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Publications by Joachim Oberhammer

Refereegranskade

Artiklar

[1]
A. Karimi et al., "A 220-260 GHz Silicon-Micromachined Waveguide MEMS Crossover Switch," IEEE transactions on microwave theory and techniques, 2024.
[2]
A. Karimi et al., "A 220–260-GHz Silicon-Micromachined Waveguide MEMS Crossover Switch," IEEE transactions on microwave theory and techniques, pp. 1-11, 2024.
[3]
B. Beuerle et al., "A CPW Probe to Rectangular Waveguide Transition for On-Wafer Micromachined Waveguide Characterization," IEEE Transactions on Terahertz Science and Technology, vol. 14, no. 1, pp. 98-108, 2024.
[4]
A. Karimi et al., "A High-Performance 220–290 GHz Micromachined Waveguide Switch Based on Interference Between MEMS Reconfigurable Surfaces," IEEE Transactions on Terahertz Science and Technology, vol. 14, no. 2, pp. 188-198, 2024.
[5]
A. Karimi et al., "Full-Band Silicon-Micromachined E-Plane Waveguide Bend for Flange-to-Chip Connection," IEEE Transactions on Terahertz Science and Technology, vol. 14, no. 1, pp. 130-133, 2024.
[6]
A. Madannejad et al., "High-Gain Circularly Polarized 500-750 GHz Lens Antenna Enabled by Silicon Micromachining," IEEE Transactions on Antennas and Propagation, pp. 1-1, 2024.
[7]
A. Karimi et al., "Silicon-Micromachined Subterahertz Frequency Beam-Steered Dual-Port Array Antenna," IEEE Transactions on Terahertz Science and Technology, vol. 14, no. 2, pp. 258-268, 2024.
[8]
A. Krivovitca et al., "Cross-Over Wire-Bonding for Millimeter-Wave Applications," IEEE Electron Device Letters, vol. 44, no. 12, pp. 2019-2022, 2023.
[9]
B. Beuerle et al., "Integrating InP MMICs and Silicon Micromachined Waveguides for Sub-THz Systems," IEEE Electron Device Letters, vol. 44, no. 10, pp. 1800-1803, 2023.
[10]
M. Mehrabi Gohari et al., "On-Chip Integration of Orthogonal Subsystems Enabled by Broadband Twist at 220–325 GHz," IEEE transactions on microwave theory and techniques, pp. 1-0, 2023.
[11]
M. Seidi et al., "A Novel Demixing Algorithm for Joint Target Detection and Impulsive Noise Suppression," IEEE Communications Letters, vol. 26, no. 11, pp. 2750-2754, 2022.
[12]
X. Zhao, O. Glubokov and J. Oberhammer, "A Silicon-Micromachined Waveguide Platform with Axial Ports for Integrated Sub-THz Filters," IEEE transactions on microwave theory and techniques, vol. 70, no. 2, pp. 1221-1232, 2022.
[13]
C. Bartlett et al., "Compact Triangular-Cavity Singlet-Based Filters in Stackable Multi-Layer Technologies," IEEE Transactions on Terahertz Science and Technology, vol. 12, no. 5, pp. 540-543, 2022.
[15]
S. Smirnov et al., "Sub‐THz Phase Shifters Enabled by Photoconductive Single‐Walled Carbon Nanotube Layers," Advanced Photonics Research, pp. 2200042-2200042, 2022.
[16]
J. Campion et al., "Ultra‐Wideband Integrated Graphene‐Based Absorbers for Terahertz Waveguide Systems," Advanced Electronic Materials, vol. 8, no. 9, pp. 2200106-2200106, 2022.
[17]
M. Horberg et al., "A 110-170-GHz Non-Galvanic Interface for Integrating Silicon Micromachined Chips With Metallic Waveguide Systems," IEEE transactions on microwave theory and techniques, vol. 69, no. 8, pp. 3667-3674, 2021.
[18]
A. Przewłoka et al., "Characterization of Silver Nanowire Layers in the Terahertz Frequency Range," Materials, vol. 14, no. 23, pp. 7399, 2021.
[19]
X. Zhao and J. Oberhammer, "HF Under-Etching Prevention for Advanced THz Micromachined Waveguide Devices," Journal of microelectromechanical systems, vol. 30, no. 3, pp. 334-336, 2021.
[20]
X. Zhao et al., "Micromachined Subterahertz Waveguide-Integrated Phase Shifter Utilizing Supermode Propagation," IEEE transactions on microwave theory and techniques, vol. 69, no. 7, pp. 3219-3227, 2021.
