Publikationer av Bhanu Singh
Refereegranskade
Konferensbidrag
[1]
B. P. Singh et al., "Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test," i 2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC, 2023.
[2]
B. P. Singh et al., "Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios," i 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, 2023.
[3]
B. P. Singh et al., "Change in SiC MOSFET body-diode voltage drop in TO-247 packages during inverse-mode and forward-mode power cycling test," i ETG-Fachbericht, 2022, s. 423-428.
Senaste synkning med DiVA:
2024-04-28 01:48:00