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Publications by Niclas Roxhed

Refereegranskade

Artiklar

[1]
T. Last, G. Stemme and N. Roxhed, "3D-Printing Enables Fabrication of Swirl Nozzles for Fast Aerosolization of Water-Based Drugs," Journal of microelectromechanical systems, vol. 30, no. 2, pp. 181-183, 2021.
[2]
E. Caffarel-Salvador et al., "A microneedle platform for buccal macromolecule delivery," Science Advances, vol. 7, no. 4, 2021.
[3]
[4]
T. Last, G. Stemme and N. Roxhed, "A Self-Sealing Spray Nozzle for Aerosol Drug Delivery," Journal of microelectromechanical systems, vol. 29, no. 2, pp. 182-189, 2020.
[5]
F. Marques, W. van der Wijngaart and N. Roxhed, "A loop‐shaped minimally invasive brush for improved cytology sampling of pancreatic cysts during EUS‐FNA," Medical Devices & Sensors, 2020.
[6]
J. Hauser et al., "A microfluidic device for TEM sample preparation," Lab on a Chip, vol. 20, no. 22, pp. 4186-4193, 2020.
[8]
F. Ribet et al., "Vertical integration of microchips by magnetic assembly and edge wire bonding," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.
[9]
M. Verma et al., "A gastric resident drug delivery system for prolonged gram-level dosing of tuberculosis treatment," Science Translational Medicine, vol. 11, no. 483, 2019.
[10]
A. Abramson et al., "A luminal unfolding microneedle injector for oral delivery of macromolecules," Nature Medicine, vol. 25, no. 10, pp. 1512-+, 2019.
[11]
J. Hauser et al., "An Autonomous Microfluidic Device for Generating Volume-Defined Dried Plasma Spots," Analytical Chemistry, vol. 91, no. 11, pp. 7125-7130, 2019.
[12]
A. Abramson et al., "An ingestible self-orienting system for oral delivery of macromolecules," Science, vol. 363, no. 6427, pp. 611-+, 2019.
[14]
X. Wang et al., "Transfer printing of nanomaterials and microstructures using a wire bonder," Journal of Micromechanics and Microengineering, vol. 29, no. 12, 2019.
[15]
X. Wang et al., "Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages," Journal of microelectromechanical systems, vol. 28, no. 3, pp. 460-471, 2019.
[16]
M. Parrilla et al., "Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection," Analytical Chemistry, vol. 91, no. 2, pp. 1578-1586, 2019.
[18]
H. K. Gatty, G. Stemme and N. Roxhed, "A Miniaturized Amperometric Hydrogen Sulfide Sensor Applicable for Bad Breath Monitoring," Micromachines, vol. 9, no. 12, 2018.
[19]
F. Ribet et al., "Gas diffusion and evaporation control using EWOD actuation of ionic liquid microdroplets for gas sensing applications," Sensors and actuators. B, Chemical, vol. 267, pp. 647-654, 2018.
[20]
J. Hauser et al., "High-Yield Passive Plasma Filtration from Human Finger Prick Blood," Analytical Chemistry, vol. 90, no. 22, pp. 13393-13399, 2018.
[21]
F. Ribet, G. Stemme and N. Roxhed, "Real-time intradermal continuous glucose monitoring using a minimally invasive microneedle-based system," Biomedical microdevices (Print), vol. 20, no. 4, 2018.
[22]
P. Nadeau et al., "Prolonged energy harvesting for ingestible devices," Nature Biomedical Engineering, vol. 1, no. 3, 2017.
[23]
F. Ribet, G. N. Stemme and N. Roxhed, "Ultra-miniaturization of a planar amperometric sensor targeting continuous intradermal glucose monitoring," Biosensors & bioelectronics, vol. 90, pp. 577-583, 2017.
[26]
H. K. Gatty, G. Stemme and N. Roxhed, "A wafer-level liquid cavity integrated amperometric gas sensor with ppb-level nitric oxide gas sensitivity," Journal of Micromechanics and Microengineering, vol. 25, no. 10, 2015.
[27]
H. K. Gatty et al., "An amperometric nitric oxide sensor with fast response and ppb-level concentration detection relevant to asthma monitoring," Sensors and actuators. B, Chemical, vol. 209, pp. 639-644, 2015.
[28]
F. Forsberg et al., "CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration," IEEE Journal of Selected Topics in Quantum Electronics, vol. 21, no. 4, pp. 1-11, 2015.
[29]
S. J. Bleiker et al., "High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, pp. 21-27, 2015.
[30]