[21]
J. Campion and J. Oberhammer, "Silicon Micromachined Waveguide Calibration Standards for Terahertz Metrology," IEEE transactions on microwave theory and techniques, vol. 69, no. 8, pp. 3927-3942, 2021.
[22]
A. Gomez-Torrent et al., "A 38 dBi Gain, Low-Loss, Flat Array Antenna for 320 GHz to 400 GHz Enabled by Silicon-On-Insulator Micromachining," IEEE Transactions on Antennas and Propagation, vol. 68, no. 6, pp. 4450-4458, 2020.
[23]
A. Gomez-Torrent et al., "A Low-Profile and High-Gain Frequency Beam Steering Subterahertz Antenna Enabled by Silicon Micromachining," IEEE Transactions on Antennas and Propagation, vol. 68, no. 2, pp. 672-682, 2020.
[24]
A. Krivovitca et al., "Micromachined Silicon-Core Substrate-Integrated Waveguides at 220-330 GHz," IEEE transactions on microwave theory and techniques, vol. 68, no. 12, pp. 5123-5131, 2020.
[25]
A. Gomez-Torrent, "Micromachined Waveguide Interposer for the Characterization of Multi-port Sub-THz Devices," Journal of Infrared, Millimeter and Terahertz Waves, 2020.
[26]
X. Zhao et al., "Silicon Micromachined D-Band Diplexer Using Releasable Filling Structure Technique," IEEE transactions on microwave theory and techniques, vol. 68, no. 8, pp. 3448-3460, 2020.
[27]
O. Glubokov et al., "Investigation of Fabrication Accuracy and Repeatability of High-Q Silicon-Micromachined Narrowband Sub-THz Waveguide Filters," IEEE transactions on microwave theory and techniques, vol. 67, no. 9, pp. 3696-3706, 2019.
[28]
O. Glubokov et al., "Micromachined Filters at 450 GHz With 1% Fractional Bandwidth and Unloaded Q Beyond 700," IEEE Transactions on Terahertz Science and Technology, vol. 9, no. 1, 2019.
[29]
P. B. Makhalov, D. Lioubtchenko and J. Oberhammer, "Semiconductor-Metal-Grating Slow Wave Amplifier for Sub-THz Frequency Range," IEEE Transactions on Electron Devices, vol. 66, no. 10, pp. 4413-4418, 2019.
[30]
S. Smirnov, D. Lioubtchenko and J. Oberhammer, "Single-walled carbon nanotube layers for millimeter-wave beam steering," Nanoscale, 2019.
[31]
J. Campion et al., "Toward Industrial Exploitation of THz Frequencies : Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems," IEEE Transactions on Terahertz Science and Technology, vol. 9, no. 6, pp. 624-636, 2019.
[32]
S. Smirnov et al., "Wavelength-dependent photoconductivity of single-walled carbon nanotube layers," RSC Advances, vol. 9, no. 26, pp. 14677-14682, 2019.
[33]
B. Beuerle et al., "A Very Low Loss 220–325 GHz Silicon Micromachined Waveguide Technology," IEEE Transactions on Terahertz Science and Technology, vol. 8, no. 2, pp. 248-250, 2018.
[34]
A. Gomez-Torrent, U. Shah and J. Oberhammer, "Compact silicon-micromachined wideband 220 – 330 GHz turnstile orthomode transducer," IEEE Transactions on Terahertz Science and Technology, vol. 9, no. 1, pp. 38-46, 2018.
[35]
I. V. Anoshkin et al., "Freeze-Dried Carbon Nanotube Aerogels for High-Frequency Absorber Applications," ACS Applied Materials and Interfaces, vol. 10, no. 23, pp. 19806-19811, 2018.
[36]
U. Shah et al., "Low Loss High Linearity RF Interposers Enabled by Through-Glass Vias," IEEE Microwave and Wireless Components Letters, vol. 28, no. 11, pp. 960-962, 2018.
[38]
U. Shah et al., "A 500–750 GHz RF MEMS Waveguide Switch," IEEE Transactions on Terahertz Science and Technology, vol. 7, no. 3, pp. 326-334, 2017.
[39]
F. Töpfer, L. Emtestam and J. Oberhammer, "Long-Term Monitoring of Skin Recovery by Micromachined Microwave Near-Field Probe," IEEE Microwave and Wireless Components Letters, vol. 27, no. 6, pp. 605-607, 2017.
[40]
H. Frid et al., "Optimization of Micromachined Millimeter-Wave Planar Silicon Lens Antennas with Concentric and Shifted Matching Regions," Progress In Electromagnetics Research C, vol. 79, pp. 17-29, 2017.
