Publikationer av Göran Stemme
Refereegranskade
Artiklar
[1]
A. Enrico et al., "Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors," Advanced Science, 2024.
[2]
S. Pagliano et al., "3D Printing by Two-Photon Polymerization of Polyimide Objects and Demonstration of a 3D-printed Micro-Hotplate," Advanced Materials Technologies, vol. 8, no. 19, 2023.
[3]
J. Hauser et al., "Microfluidic Device for Patient-Centric Multiplexed Assays with Readout in Centralized Laboratories," Analytical Chemistry, vol. 95, no. 2, s. 1350-1358, 2023.
[4]
F. Ribet et al., "Microneedle Patch for Painless Intradermal Collection of Interstitial Fluid Enabling Multianalyte Measurement of Small Molecules, SARS‐CoV‐2 Antibodies, and Protein Profiling," Advanced Healthcare Materials, vol. 12, no. 13, 2023.
[5]
S. Buchmann et al., "Probabilistic cell seeding and non-autofluorescent 3D-printed structures as scalable approach for multi-level co-culture modeling," Materials Today Bio, vol. 21, s. 100706-100706, 2023.
[6]
T. Last et al., "Scaling toward Diminutive MEMS : Dust-Sized Spray Chips for Aerosolized Drug Delivery to the Lung," Advanced Materials Technologies, vol. 8, no. 7, 2023.
[7]
S. Jain et al., "Sensing of protein and DNA complexes using solid-state nanopores," Biophysical Journal, vol. 122, no. 3S1, 2023.
[8]
P.-H. Huang et al., "Three-dimensional printing of silica glass with sub-micrometer resolution," Nature Communications, vol. 14, no. 1, 2023.
[9]
A. Enrico et al., "Ultrafast and Resist-Free Nanopatterning of 2D Materials by Femtosecond Laser Irradiation," ACS Nano, vol. 17, no. 9, s. 8041-8052, 2023.
[10]
A. Enrico et al., "3D Microvascularized Tissue Models by Laser-Based Cavitation Molding of Collagen," Advanced Materials, vol. 34, no. 11, 2022.
[11]
M. Sandell et al., "Endovascular Device for Endothelial Cell Sampling," Advanced NanoBiomed Research, vol. 2, no. 10, s. 2200023-2200023, 2022.
[12]
S. Pagliano et al., "Micro 3D printing of a functional MEMS accelerometer," MICROSYSTEMS & NANOENGINEERING, vol. 8, no. 1, 2022.
[13]
T. Last et al., "Self-sealing MEMS spray-nozzles to prevent bacterial contamination of portable inhalers for aqueous drug delivery," Biomedical microdevices (Print), vol. 24, no. 3, 2022.
[14]
G. Jo et al., "Wafer-level hermetically sealed silicon photonic MEMS," Photonics Research, vol. 10, no. 2, s. A14-A21, 2022.
[15]
T. Last, G. Stemme och N. Roxhed, "3D-Printing Enables Fabrication of Swirl Nozzles for Fast Aerosolization of Water-Based Drugs," Journal of microelectromechanical systems, vol. 30, no. 2, s. 181-183, 2021.
[16]
S. Schröder et al., "A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system," Microsystems and Nanoengineering, vol. 7, no. 1, 2021.
[17]
A. Quellmalz et al., "Large-area integration of two-dimensional materials and their heterostructures by wafer bonding," Nature Communications, vol. 12, no. 1, 2021.
[18]
T. Last, G. Stemme och N. Roxhed, "A Self-Sealing Spray Nozzle for Aerosol Drug Delivery," Journal of microelectromechanical systems, vol. 29, no. 2, s. 182-189, 2020.
[19]
J. Hauser et al., "A microfluidic device for TEM sample preparation," Lab on a Chip, vol. 20, no. 22, s. 4186-4193, 2020.
[20]
C. Chen et al., "Bactericidal surfaces prepared by femtosecond laser patterning andlayer-by-layer polyelectrolyte coating," Journal of Colloid and Interface Science, vol. 575, s. 286-297, 2020.
