaus och G. Stemme, "Selective Wafer Level Adhesive Bonding with Benzocyclobutene," i Proc. Micromechanics Europe MME 2001, 2001, s. 54-57.

Kapitel i böcker

[192]

F. Niklaus och J. -. Lu, "Polymer Adhesive Wafer Bonding," i Handbook of Wafer Bonding, : Wiley-VCH Verlagsgesellschaft, 2012, s. 33-61.

Icke refereegranskade

Artiklar

[193]

R. Knechtel, F. Niklaus och B. Michel, "Special issue WaferBond'13 "International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration"," Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems, vol. 21, no. 5, s. 951-951, 2015.

Konferensbidrag

[194]

G. Jo et al., "Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding," i WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, October 5-6, 2022., 2022.

[195]

G. Jo et al., "Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS," i Proceedings SPIE OPTO 6-12 march 2021 silicon photonics XVI, 2021.

[196]

W. Bogaerts et al., "MORPHIC : Programmable Photonic Circuits enabled by Silicon Photonic MEMS," i Proceedings Volume 11285 SPIE OPTO - 1-6 February 2020 Silicon Photonics XV, 2020.

[197]

M. Laakso et al., "Through-Glass Vias for MEMS Packaging," i The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May, 2018.

[198]

F. Saharil et al., "Dry adhesive bonding of porous membranes to microstructured silicon wafers using the OSTE(+) dual-cure polymer," i Proceedings of the 10th Micronano System Workshop (MSW 2014), 2014.

[199]

F. Saharil et al., "Dry adhesive bonding of porous alumina membranes to microstructured silicon wafers using the OSTE(+) dual-cure polymer," i Proceedings of the International Conference on Wafer Bonding, 2013.

[200]

A. C. Fischer et al., "3D Patterning of Si Micro and Nano Structures by Focused Ion Beam Implantation, Si Deposition and Selective Si Etching," i The 56th International Conference on Electron, Ion, Photon Beam Technolog (EIPBN), 2012.

[201]

F. Forsberg et al., "HETEROGENEOUS INTEGRATION METHOD FOR TRANSFER OFEXPANDED DIE MATRICES TO LARGE FORMAT WAFERS USINGAN EXPANDABLE TAPE," i MSW 2012 Linköping, 2012.

[202]

G. B. Malm et al., "Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers," i 2012 MRS Spring Meeting - Symposium L – Group IV Photonics for Sensing and Imaging, 2012.

[203]

M. Antelius et al., "Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level," i Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2011, s. 356-359.

[204]

M. Antelius et al., "Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps," i Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers), 2011, s. 1360-1363.

[205]

F. Forsberg et al., "Use of Expandable Handle Substrate for Wafer-Level Transfer of Dies in Heterogeneous Integration and Packaging of MEMS," i WaferBond´11, 2011, s. 105-106.

[206]

G. Stemme och F. Niklaus, "Wafer-Level Heterogeneous Integration Techniques for MEMS and IC," i 1st International Symposium on Integrated Microsystems (ISIM2011). Tsukuba Japan. 10th Feb. 2011, 2011.

[207]

F. Forsberg et al., "Quantum-Well Silicon-Germanium Bolometers for Low-Cost Infrared Imagers," i Proceedings : MSW2010, 2010.

[208]

F. Zimmer et al., "Fabrication of mono-crystalline Silicon Micro-mirror Arrays using adhesive Wafer Transfer Bonding," i MikroSystemTechnik KONGRESS 2009, 2009.

[209]

A. Decharat et al., "NOVEL ROOM-TEMPERATURE WAFER-TO-WAFER ATTACHMENT AND SEALING OF CAVITIES USING COLD METAL WELDING," i Proceedings Micro System Workshop MSW08, 2008.

[210]

F. Zimmer et al., "The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications," i International Conference on Multi-Material Micro Manufacture, 2008, s. 35-38.

[211]

M. Taklo et al., "Vibration Sensor for Wireless Condition Monitoring," i Proceedings of the Pan Pacific Microelectronics Symposium, 2008, s. 305-331.

[212]

S. Wissmar et al., "SiGe Thermistor Infrared Bolometers," i Proceedings Micro System Workshop MSW, 2006, s. 62.

[213]

F. Niklaus et al., "Wafer-Level 3D Integration Technology Platforms for ICs and MEMS," i TWENTY SECOND INTERNATIONAL VLSI MULTILEVEL INTERCONNECTION (VMIC), 2005, s. 486-493.

[214]

R. Gutmann et al., "Wafer-Level Via-First 3D Integration with Hybrid-Bonding of Cu/BCB Redistribution Layers," i IWLPC - International Wafer-Level Packaging Conference. San Jose (CA). November 3-4, 2005., 2005.

[215]

F. Niklaus, J. Oberhammer och G. Stemme, "Adhesive Wafer Bonding for Packaging Applications," i Workshop on MEMS Sensor Packaging 2003; Copenhagen, Denmark, 20-21 March 2003, 2003.

Kapitel i böcker

[216]

X. Wang och F. Niklaus, "Polymer Bonding," i 3D and Circuit Integration of MEMS, Masayoshi Esashi red., : Wiley, 2021, s. 331-359.

[217]

A. C. Fischer, M. Mäntysalo och F. Niklaus, "Inkjet printing, laser-based micromachining, and micro-3D printing technologies for MEMS," i Handbook of Silicon Based MEMS Materials and Technologies, : Elsevier BV, 2020, s. 531-545.

[218]

A. C. Fischer, M. Mäntysalo och F. Niklaus, "Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS," i Handbook of Silicon Based MEMS Materials and Technologies: Second Edition, : Elsevier Inc., 2015, s. 550-564.

[219]

F. Niklaus och J. Q. Lu, "Handbook of Wafer Bonding," i Polymer Adhesive Wafer Bonding, P. Ramm, J.-Q. Lu, M.M.V. Taklo red., : Wiley-VCH Verlagsgesellschaft, 2012.