[41]
U. Shah et al., "Submillimeter-Wave 3.3-bit RF MEMS Phase Shifter Integrated in Micromachined Waveguide," IEEE Transactions on Terahertz Science and Technology, vol. 6, no. 5, pp. 706-715, 2016.
[42]
S. J. Bleiker et al., "High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, pp. 21-27, 2015.
[43]
F. Töpfer, S. Dudorov and J. Oberhammer, "Millimeter-Wave Near-Field Probe Designed for High-Resolution Skin Cancer Diagnosis," IEEE transactions on microwave theory and techniques, vol. 63, no. 6, pp. 2050-2059, 2015.
[44]
F. Töpfer and J. Oberhammer, "Millimeter-Wave Tissue Diagnostics : The most promising fields for medical applications," IEEE Microwave Magazine, vol. 16, no. 4, pp. 97-113, 2015.
[45]
U. Shah, M. Sterner and J. Oberhammer, "Analysis of Linearity Deterioration in Multidevice RF MEMS Circuits," IEEE Transactions on Electron Devices, vol. 61, no. 5, pp. 1529-1535, 2014.
[47]
U. Shah et al., "Permeability Enhancement by Multilayer Ferromagnetic Composites for Magnetic-Core On-Chip Inductors," IEEE Microwave and Wireless Components Letters, vol. 24, no. 10, pp. 677-679, 2014.
[48]
T. Ebefors and J. Oberhammer, "Through-Silicon Vias and 3D Inductors for RF Applications," Microwave journal (International ed.), vol. 57, no. 2, pp. 80, 2014.
[49]
Z. Baghchehsaraei et al., "Waveguide-integrated MEMS-based phase shifter for phased array antenna," IET Microwaves, Antennas & Propagation, vol. 8, no. 4, pp. 235-243, 2014.
[50]
U. Shah, M. Sterner and J. Oberhammer, "High-Directivity MEMS-Tunable Directional Couplers for 10–18-GHz Broadband Applications," IEEE transactions on microwave theory and techniques, vol. 61, no. 9, pp. 3236-3246, 2013.
[51]
Z. Baghchehsaraei et al., "Integration of microwave MEMS devices into rectangular waveguide with conductive polymer interposers," Journal of Micromechanics and Microengineering, vol. 23, no. 12, pp. 125020, 2013.
[52]
Z. Baghchehsaraei et al., "MEMS reconfigurable millimeter-wave surface for V-band rectangular-waveguide switch," International Journal of Microwave and Wireless Technologies, vol. 5, no. 3, pp. 341-349, 2013.
[53]
U. Shah, M. Sterner and J. Oberhammer, "Multi-Position RF MEMS Tunable Capacitors Using Laterally Moving Sidewalls of 3-D Micromachined Transmission Lines," IEEE transactions on microwave theory and techniques, vol. 61, no. 6, pp. 2340-2352, 2013.
[54]
Z. Baghchehsaraei and J. Oberhammer, "Parameter Analysis of Millimeter-Wave Waveguide Switch Based on a MEMS-Reconfigurable Surface," IEEE transactions on microwave theory and techniques, vol. 61, no. 12, pp. 4396-4406, 2013.
[55]
M. Sterner and J. Oberhammer, "Symmetrical Anti-Directional Metallization for Stress-Compensation of Transfer-Bonded Monocrystalline Silicon Membranes," Journal of microelectromechanical systems, vol. 22, no. 1, pp. 195-205, 2013.
[56]
N. Somjit and J. Oberhammer, "Three-dimensional micromachined silicon-substrate integrated millimetre-wave helical antennas," IET Microwaves, Antennas & Propagation, vol. 7, no. 4, pp. 291-298, 2013.
[57]
N. Somjit and J. Oberhammer, "Design Approach for Return-Loss Optimisation of Multi-Stage Millimetre-Wave MEMS Dielectric-Block Phase Shifters," IET Microwaves, Antennas & Propagation, vol. 6, pp. 1429-1436, 2012.
[58]
D. Chicherin et al., "Analog-type millimeter-wave phase shifters based on MEMS tunable high-impedance surface and dielectric rod waveguide," International Journal of Microwave and Wireless Technologies, vol. 3, no. 5, pp. 533-538, 2011.
[60]
M. Sterner et al., "Microwave MEMS Devices Designed for Process Robustness and Operational Reliability," International Journal of Microwave and Wireless Technology, vol. 3, no. 5, pp. 547-563, 2011.