A. C. Fischer et al., "Integrating MEMS and ICs," Microsystems & Nanoengineering, vol. 1, no. 1, pp. 1-16, 2015.
[32]
G. Lenk et al., "The effect of drying on the homogeneity of DBS," Bioanalysis, vol. 7, no. 16, pp. 1977-1985, 2015.
[33]
S. Johansson, G. Stemme and N. Roxhed, "A MEMS-based passive air flow regulator for handheld breath diagnostics," Sensors and Actuators A-Physical, vol. 215, pp. 65-70, 2014.
[34]
S. B. Johansson et al., "A MEMS-based passive hydrocephalus shunt for body position controlled intracranial pressure regulation," Biomedical microdevices (Print), vol. 16, no. 4, pp. 529-536, 2014.
[35]
M. Hultström, N. Roxhed and L. Nordquist, "Intradermal insulin delivery : A promising future for diabetes management," Journal of Diabetes Science and Technology, vol. 8, no. 3, pp. 453-457, 2014.
[36]
[37]
H. K. Gatty et al., "Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive," ECS Journal of Solid State Science and Technology, vol. 3, no. 5, pp. P115-P121, 2014.
[38]
F. Forsberg et al., "A Comparative study of the bonding energy in adhesive wafer bonding," Journal of Micromechanics and Microengineering, vol. 23, no. 8, pp. 1-7, 2013.
[39]
F. Forsberg et al., "Heterogeneous 3D integration of 17 mu m pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems," Journal of Micromechanics and Microengineering, vol. 23, no. 4, pp. 045017, 2013.
[40]
G. Pardon et al., "Pt-Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanopores," Nanotechnology, vol. 24, no. 1, pp. 015602, 2013.
[41]
A. C. Fischer et al., "Unconventional applications of wire bonding create opportunities for microsystem integration," Journal of Micromechanics and Microengineering, vol. 23, no. 8, pp. 083001, 2013.
[43]
M. Antelius et al., "Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps," Journal of microelectromechanical systems, vol. 22, no. 6, pp. 1347-1353, 2013.
[44]
F. Forsberg et al., "Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes," Journal of microelectromechanical systems, vol. 21, no. 5, pp. 1077-1083, 2012.
[45]
M. Antelius et al., "Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level," Journal of Micromechanics and Microengineering, vol. 22, no. 4, pp. 045021, 2012.
[46]
A. C. Fischer et al., "Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires," Journal of Micromechanics and Microengineering, vol. 22, no. 10, pp. 105001, 2012.
[48]
A. C. Fischer et al., "Wire-bonded through-silicon vias with low capacitive substrate coupling," Journal of Micromechanics and Microengineering, vol. 21, no. 8, pp. 085035, 2011.
[49]
M. Sterner et al., "Static Zero-Power-Consumption Coplanar Waveguide Embedded DC-to-RF Metal-Contact MEMS Switches in Two-Port and Three-Port Configuration," IEEE Transactions on Electron Devices, vol. 57, no. 7, pp. 1659-1669, 2010.
[51]
N. Roxhed, P. Griss and G. Stemme, "Membrane-sealed Hollow Microneedles and Related Administration Schemes for Transdermal Drug Delivery," Biomedical microdevices (Print), vol. 10, no. 2, pp. 271-279, 2008.
[52]
N. Roxhed et al., "Painless Drug Delivery through Microneedle-based Transdermal Patches featuring Active Infusion," IEEE Transactions on Biomedical Engineering, vol. 55, no. 3, pp. 1063-1071, 2008.
[53]
N. Roxhed, P. Griss and G. Stemme, "A Method for Tapered Deep Reactive Ion Etching using a Modified Bosch Process," Journal of Micromechanics and Microengineering, vol. 17, no. 5, pp. 1087-1092, 2007.
[55]
N. Roxhed et al., "Penetration-enhanced ultrasharp microneedles and prediction on skin interaction for efficient transdermal drug delivery," Journal of microelectromechanical systems, vol. 16, no. 6, pp. 1429-1440, 2007.
[56]
N. Roxhed et al., "A Compact, Low-cost Microliter-range Liquid Dispenser based on Expandable Microspheres," Journal of Micromechanics and Microengineering, vol. 16, no. 12, pp. 2740-2746, 2006.
[57]
J. Melin et al., "A fast passive and planar liquid sample micromixer," Lab on a Chip, vol. 4, no. 3, pp. 214-219, 2004.
[58]
J. Melin et al., "A liquid-triggered liquid microvalve for on-chip flow control," Sensors and actuators. B, Chemical, vol. 100, no. 3, pp. 463-468, 2004.