[21]
F. Ribet et al., "Vertical integration of microchips by magnetic assembly and edge wire bonding," MICROSYSTEMS & NANOENGINEERING, vol. 6, no. 1, 2020.
[22]
M. Laakso et al., "Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses," Optics Express, vol. 28, no. 2, s. 1394-1408, 2020.
[23]
J. Hauser et al., "An Autonomous Microfluidic Device for Generating Volume-Defined Dried Plasma Spots," Analytical Chemistry, vol. 91, no. 11, s. 7125-7130, 2019.
[24]
G. Lenk et al., "Evaluation of a Volumetric Dried Blood Spot Card Using a Gravimetric Method and a Bioanalytical Method with Capillary Blood from 44 Volunteers," Analytical Chemistry, vol. 91, no. 9, s. 5558-5565, 2019.
[25]
A. Enrico et al., "Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography," ACS Applied Materials and Interfaces, vol. 11, no. 8, s. 8217-8226, 2019.
[26]
X. Wang et al., "Transfer printing of nanomaterials and microstructures using a wire bonder," Journal of Micromechanics and Microengineering, vol. 29, no. 12, 2019.
[27]
X. Wang et al., "Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages," Journal of microelectromechanical systems, vol. 28, no. 3, s. 460-471, 2019.
[28]
F. Ribet et al., "Zero-insertion-loss optical shutter based on electrowetting-on-dielectric actuation of opaque ionic liquid microdroplets," Applied Physics Letters, vol. 115, no. 7, 2019.
[29]
H. K. Gatty, G. Stemme och N. Roxhed, "A Miniaturized Amperometric Hydrogen Sulfide Sensor Applicable for Bad Breath Monitoring," Micromachines, vol. 9, no. 12, 2018.
[30]
F. Ribet et al., "Gas diffusion and evaporation control using EWOD actuation of ionic liquid microdroplets for gas sensing applications," Sensors and actuators. B, Chemical, vol. 267, s. 647-654, 2018.
[31]
J. Hauser et al., "High-Yield Passive Plasma Filtration from Human Finger Prick Blood," Analytical Chemistry, vol. 90, no. 22, s. 13393-13399, 2018.
[32]
V. J. Dubois et al., "Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices," Nature Communications, vol. 9, 2018.
[33]
F. Ribet, G. Stemme och N. Roxhed, "Real-time intradermal continuous glucose monitoring using a minimally invasive microneedle-based system," Biomedical microdevices (Print), vol. 20, no. 4, 2018.
[34]
V. J. Dubois et al., "Scalable Manufacturing of Nanogaps," Advanced Materials, vol. 30, no. 46, 2018.
[35]
M. J. Laakso et al., "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires," IEEE Access, vol. 6, s. 44306-44317, 2018.
[36]
S. J. Bleiker et al., "Adhesive wafer bonding with ultra-thin intermediate polymer layers," Sensors and Actuators A-Physical, vol. 260, s. 16-23, 2017.
[37]
V. J. Dubois, F. Niklaus och G. Stemme, "Design and fabrication of crack-junctions," MICROSYSTEMS & NANOENGINEERING, vol. 3, 2017.
[38]
M. Asiatici et al., "Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications," Journal of microelectromechanical systems, vol. 26, no. 1, s. 158-168, 2017.
[39]
F. Ribet, G. N. Stemme och N. Roxhed, "Ultra-miniaturization of a planar amperometric sensor targeting continuous intradermal glucose monitoring," Biosensors & bioelectronics, vol. 90, s. 577-583, 2017.
[40]
X. Wang et al., "Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint," Journal of microelectromechanical systems, vol. 26, no. 2, s. 357-365, 2017.
[41]
F. Ottonello Briano et al., "A sub-μs thermal time constant electrically driven Pt nanoheater: thermo-dynamic design and frequency characterization," Applied Physics Letters, vol. 108, no. 19, 2016.
[42]
M. Asiatici et al., "Capacitive inertial sensing at high temperatures of up to 400 degrees C," Sensors and Actuators A-Physical, vol. 238, s. 361-368, 2016.
[43]
V. Dubois, F. Niklaus och G. Stemme, "Crack-defined electronic nanogaps," Advanced Materials, vol. 28, no. 11, s. 2178-2182, 2016.