[61]
N. Somjit, G. Stemme and J. Oberhammer, "Power Handling Analysis of High-Power W-Band All-Silicon MEMS Phase Shifters," IEEE Transactions on Electron Devices, vol. 58, no. 5, pp. 1548-1555, 2011.
[62]
N. Somjit, G. Stemme and J. Oberhammer, "Deep-Reactive-Ion-Etched Wafer-Scale-Transferred All-Silicon Dielectric-Block Millimeter-Wave MEMS Phase Shifters," Journal of microelectromechanical systems, vol. 19, no. 1, pp. 120-128, 2010.
[63]
M. Sterner et al., "Static Zero-Power-Consumption Coplanar Waveguide Embedded DC-to-RF Metal-Contact MEMS Switches in Two-Port and Three-Port Configuration," IEEE Transactions on Electron Devices, vol. 57, no. 7, pp. 1659-1669, 2010.
[64]
N. Somjit, G. Stemme and J. Oberhammer, "Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters," IEEE transactions on microwave theory and techniques, vol. 57, no. 11, pp. 2834-2840, 2009.
[65]
F. Ke, J. Miao and J. Oberhammer, "A Ruthenium-Based Multimetal-Contact RF MEMS Switch With a Corrugated Diaphragm," Journal of microelectromechanical systems, vol. 17, no. 6, pp. 1447-1459, 2008.
[66]
M. Tang, A. Q. Liu and J. Oberhammer, "A silicon-on-glass single-pole-double-throw (SPDT) switching circuit integrated with a silicon-core metal-coated transmission line," Journal of Micromechanics and Microengineering, vol. 18, no. 9, 2008.
[67]
S. Braun, J. Oberhammer and G. Stemme, "Row/column addressing scheme for large electrostatic actuator MEMS switch arrays and optimization of the operational reliability by statistical analysis," Journal of microelectromechanical systems, vol. 17, no. 5, pp. 1104-1113, 2008.
[68]
S. Braun, J. Oberhammer and G. Stemme, "Single-chip MEMS 5x5 and 20x20 double-pole single-throw switch arrays for automating telecommunication networks," Journal of Micromechanics and Microengineering, vol. 18, no. 1, pp. 015014, 2008.
[69]
A. B. Yu et al., "Characterization and optimization of dry releasing for the fabrication of RF MEMS capacitive switches," Journal of Micromechanics and Microengineering, vol. 17, no. 10, pp. 2024-2030, 2007.
[71]
J. Oberhammer, A. Q. Liu and G. Stemme, "Time-efficient quasi-static algorithm for simulation of complex single-sided clamped electrostatic actuators," Journal of microelectromechanical systems, vol. 16, no. 2, pp. 373-382, 2007.
[72]
J. Oberhammer and G. Stemme, "Active opening force and passive contact force electrostatic switches for soft metal contact materials," Journal of microelectromechanical systems, vol. 15, no. 5, pp. 1235-1242, 2006.
[73]
J. Oberhammer et al., "Mechanically tri-stable, true single-pole-double-throw (SPDT) switches," Journal of Micromechanics and Microengineering, vol. 16, no. 11, pp. 2251-2258, 2006.
[74]
J. Oberhammer and G. Stemme, "BCB contact printing for patterned adhesive full-wafer bonded 0-level packages," Journal of microelectromechanical systems, vol. 14, no. 2, pp. 419-425, 2005.
[75]
J. Oberhammer and G. Stemme, "Design and fabrication aspects of an S-shaped film actuator based DC to RF MEMS switch," Journal of microelectromechanical systems, vol. 13, no. 3, pp. 421-428, 2004.
[76]
J. Oberhammer and G. Stemme, "Low-voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator," IEEE Transactions on Electron Devices, vol. 51, no. 1, pp. 149-155, 2004.
[77]
J. Oberhammer, F. Niklaus and G. Stemme, "Sealing of adhesive bonded devices on wafer level," Sensors and Actuators A-Physical, vol. 110, no. 1-3, pp. 407-412, 2004.
[78]
J. Oberhammer, F. Niklaus and G. Stemme, "Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities," Sensors and Actuators A-Physical, vol. 105, no. 3, pp. 297-304, 2003.