Konferensbidrag

[59]
M. Sandell et al., "An Ultraminiaturized MEMS Microbiopsy Tool for Trans Blood Vessel Wall Biopsies," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2020, pp. 10-12.
[60]
A. Quellmalz et al., "Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding," in 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems, 2020.
[61]
J. Hauser, G. Stemme and N. Roxhed, "A blood hematocrit test strip," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 426-428.
[62]
T. Last, G. Stemme and N. Roxhed, "Demonstration of the First Self-Sealing Aerosol Spray Nozzle for Medical Drug Delivery," in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 53-56.
[63]
A. Quellmalz et al., "Wafer-Scale Transfer of Graphene by Adhesive Wafer Bonding," in 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS), 2019, pp. 257-259.
[64]
F. Ribet et al., "Zero-Loss Optical Switch Based on Ionic Liquid Microdroplet Ewod Actuation," in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, 2019, pp. 2290-2293.
[65]
J. Hauser, G. Stemme and N. Roxhed, "An autonomous blood microsampling device enabling metered large-volume dried plasma spots (DPS)," in 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2018, 2018, pp. 1737-1739.
[66]
F. Ribet et al., "Ionic liquid microdroplet manipulation by electrowetting-on-dielectric for on/off diffusion control," in 2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, pp. 1181-1184.
[67]
F. Ribet, G. Stemme and N. Roxhed, "Microneedle-based system for minimally invasive continuous monitoring of glucose in the dermal interstitial fluid," in 2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, pp. 408-411.
[68]
S. Schröder et al., "A low-cost nitric oxide gas sensor based on bonded gold wires," in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, pp. 1457-1460.
[69]
X. Wang, G. Stemme and N. Roxhed, "High aspect ratio silicon field emitter arrays (FEAs) as miniaturized stable electron source for catheter-based radiotherapy," in Proceedings of IEEE 30th International Conference on Micro Electro Mechanical Systems, 2017.
[70]
G. Lenk et al., "Capillary driven and volume-metred blood-plasma separation," in Proceedings 18 th IEEE Transducers, 2015, pp. 335-338.
[71]
G. Lenk, G. Stemme and N. Roxhed, "Dry reagent storage in dissolvable films and liquid triggered release for programmed multi-step lab-on-chip diagnostics," in 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2015, pp. 451-454.
[72]
F. Forsberg et al., "Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation," in 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2015), 2015, pp. 280-283.
[73]
G. Lenk et al., "A Disposable Chip for the Collection of Quantitative Dried Blood Spot Samples," in MSW 2014,15-16 May, Uppsala, Sweden, 2014.
[74]
S. B. Johansson, G. Stemme and N. Roxhed, "A novel constant flow regulation principle for compact breath diagnostics," in 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, pp. 935-938.
[75]
G. A. Lenk, G. Stemme and N. Roxhed, "Delay valving in capillary driven devices based on dissolvable thin films," in 18th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2014, 2014, pp. 216-218.
[76]
G. Lenk et al., "A Disposable Chip Enabling Metering In Dried Blood Spot Sampling," in Micro TAS 2013, 2013, pp. 281-283.
[77]
S. Johansson et al., "A MEMS-based passive hydrocephalus shunt with adaptive flow characteristics," in Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), Barcelona, 2013, 2013.
[78]
S. B. Johansson, G. Stemme and N. Roxhed, "A compact passive air flow regulator for portable breath diagnostics," in Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, pp. 157-160.
[79]
H. K. Gatty et al., "A ppb level, miniaturized fast response amperometric nitric oxide sensor for asthma diagnostics," in Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, pp. 1001-1004.
[80]
G. Lenk et al., "Disposable Chip to Enable Metering in Dried Blood Spot Sampling," in Medicinteknikdagarna, 2013.
[81]
F. Forsberg et al., "Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration," in Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, pp. 342-346.
[82]
H. K. Gatty et al., "Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration," in Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, pp. 381-384.
[83]
F. Niklaus et al., "Wafer-level heterogeneous 3D integration for MEMS and NEMS," in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, 2012, pp. 247-252.
[84]
A. C. Fischer et al., "high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 2012, pp. 541-547.
[85]
A. C. Fischer et al., "Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires," in Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, 2011, pp. 37-40.