[44]
S. Schröder et al., "Fabrication of an Infrared Emitter using a Generic Integration Platform Based on Wire Bonding," Journal of Micromechanics and Microengineering, vol. 26, no. 11, 2016.
[45]
M. Rajabi et al., "Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing," PLOS ONE, vol. 11, no. 12, 2016.
[46]
G. Lenk et al., "A disposable sampling device to collect volume-measured DBS directly from a fingerprick onto DBS paper," Bioanalysis, vol. 7, no. 16, s. 2085-2094, 2015.
[47]
H. K. Gatty, G. Stemme och N. Roxhed, "A wafer-level liquid cavity integrated amperometric gas sensor with ppb-level nitric oxide gas sensitivity," Journal of Micromechanics and Microengineering, vol. 25, no. 10, 2015.
[48]
H. K. Gatty et al., "An amperometric nitric oxide sensor with fast response and ppb-level concentration detection relevant to asthma monitoring," Sensors and actuators. B, Chemical, vol. 209, s. 639-644, 2015.
[49]
S. J. Bleiker et al., "High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, s. 21-27, 2015.
[50]
A. C. Fischer et al., "Integrating MEMS and ICs," Microsystems & Nanoengineering, vol. 1, no. 1, s. 1-16, 2015.
[51]
C. Errando-Herranz et al., "Low-power microelectromechanically tunable silicon photonic ring resonator add-drop filter," Optics Letters, vol. 40, no. 15, s. 3556-3559, 2015.
[52]
S. Schröder et al., "Stress-Minimized Packaging of Inertial Sensors by Double-Sided Bond Wire Attachment," Journal of microelectromechanical systems, vol. 24, no. 4, s. 781-789, 2015.
[53]
S. Johansson, G. Stemme och N. Roxhed, "A MEMS-based passive air flow regulator for handheld breath diagnostics," Sensors and Actuators A-Physical, vol. 215, s. 65-70, 2014.
[54]
S. B. Johansson et al., "A MEMS-based passive hydrocephalus shunt for body position controlled intracranial pressure regulation," Biomedical microdevices (Print), vol. 16, no. 4, s. 529-536, 2014.
[55]
F. Ottonello Briano et al., "High-frequency sub-wavelength IR thermal source," Proceedings of SPIE, the International Society for Optical Engineering, vol. 9133, s. 91331D-1-91331D-6, 2014.
[56]
H. K. Gatty et al., "Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive," ECS Journal of Solid State Science and Technology, vol. 3, no. 5, s. P115-P121, 2014.
[57]
F. Forsberg et al., "A Comparative study of the bonding energy in adhesive wafer bonding," Journal of Micromechanics and Microengineering, vol. 23, no. 8, s. 1-7, 2013.
[58]
F. Forsberg et al., "Heterogeneous 3D integration of 17 mu m pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems," Journal of Micromechanics and Microengineering, vol. 23, no. 4, s. 045017, 2013.
[59]
M. Lapisa et al., "Heterogeneous 3D integration of hidden hinge micromirror arrays consisting of two layers of monocrystalline silicon," Journal of Micromechanics and Microengineering, vol. 23, no. 7, s. 075003, 2013.
[60]
Z. Baghchehsaraei et al., "MEMS reconfigurable millimeter-wave surface for V-band rectangular-waveguide switch," International Journal of Microwave and Wireless Technologies, vol. 5, no. 3, s. 341-349, 2013.
[61]
G. Pardon et al., "Pt-Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanopores," Nanotechnology, vol. 24, no. 1, s. 015602, 2013.
[62]
D. Clausi et al., "Robust actuation of silicon MEMS using SMA wires integrated at wafer-level by nickel electroplating," Sensors and Actuators A-Physical, vol. 189, s. 108-116, 2013.
[63]
A. C. Fischer et al., "Unconventional applications of wire bonding create opportunities for microsystem integration," Journal of Micromechanics and Microengineering, vol. 23, no. 8, s. 083001, 2013.