Konferensbidrag

[79]
M. Mehrabi Gohari, O. Glubokov and J. Oberhammer, "Novel Negative Coupling Structure for Rectangular Waveguide Cavity Filters," in Proceedings IEEE International Microwave Filter Workshop IMFW 2024, 2024.
[80]
O. Glubokov et al., "On Modelling of Balanced Filters," in IThe 2nd IEEE International Microwave Filter Workshop (IMFW), February 21-23, 2024 Cocoa Beach, Florida, USA, 2024.
[81]
M. Rezaei Golghand et al., "Attenuation of Electromagnetic waves in Plasma in Ku band," in Swedish Microwave Days 2023, 2023.
[83]
A. Madannejad and J. Oberhammer, "Channel Bounding modeling for THz Communication," in Swedish Microwave days 2023, 2023.
[84]
A. Karimi, U. Shah and J. Oberhammer, "Compact High-isolation Sub-THz Micro-electromechanical SPST Switch," in 2023 53rd European Microwave Conference, EuMC 2023, 2023.
[85]
A. Karimi, U. Shah and J. Oberhammer, "Silicon-Micromachined THz Radar Frontend," in Swedish Microwave Days 2023, 2023.
[86]
A. Karimi, U. Shah and J. Oberhammer, "Sub-THz Silicon-Micromachined Reconfigurable Beam-Steering Frontend," in 2023 53rd European Microwave Conference, EuMC 2023, 2023.
[87]
A. Karimi, U. Shah and J. Oberhammer, "Sub-THz Single-Pole-Single-Thru Microelectromechanical Switch," in Swedish Microwave Days, KTH, Stockholm, 23-25 May 2023, 2023.
[88]
N. Xenidis et al., "Waveguide Measurements of Highly Anisotropic Graphene Augmented Inorganic Nanofibers," in 2023 53rd European Microwave Conference, EuMC 2023, 2023, pp. 576-579.
[89]
O. Glubokov et al., "Compact W-band Silicon-Micromachined Filters with Increased Fabrication Robustness," in 2022 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS 2022), 2022, pp. 329-332.
[90]
A. Karimi and J. Oberhammer, "Design of an Amplitude-Tapered Corporate-Feed Slot Array Antenna with Reduced Side-Lobe Level for Silicon Micromachining," in 2022 16TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP), 2022.
[91]
S. Smirnov et al., "Generation of High-order Modes in Sub-THz Dielectric Waveguides by Misalignment of the Transition Structure," in 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, 2022, pp. 479-482.
[92]
M. Reza Seidi Goldar, J. Hassanpour and J. Oberhammer, "Concept analysis of a frequency-sweeping delta/sigma beam-switching radar using machine learning," in 2021 18Th European Radar Conference (EURAD), 2021, pp. 145-148.
[93]
O. Glubokov et al., "Micromachined Bandpass Filters with Enhanced Stopband Performance and Q-factor of 950 at 700 GHz," in Proceedings IEEE MTT-S International Microwave Symposium Digest, 2021, pp. 204-206.
[94]
A. Przewłoka et al., "Single-walled carbon nanotube phase shifters for low THz frequencies," in The 11th International Conference on Metamaterials, Photonic Crystals and Plasmonics, META 2021, 2021, pp. 1058-1059.
[95]
J. Campion et al., "Ultra-wideband waveguide embedded graphene-based THz absorber," in The 11th International Conference on Metamaterials, Photonic Crystals and Plasmonics, META 2021, 2021, pp. 926-927.
[96]
P. Drozdz et al., "W-band waveguide embedded nanofiber absorber," in 2021 46Th International Conference On Infrared, Millimeter And Terahertz Waves (IRMMW-THZ), 2021.
[97]
A. Gomez-Torrent, U. Shah and J. Oberhammer, "Silicon Micromachined Receiver Calibration Waveguide Switch for THz Frequencies," in International Symposium on Space Terahertz Technology (ISSTT),Gothenburg, Sweden, April 15-17, 2019, 2020.
[98]
X. Zhao, O. Glubokov and J. Oberhammer, "Silicon-on-Insulator based Micromachining Technology for Sub-Terahertz Waveguide Devices," in 2020 IEEE Asia-pacific Microwave Conference (APMC), 2020, pp. 920-922.
[99]
Y. Li et al., "D-band SiGe transceiver modules based on silicon-micromachined integration," in Asia-Pacific Microwave Conference Proceedings, APMC, 2019, pp. 883-885.
[100]
S. Smirnov et al., "Dielectric Rod Antenna Array for Photonic-Based Sub-Terahertz Beamforming," in International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2019.
[101]
Z. Xinghai et al., "Highly compact silicon micromachined filter with axial ports at sub-terahertz band," in Asia-Pacific Microwave Conference Proceedings, APMC, 2019, pp. 768-770.
[102]
D. Dancila et al., "Leaky Wave Antenna at 300 GHz in Silicon Micromachined Waveguide Technology," in 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2019.
[103]
J. Oberhammer, "Overview and recent achievements in silicon micromachining for THz systems," in Proceedings of European Microwave Conference in Central Europe, EuMCE 2019, 2019, pp. 23-26.
[104]
A. Morales et al., "Photonic-Based Beamforming System for Sub-THz Wireless Communications," in 2019 European Microwave Conference in Central Europe (EuMCE), Prague, Czech Republic, May 13-15 2019, 2019, pp. 253-256.
[105]
J. Campion, U. Shah and J. Oberhammer, "Silicon-Micromachined Waveguide Calibration Shims for Terahertz Frequencies," in Proceedings 2019 IEEE MTT-S International Microwave Symposium (IMS), 2019.