[86]
F. Forsberg et al., "HETEROGENEOUS INTEGRATION TECHNOLOGY FOR COMBINATION OF DIFFERENT WAFER SIZES USING AN EXPANDABLE HANDLE SUBSTRATE," in PROC IEEE MICR ELECT : IEEE MICRO ELECTRO MECHANICAL SYSTEMS, 2011, pp. 268-271.
[87]
F. Forsberg et al., "High-Performance Infrared Micro-Bolometer Arrays Manufactured Using Very Large Scale Heterogeneous Integration," in OMN2011 : 16TH INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS, 2011, pp. 9-10.
[88]
P. Ericsson et al., "Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays," in Infrared Technology and Applications XXXVII : Proc. of SPIE, Vol. 8012, 2011, pp. 801216-1-801216-9.
[89]
A. C. Fischer et al., "Heterogeneous Integration for Optical MEMS," in 2010 23RD ANNUAL MEETING OF THE IEEE PHOTONICS SOCIETY, 2010, pp. 487-488.
[90]
A. C. Fischer et al., "Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling," in MEMS 2010 : 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, pp. 480-483.
[91]
A. C. Fischer et al., "Low-cost Through Silicon Vias (Tsvs) with wire-bonded metal cores and low capacitive substratecoupling :  ," in Proceedings : 8th Micronano System Technology Event (MSW 2010), 2010, pp. 30-30.
[92]
N. Roxhed et al., "Low-cost uncooled microbolometers for thermal imaging," in OPTICAL SENSING AND DETECTION, 2010, p. 772611.
[93]
N. Roxhed, "Microneedle Fabrication and Challenges on a New Drug Administration Standard," in First International Conference on Microneedles. Atlanta. May 23-25, 2010, 2010.
[94]
A. C. Fischer et al., "Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures," in MEMS 2010 : (MEMS), 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems, 2010, pp. 472-475.
[96]
N. Roxhed and F. Niklaus, "Adhesive Wafer Bonding and Applications," in Proceedings of Waferbond'09, 2009, pp. 53-56.
[97]
F. Forsberg et al., "High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers," in TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, 2009, pp. 2214-2217.
[98]
M. Sterner et al., "Maskless selective electrochemically assisted wet etching of metal layers for 3D micromachined SOI RF MEMS devices," in MEMS 2008 : 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2008, pp. 383-386.
[99]
M. Sterner et al., "Coplanar-waveguide embedded mechanically-bistable DC-to-RF MEMS switches," in 2007 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST : VOLS 1-6, 2007, pp. 359-362.
[100]
M. Sterner et al., "Deep-reactive-ion-etched 3D transmission lines with integrated mechanically multi-stable SPST and SPDT RF MEMS switches," in Proc. International Symposium on RF MEMS and RF Microsystems MEMSWAVE 2007, 2007.
[101]
T. Frisk, N. Roxhed and G. Stemme, "MEMS for medical technology applications," in MEMS Adaptive Optics, 2007, pp. 46513-46513.
[102]
M. Sterner et al., "Mechanically bi-stable in-plane switch with dual-stiffness actuators," in TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS : VOLS 1 AND 2, 2007, pp. U709-U710.
[103]
M. Sterner et al., "Mechanically tri-stable SPDT metal-contact MEMS switch embedded in 3D transmission line," in Proceedings of the 37th European Microwave Conference, EUMC, 2007, pp. 1225-1228.
[104]
M. Stemer et al., "Mechanically tri-stable SPDT metal-contact MEMS switch embedded in 3D transmission line," in European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, 2007, pp. 153-156.
[105]
N. Roxhed, P. Griss and G. Stemme, "Tapered deep reactive ion etching : Method and characterization," in TRANSDUCERS '07 & EUROSENSORS XXI : DIGEST OF TECHNICAL PAPERS, 2007, pp. 251-252.
[106]
N. Roxhed et al., "Compact seamless integration of active dosing and actuation with microneedles for transdermal drug delivery," in MEMS 2006 : 19th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest , 2006, pp. 414-417.
[107]
N. Roxhed, P. Griss and G. Stemme, "Generic leak-free drug storage and delivery for microneedle-based systems," in MEMS 2005 Miami : Technical Digest, 2005, pp. 742-745.
[108]
S. Balslev et al., "Microfluidic dye laser with compact, low-cost liquid dye dispenser," in Micro Total Analysis Systems 2004, 2005, pp. 375-377.
[109]
N. Roxhed et al., "LOW COST DEVICE FOR PRECISE MICROLITER RANGE LIQUID DISPENSIN," in 17th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2004), 2004, pp. 326-329.
[110]
N. Roxhed et al., "Novel Technology Platforms with Expandable Microspheres," in Proceedings of the 5th Micro Structure Workshop, Ystad, March 30-31, 2004, 2004, pp. 57-60.
[111]
J. Melin et al., "A LIQUID-TRIGGERED LIQUID MICROVALVE," in 12th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2003) : DIGEST OF TECHNICAL PAPERS, VOL 1 AND 2, 2003, pp. 1562-1565.