[64]
F. Forsberg et al., "Very Large Scale Heterogeneous Integration (VLSHI) and Wafer-Level Vacuum Packaging for Infrared Bolometer Focal Plane Arrays," Infrared physics & technology, vol. 60, s. 251-259, 2013.
[65]
M. Antelius et al., "Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps," Journal of microelectromechanical systems, vol. 22, no. 6, s. 1347-1353, 2013.
[66]
M. Lapisa et al., "Wafer-Level capping and sealing of heat sensitive substances and liquids with gold gaskets," Sensors and Actuators A-Physical, vol. 201, s. 154-163, 2013.
[67]
H. Gradin et al., "Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bonding," Journal of Micromechanics and Microengineering, vol. 23, no. 1, s. 1-14, 2013.
[68]
A. C. Fischer et al., "3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching," Advanced Functional Materials, vol. 22, no. 19, s. 4004-4008, 2012.
[69]
H. Gradin et al., "A low-power high-flow shape memory alloy wire gas microvalve," Journal of Micromechanics and Microengineering, vol. 22, no. 7, s. 1-10, 2012.
[70]
F. Forsberg et al., "Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes," Journal of microelectromechanical systems, vol. 21, no. 5, s. 1077-1083, 2012.
[71]
M. Lapisa et al., "Drift-free micromirror arrays made of monocrystalline silicon for adaptive optics applications," Journal of microelectromechanical systems, vol. 21, no. 4, s. 959-970, 2012.
[72]
M. Antelius et al., "Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level," Journal of Micromechanics and Microengineering, vol. 22, no. 4, s. 045021, 2012.
[73]
H. Gradin et al., "SMA Microvalves for Very Large Gas Flow Control Manufactured Using Wafer-Level Eutectic Bonding," IEEE Transactions on Industrial Electronics, vol. 59, no. 12, s. 4895-4906, 2012.
[74]
A. C. Fischer et al., "Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires," Journal of Micromechanics and Microengineering, vol. 22, no. 10, s. 105001, 2012.
[75]
A. C. Fischer et al., "Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates," Journal of Micromechanics and Microengineering, vol. 22, no. 5, s. 055025, 2012.
[76]
M. Sterner et al., "Electrochemically Assisted Maskless Selective Removal of Metal Layers for Three-Dimensional Micromachined SOI RF MEMS Transmission Lines and Devices," Journal of microelectromechanical systems, vol. 20, no. 4, s. 899-908, 2011.
[77]
F. Zimmer et al., "One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration," Journal of microelectromechanical systems, vol. 20, no. 3, s. 564-572, 2011.
[78]
N. Somjit, G. Stemme och J. Oberhammer, "Power Handling Analysis of High-Power W-Band All-Silicon MEMS Phase Shifters," IEEE Transactions on Electron Devices, vol. 58, no. 5, s. 1548-1555, 2011.
[79]
M. Antelius, G. Stemme och F. Niklaus, "Small footprint wafer-level vacuum packaging using compressible gold sealing rings," Journal of Micromechanics and Microengineering, vol. 21, no. 8, s. 085011, 2011.
[80]
M. Lapisa, G. Stemme och F. Niklaus, "Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS," IEEE Journal of Selected Topics in Quantum Electronics, vol. 17, no. 3, s. 629-644, 2011.
[81]
A. C. Fischer et al., "Wire-bonded through-silicon vias with low capacitive substrate coupling," Journal of Micromechanics and Microengineering, vol. 21, no. 8, s. 085035, 2011.
[82]
C. F. Carlborg et al., "A High-Yield Process for 3-D Large-Scale Integrated Microfluidic Networks in PDMS," Journal of microelectromechanical systems, vol. 19, no. 5, s. 1050-1057, 2010.
[83]
C. F. Carlborg et al., "A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips," Lab on a Chip, vol. 10, no. 3, s. 281-290, 2010.
[84]
N. Somjit, G. Stemme och J. Oberhammer, "Deep-Reactive-Ion-Etched Wafer-Scale-Transferred All-Silicon Dielectric-Block Millimeter-Wave MEMS Phase Shifters," Journal of microelectromechanical systems, vol. 19, no. 1, s. 120-128, 2010.