[106]
U. Shah, A. Gomez Torrent and J. Oberhammer, "Ultra-Compact Micromachined Beam-Steering Antenna Front-End for High-Resolution Sub-Terahertz Radar," in 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2019.
[107]
W. Kuramoto et al., "Wideband Design of a 350GHz-band Corporate-feed Waveguide Slot Array Antenna using Gold-coating Silicon Wafers with Different Thickness," in 2019 International Symposium on Antennas and Propagation, ISAP 2019 - Proceedings, 2019.
[108]
Z. S. He et al., "A 140 GHz Transmitter with an Integrated Chip-to-Waveguide Transition using 130nm SiGe BiCMOS Process," in 2018 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC), 2018, pp. 28-30.
[109]
A. Gomez-Torrent, U. Shah and J. Oberhammer, "A Silicon Micromachined 220-330 GHz Turnstile Orthomode Transducer (OMT) in a Low-Loss Micromachining Fabrication Platform," in The 8th ESA Workshop on Millimetre-Wave Technology and Applications, 10-12 December 2018, ESA/ESTEC, Noordwijk, The Netherlands, 2018.
[110]
U. Shah and J. Oberhammer, "A Very High Isolation (>50 dB) and Low Insertion Loss (<0.55 dB) 140-220 GHz MEMSWaveguide Switch," in The 8th ESA Workshop on Millimetre-Wave Technology and Applications, 2018.
[111]
A. Gomez-Torrent, U. Shah and J. Oberhammer, "Advanced Millimetre-Wave Waveguide Components Enabled by Silicon Micromachining," in Swedish Microwave Days, 2018.
[112]
J. Campion et al., "An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications," in 2018 IEEE/MTT-S International Microwave Symposium, 2018, pp. 583-586.
[113]
S. Smirnov et al., "Carbon Nanotube Layer Modeling for Computer Simulation of Optically Controlled Phase Shifters," in 2018 48th European Microwave Conference (EuMC), 2018, pp. 827-830.
[114]
B. Beuerle et al., "Low-Loss Silicon Micromachined Waveguides Above 100 GHz Utilising Multiple H-plane Splits," in Proceedings of the 48th European Microwave Conference, Madrid, October 1-3, 2018, 2018, pp. 1041-1044.
[115]
A. Krivovitca et al., "Micromachined Silicon-core Substrate-integrated Waveguides with Coplanar-probe Transitions at 220-330 GHz," in Transmission-line structures : Advances in Millimeter-Wave Integrated Waveguide Components and Transitions, 2018, pp. 190-193.
[116]
J. Oberhammer, "Micromachined THz Systems - enabling the large-scale exploitation of the THz frequency spectrum," in 2018 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC), 2018, pp. 25-27.
[117]
B. Beuerle, U. Shah and J. Oberhammer, "Micromachined Waveguides with Integrated Silicon Absorbers and Attenuators at 220–325 GHz," in IEEE MTT-S International Microwave Symposium, IEEE conference proceedings, 2018, 2018.
[118]
D. Lyubchenko et al., "Millimeter Wave Beam Steering Based on Optically Controlled Carbon Nanotube Layers," in 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2018.
[119]
S. Smirnov et al., "Millimeter Wave Phase Shifter Based on Optically Controlled Carbon Nanotube Layers," in 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2018.
[120]
O. Glubokov et al., "Multilayer Micromachined Dual-Mode Elliptic Cavities Filter With Axial Feeding at 270 GHz," in 14th GigaHertz Symposium (Swedish Microwave Days), Lund, Sweden, 24-25 May 2018, 2018.
[121]
J. Oberhammer, "THz MEMS - Micromachining enabling new solutions at millimeter and submillimeter-wave frequencies (invited paper)," in Asia-Pacific Microwave Conference Proceedings, APMC, 2018, pp. 81-84.
[122]
A. Gomez-Torrent, U. Shah and J. Oberhammer, "Wideband 220 – 330 GHz Turnstile OMT Enabled by Silicon Micromachining," in 2018 IEEE MTT-S International Microwave Symposium (IMS), 2018, pp. 1511-1514.
[123]
R. Malmqvist et al., "A 220-325 GHz Low-Loss Micromachined Waveguide Power Divider," in Proceedings of the 2017 Asia-Pacific Microwave Conference (APMC), 2017, pp. 291-294.
[124]
J. Svedin et al., "A 230-300 GHz Low-Loss Micromachined Waveguide Hybrid Coupler," in Proceedings of the 47th European Microwave Conference,, 2017, pp. 616-619.
[125]
A. Hassona et al., "A non-galvanic D-band MMIC-to-waveguide transition using eWLB packaging technology," in 2017 IEEE MTT-S International Microwave Symposium (IMS), 2017, pp. 510-512.
[126]
J. Campion, U. Shah and J. Oberhammer, "Elliptical alignment holes enabling accurate direct assembly of micro-chips to standard waveguide flanges at sub-THz frequencies," in 2017 IEEE MTT-S International Microwave Symposium (IMS), 2017, pp. 1262-1265.
[127]
B. Beuerle et al., "Integrated Micromachined Waveguide Absorbers at 220 – 325 GHz," in Proceedings of the 47th European Microwave Conference, Nuremberg, October 8-13, 2017, 2017, pp. 695-698.
[128]
D. Dancila et al., "Micromachined Cavity Resonator Sensors for on Chip Material Characterisation in the 220–330 GHz band," in Proceedings of the 47th European Microwave Conference, Nuremberg, October 8-13, 2017, 2017, pp. 938-941.