Icke refereegranskade

Konferensbidrag

[112]
H. K. Gatty et al., "A ppb-level miniaturized amperometric nitric oxide sensor," in Medicinteknikdagarna, Stockholm, Sweden, Oct 2013, 2013.
[113]
H. K. Gatty et al., "Temporary wafer bonding of thin wafers by electrochemically active polymer," in Int.Conf. on Wafer Bonding for Microsystems 3D-and Wafer Level Integration, 2013, pp. 143-144.
[115]
G. B. Malm et al., "Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers," in 2012 MRS Spring Meeting - Symposium L – Group IV Photonics for Sensing and Imaging, 2012.
[116]
M. Antelius et al., "Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level," in Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2011, pp. 356-359.
[117]
M. Antelius et al., "Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps," in Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers), 2011, pp. 1360-1363.
[119]
F. Forsberg et al., "Quantum-Well Silicon-Germanium Bolometers for Low-Cost Infrared Imagers," in Proceedings : MSW2010, 2010.
[120]
N. Roxhed, P. Griss and G. Stemme, "Reliable in-vivo penetration and transdermal injection using ultra-sharp hollow microneedles," in Transducers '05, Digest of Technical Papers, Vols 1 and 2 : Digest of Technical Papers, 2005, pp. 213-216.

Avhandlingar

[121]
N. Roxhed, "A Fully Integrated Microneedle-based Transdermal Drug Delivery System," Doctoral thesis Stockholm : KTH, Trita-EE, 2007:046, 2007.

Patent

Patent

[126]
A. C. Fischer et al., "Method for plugging a hole and a plugged hole," WO 2011073393A3 , 2009.
Senaste synkning med DiVA:
2021-07-25 02:46:07