[85]
D. Clausi et al., "Design and wafer-level fabrication of SMA wire microactuators on silicon," Journal of microelectromechanical systems, vol. 19, no. 4, s. 982-991, 2010.
[86]
M. Do-Quang et al., "Fluid dynamic behavior of dispensing small droplets through a thin liquid film," Microfluidics and Nanofluidics, vol. 9, no. 2-3, s. 303-311, 2010.
[87]
K. Gylfason et al., "On-chip temperature compensation in an integrated slot-waveguide ring resonator refractive index sensor array," Optics Express, vol. 18, no. 4, s. 3226-3237, 2010.
[88]
M. Sterner et al., "Static Zero-Power-Consumption Coplanar Waveguide Embedded DC-to-RF Metal-Contact MEMS Switches in Two-Port and Three-Port Configuration," IEEE Transactions on Electron Devices, vol. 57, no. 7, s. 1659-1669, 2010.
[89]
N. Somjit, G. Stemme och J. Oberhammer, "Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters," IEEE transactions on microwave theory and techniques, vol. 57, no. 11, s. 2834-2840, 2009.
[90]
H. Gradin et al., "Localized removal of the Au-Si eutectic bonding layer for the selective release of microstructures," Journal of Micromechanics and Microengineering, vol. 19, no. 10, s. 105014-105023, 2009.
[91]
A. Decharat et al., "Room-Temperature Sealing of Microcavities by Cold Metal Welding," Journal of microelectromechanical systems, vol. 18, no. 6, s. 1318-1325, 2009.
[92]
F. Niklaus et al., "Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs," Sensors and Actuators A-Physical, vol. 154, no. 1, s. 180-186, 2009.
[93]
S. Braun et al., "Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Wafers," Journal of microelectromechanical systems, vol. 18, no. 6, s. 1309-1317, 2009.
[94]
T. Frisk et al., "An integrated QCM-based narcotics sensing microsystem," Lab on a Chip, vol. 8, no. 10, s. 1648-1657, 2008.
[95]
B. Samel et al., "Liquid Aspiration and Dispensing Based on an Expanding PDMS Composite," Journal of microelectromechanical systems, vol. 17, no. 5, s. 1254-1262, 2008.
[96]
N. Roxhed, P. Griss och G. Stemme, "Membrane-sealed Hollow Microneedles and Related Administration Schemes for Transdermal Drug Delivery," Biomedical microdevices (Print), vol. 10, no. 2, s. 271-279, 2008.
[97]
S. Rydholm et al., "Microfluidic devices for studies of primary cilium mediated cellular response to dynamic flow conditions," Biomedical microdevices (Print), vol. 10, no. 4, s. 555-560, 2008.
[98]
N. Roxhed et al., "Painless Drug Delivery through Microneedle-based Transdermal Patches featuring Active Infusion," IEEE Transactions on Biomedical Engineering, vol. 55, no. 3, s. 1063-1071, 2008.
[99]
F. Niklaus et al., "Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure," Infrared physics & technology, vol. 51, no. 3, s. 168-177, 2008.
[100]
S. Braun, J. Oberhammer och G. Stemme, "Row/column addressing scheme for large electrostatic actuator MEMS switch arrays and optimization of the operational reliability by statistical analysis," Journal of microelectromechanical systems, vol. 17, no. 5, s. 1104-1113, 2008.
[101]
S. Braun, J. Oberhammer och G. Stemme, "Single-chip MEMS 5x5 and 20x20 double-pole single-throw switch arrays for automating telecommunication networks," Journal of Micromechanics and Microengineering, vol. 18, no. 1, s. 015014, 2008.
[102]
B. Samel et al., "A Disposable Lab-on-a-chip Platform with Embedded Fluid Actuators for Active Nanoliter Liquid Handling," Biomedical microdevices (Print), vol. 9, no. 1, s. 61-67, 2007.
[103]
N. Roxhed, P. Griss och G. Stemme, "A Method for Tapered Deep Reactive Ion Etching using a Modified Bosch Process," Journal of Micromechanics and Microengineering, vol. 17, no. 5, s. 1087-1092, 2007.