[129]
O. Glubokov et al., "Micromachined Multilayer Bandpass Filter at 270 GHz Using Dual-Mode Circular Cavities," in 2017 IEEE MTT-S International Microwave Symposium, 2017, pp. 1449-1452.
[130]
P. B. Makhalov, D. Lioubtchenko and J. Oberhammer, "Simulations of a semiconductor/metal-grating slow-wave amplifier for sub-THz range," in 2017 42nd International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2017.
[131]
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N. Somjit, G. Stemme and J. Oberhammer, "Novel Low-loss 4.25-Bit All-Silicon Millimeter-Wave MEMS Phase Shifters for High-Performance W-Band Applications," in The 8th Micronano System Workshop. Stockholm, SWE. 04 May 2010 - 05 May 2010, 2010.
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N. Somjit, G. Stemme and J. Oberhammer, "Novel concept of microwave mems reconfigurable 7X45o multi-stage dielectric-block phase shifter," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, 2009, pp. 15-18.
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N. Somjit, G. Stemme and J. Oberhammer, "Phase Error and Nonlinearity Investigation of Millimeter-Wave MEMS 7-Stage Dielectric-Block Phase Shifters," in 2009 European microwave conference : Vols 1-3, 2009, pp. 1872-1875.
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N. Somjit, G. Stemme and J. Oberhammer, "Phase Error and Nonlinearity Investigation of Millimeter-Wave MEMS 7-Stage Dielectric-Block Phase Shifters," in 2009 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC 2009), 2009, pp. 519-522.
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F. Ke, J. Miao and J. Oberhammer, "Ruthenium/Gold hard-surface/low-resistivity contact metallization for polymer-encapsulated microswitch with stress-reduced corrugated SIN/SIO2 diaphragm," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, 2009, pp. 860-863.
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M. Sterner, G. Stemme and J. Oberhammer, "Wafer counter-bonding for integrating CTE-mismatched substrates and its application to MEMS tuneable metamaterials," in TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, 2009, pp. 1722-1725.
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N. Somjit, G. Stemme and J. Oberhammer, "Reconfigurable Three-Dimensional Micromachined Dielectric-Loaded CPW Phase-Shifter," in 9th International Symposium on RF MEMS and RF Microsystems. Heraklion, Greece. 1-3 July 2008, 2008.
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J. Oberhammer and G. Stemme, "Passive contact force and active opening force electrostatic switches for soft metal contact materials," in MEMS 2006 : 19th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest, 2006, pp. 162-165.
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M. Mowlér et al., "A 2-bit reconfigurable meander slot antenna with RF-MEMS switches," in Antennas and Propagation Society International Symposium, 2005 IEEE : volym 2A, 2005, pp. 396-399.
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J. Oberhammer, A. Q. Liu and G. Stemme, "Numerical algorithm for quasi-static nonlinear simulation of touch-mode actuators with complex geometries and pre-stressed materials," in Transducers '05, Digest of Technical Papers, Vols 1 and 2, 2005, pp. 2119-2122.
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J. Oberhammer and G. Stemme, "Contact printing for improved bond-strength of patterned adhesive full-wafer bonded 0-level packages," in MEMS 2004 : 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2004, pp. 713-716.
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J. Oberhammer and G. Stemme, "S-shaped film actuator for low-voltage high-isolation mems metal contact switches," in MEMS 2004: 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2004, pp. 637-640.
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J. Oberhammer and G. Stemme, "Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages," in BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS : VOLS 1 AND 2, 2003, pp. 1832-1835.
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J. Oberhammer, B. Lindmark and G. Stemme, "RF characterization of low-voltage high-isolation MEMS series switch based on a S-shaped film actuator," in PROCEEDINGS OF THE INTERNATIONAL 2003 SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE - IMOC 2003 : VOLS I AND II, 2003, pp. 537-540.
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J. Oberhammer, F. Niklaus and G. Stemme, "Sealing of Adhesive Bonded Devices on Wafer Level," in Proc. Eurosensors XVI, 2002, pp. 298-299.
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J. Oberhammer, F. Niklaus and G. Stemme, "Selective Wafer Level Adhesive Bonding with Benzocyclobutene," in Proc. Micromechanics Europe MME 2001, 2001, pp. 54-57.

Kapitel i böcker

[218]
R. Malmqvist et al., "Reconfigurable RF Circuits and RF-MEMS," in Microwave and Millimeter Wave Circuits and Systems : Emerging Design, Technologies, and Applications, : John Wiley & Sons, 2012, pp. 325-356.
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N. Somjit, G. Stemme and J. Oberhammer, "Reconfigurable Three-Dimensional Micromachined Dielectric-Loaded CPW Phase Shifter," in Series in Micro and Nanoengineering : New developments in micro electro mechanical systems for radio frequency and millimeter wave applications, George Konstantinidis, Alexandru Müller, Dan Dascălu, Robert Plana Ed., 15th ed. : Publishing House of the Romanian Academy, 2009, pp. 163-167.

Icke refereegranskade

Konferensbidrag

[220]
D. Dancila et al., "Leaky Wave Antenna at 300 GHz in KTH’s Micromachined Waveguide Technology," in AntennEMB Symposium 2018, 2018.
[221]
J. Campion et al., "Low-Loss Hollow and Silicon-Core Micromachined Waveguide Technologies Above 100 GHz," in GigaHertz Symposium 2018, Swedish Microwave Days 24-25 June, Lund, Sweden, 2018.
[222]
J. Oberhammer et al., "3D silicon micromachining – an enabling technology for high-performance millimeter and submillimeter-wave frequencies reconfigurable satellite front-ends," in 38th ESA Antenna Workshop on Innovative Antenna Systems and Technologies for Future Space Missions, 3-6 October 2017 Noordwijk, The Netherlands, 2017.
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F. Töpfer, S. Dudorov and J. Oberhammer, "Characterization of high-resolution millimeter-wave measurement probe for skin tissue analysis," in 13th International Symposium on RF-MEMS and RF-Microsystems (MEMSWAVE 2012), 2012.
[224]
F. Töpfer et al., "High-resolution microwave skin cancer diagnostic tool based on micromachined interface," in Micronano System Workshop (MSW) 2012, 2012.
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U. Shah, M. Sterner and J. Oberhammer, "RF MEMS RECONFIGURABLE FILTERS BASED ON MOVABLE SIDEWALLS OF A 3D MICROMACHINED TRANSMISSION LINE," in GigaHertz Symposium 2012, 2012.
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U. Shah, M. Sterner and J. Oberhammer, "TUNEABLE DIRECTIONAL COUPLERS IN 3D MICROMACHINEDTRANSMISSION LINE FOR ULTRA-WIDEBAND APPLICATIONS," in GigaHertz Symposium 2012, 2012.
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J. Oberhammer et al., "Microwave MEMS Activities at KTH- Royal Institute of Technology," in 8th Micronano System Workshop 2010 (MSW 2010). Stockholm, Sweden. May 4-5, 2010, 2010.
[230]
M. Sterner, G. Stemme and J. Oberhammer, "Nanometer-scale flatness and reliability investigation of stress-compensated symmetrically-metallized monocrystalline-silicon multi-layer membranes," in 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010, pp. 959-962.
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M. Sterner et al., "RF MEMS Tuneable High-Impedance Metamaterial Surfaces for Millimeter-Wave Applications," in Proc. Micro Structure Workshop 2010, 2010.
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M. Sterner et al., "Reliability investigation of stress-compensated metal-coated monocrystalline-silicon membranes for MEMS tuneable high-impedance surfaces," in 11th International Symposium on RF MEMS and RF Microsystems. Otranto, Italy. June 29 - July 1 2010, 2010.
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D. Chicherin et al., "MEMS tunable metamaterials for beam steering millimeter wave applications," in NATO-Advanced Research Workshop : Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators, 2009.
[234]
S. Braun, J. Oberhammer and G. Stemme, "MEMS crossbar switches for telecommunication networks," in Micro System Workshop 08, 2008.
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D. Bhattacharyya et al., "Material aspects for batch integration of PZT thin films using transfer bonding technologies : Q2M development," in Proc. 4M 2008 Conference on Multi-Material Micro Manufacture, 2008.
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S. Braun, J. Oberhammer and G. Stemme, "Smart individual switch addressing of 5×5 and 20×20 MEMS double-switch arrays," in TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, 2007, pp. 153-156.
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M. Mowler et al., "A 2-bit Reconfigurable Meander Slot Antenna with High-Displacement Low-Voltage RF MEMS Switches," in Proc. MEMSWave – Workshop on MEMS for Millimeterwave Communication 2004, 2004, pp. D20-D24.
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A. Thorsén et al., "Summit RF MEMS packaging," in Fifth Micro Structure Workshop (MSW 2004), 2004.
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F. Niklaus, J. Oberhammer and G. Stemme, "Adhesive Wafer Bonding for Packaging Applications," in Workshop on MEMS Sensor Packaging 2003; Copenhagen, Denmark, 20-21 March 2003, 2003.

Kapitel i böcker

[240]
F. Töpfer and J. Oberhammer, "Microwave cancer diagnosis," in Principles and Applications of RF/Microwave in Healthcare and Biosensing, : Elsevier Inc., 2016, pp. 103-149.
[241]
J. Oberhammer et al., "RF MEMS for automotive radar," in Handbook of Mems for Wireless and Mobile Applications, : Elsevier, 2013, pp. 518-549.
[242]
J. Oberhammer et al., "RF MEMS for automotive radar sensors," in Mems for Automotive and Aerospace Applications, : Elsevier, 2013, pp. 106-136.
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J. Oberhammer et al., "RF MEMS for Automotive and Radar Applications : MEMS for Automotive and Radar Applications," in MEMS for Automotive and Radar Applications : RF MEMS for Automotive and Radar Applications, : Woodhead Publishing Limited, 2012.

Avhandlingar

[244]
J. Oberhammer, "Novel RF MEMS Switch and Packaging Concepts," Doctoral thesis Stockholm : KTH, Trita-ILA, 0401, 2004.

Övriga

[251]
Z. Baghchehsaraei and J. Oberhammer, "MEMS-reconfigurable irises for millimeter-wave waveguide components," (Manuscript).
[256]

Patent

Patent

[259]
J. Oberhammer and G. Stemme, "Film Actuator Based Mems Device and Method," US 20070256917A1, 2004.
[260]
F. Niklaus, G. Stemme and J. Oberhammer, "Method for sealing a microcavity and package comprising at least one microcavity," EP 1540727 (2010-10-20), 2002.
Senaste synkning med DiVA:
2024-04-18 00:02:58