[104]
B. Samel, P. Griss och G. Stemme, "A Thermally Responsive PDMS Composite and its Microfluidic Applications," Journal of microelectromechanical systems, vol. 16, no. 1, s. 50-57, 2007.
[105]
W. van der Wijngaart et al., "A low-temperature thermopneumatic actuation principle for gas bubble microvalves," Journal of microelectromechanical systems, vol. 16, no. 3, s. 765-774, 2007.
[106]
T. Frisk et al., "A microfluidic device for parallel 3-D cell cultures in asymmetric environments," Electrophoresis, vol. 28, no. 24, s. 4705-4712, 2007.
[107]
L. Nordquist et al., "Novel Microneedle Patches for Active Insulin Delivery are Efficient in Maintaining Glycaemic Control : An Initial Comparison with Subcutaneous Administration," Pharmaceutical research, vol. 24, no. 7, s. 1381-1388, 2007.
[108]
J. Jacksén et al., "Off-line integration of CE and MALDI-MS using a closed-open-closed microchannel system," Electrophoresis, vol. 28, no. 14, s. 2458-2465, 2007.
[109]
N. Roxhed et al., "Penetration-enhanced ultrasharp microneedles and prediction on skin interaction for efficient transdermal drug delivery," Journal of microelectromechanical systems, vol. 16, no. 6, s. 1429-1440, 2007.
[110]
B. Samel, M. K. Chowdhury och G. Stemme, "The fabrication of microfluidic structures by means of full-wafer adhesive bonding using a poly(dimethylsiloxane) catalyst," Journal of Micromechanics and Microengineering, vol. 17, no. 8, s. 1710-1714, 2007.
[111]
P. Gkotsis et al., "Thin film crystal growth template removal : Application to stress reduction in lead zirconate titanate microstructures," Applied Physics Letters, vol. 91, no. 16, 2007.
[112]
J. Oberhammer, A. Q. Liu och G. Stemme, "Time-efficient quasi-static algorithm for simulation of complex single-sided clamped electrostatic actuators," Journal of microelectromechanical systems, vol. 16, no. 2, s. 373-382, 2007.
[113]
B. Samel et al., "Wafer-Level Process for Single-Use Buckling Film Microliter-Range Pumps," Journal of microelectromechanical systems, vol. 16, no. 4, s. 795-801, 2007.
[114]
N. Roxhed et al., "A Compact, Low-cost Microliter-range Liquid Dispenser based on Expandable Microspheres," Journal of Micromechanics and Microengineering, vol. 16, no. 12, s. 2740-2746, 2006.
[115]
T. Frisk et al., "A micromachined interface for airborne sample-to-liquid transfer and its application in a biosensor system," Lab on a Chip, vol. 6, no. 12, s. 1504-1509, 2006.
[116]
J. Oberhammer och G. Stemme, "Active opening force and passive contact force electrostatic switches for soft metal contact materials," Journal of microelectromechanical systems, vol. 15, no. 5, s. 1235-1242, 2006.
[117]
[118]
J. Oberhammer et al., "Mechanically tri-stable, true single-pole-double-throw (SPDT) switches," Journal of Micromechanics and Microengineering, vol. 16, no. 11, s. 2251-2258, 2006.
[119]
S. Haasl et al., "Out-of-Plane Knife-Gate Microvalves for Controlling Large Gas Flows," Journal of microelectromechanical systems, vol. 15, no. 5, s. 1281-1288, 2006.
[120]
A. Russom et al., "Rapid melting curve analysis on monolayered beads for high-throughput genotyping of single-nucleotide polymorphisms," Analytical Chemistry, vol. 78, no. 7, s. 2220-2225, 2006.
[121]
T. Frisk et al., "A concept for miniaturized 3-D cell culture using an extracellular matrix gel," Electrophoresis, vol. 26, no. 24, s. 4751-4758, 2005.
[122]
W. van der Wijngaart, A. Thorsen och G. Stemme, "A seat microvalve nozzle for optimal gas-flow capacity at large-controlled pressure," Journal of microelectromechanical systems, vol. 14, no. 2, s. 200-206, 2005.
[123]
F. Jaouen et al., "Adhesive copper films for an air-breathing polymer electrolyte fuel cell," Journal of Power Sources, vol. 144, no. 1, s. 113-121, 2005.
[124]
J. Oberhammer och G. Stemme, "BCB contact printing for patterned adhesive full-wafer bonded 0-level packages," Journal of microelectromechanical systems, vol. 14, no. 2, s. 419-425, 2005.
[125]
J. Melin, W. van der Wijngaart och G. Stemme, "Behaviour and design considerations for continuous flow closed-open-closed liquid microchannels," Lab on a Chip, vol. 5, no. 6, s. 682-686, 2005.
[126]
S. Haasl et al., "Hybrid-mounted micromachined aluminum hotwires for wall shear-stress measurements," Journal of microelectromechanical systems, vol. 14, no. 2, s. 254-260, 2005.
[127]
A. Russom et al., "Pyrosequencing in a microfluidic flow-through device," Analytical Chemistry, vol. 77, no. 23, s. 7505-7511, 2005.
[128]
J. Melin et al., "A fast passive and planar liquid sample micromixer," Lab on a Chip, vol. 4, no. 3, s. 214-219, 2004.
[129]
J. Melin et al., "A liquid-triggered liquid microvalve for on-chip flow control," Sensors and actuators. B, Chemical, vol. 100, no. 3, s. 463-468, 2004.
[130]
J. Oberhammer och G. Stemme, "Design and fabrication aspects of an S-shaped film actuator based DC to RF MEMS switch," Journal of microelectromechanical systems, vol. 13, no. 3, s. 421-428, 2004.
[131]
A. Russom et al., "Genotyping by dynamic heating of monolayered beads on a microheated surface," Electrophoresis, vol. 25, no. 21-22, s. 3712-3719, 2004.
[132]
J. Oberhammer och G. Stemme, "Low-voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator," IEEE Transactions on Electron Devices, vol. 51, no. 1, s. 149-155, 2004.
[133]
J. Oberhammer, F. Niklaus och G. Stemme, "Sealing of adhesive bonded devices on wafer level," Sensors and Actuators A-Physical, vol. 110, no. 1-3, s. 407-412, 2004.
[134]
P. Melvås och G. Stemme, "A diode-based two-wire-solution for temperature-compensated piezoresistive pressure sensors," IEEE Transactions on Electron Devices, vol. 50, no. 2, s. 503-509, 2003.
[135]
N. Svedin, E. Kälvesten och G. Stemme, "A lift force sensor with integrated hot-chips for wide range flow measurements," Sensors and Actuators A-Physical, vol. 109, no. 02-jan, s. 120-130, 2003.
[136]
F. Niklaus et al., "A method to maintain wafer alignment precision during adhesive wafer bonding," Sensors and Actuators A-Physical, vol. 107, no. 3, s. 273-278, 2003.
[137]
N. Svedin, E. Kälvesten och G. Stemme, "A new edge-detected lift force flow sensor," Journal of microelectromechanical systems, vol. 12, no. 3, s. 344-354, 2003.
[138]
N. Svedin, E. Stemme och G. Stemme, "A static turbine flow meter with a micromachined silicon torque sensor," Journal of microelectromechanical systems, vol. 12, no. 6, s. 937-946, 2003.
[139]
F. Niklaus, S. Haasl och G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding," Journal of microelectromechanical systems, vol. 12, no. 4, s. 465-469, 2003.
[140]
L. Löfdahl et al., "Characteristics of a hot-wire microsensor for time-dependent wall shear stress measurements," Experiments in Fluids, vol. 35, no. 3, s. 240-251, 2003.
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J. Sjödahl et al., "Characterization of micromachined hollow tips for two-dimensional nanoelectrospray mass spectrometry," Rapid Communications in Mass Spectrometry, vol. 17, no. 4, s. 337-341, 2003.
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J. Oberhammer, F. Niklaus och G. Stemme, "Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities," Sensors and Actuators A-Physical, vol. 105, no. 3, s. 297-304, 2003.
[143]
P. Griss och G. Stemme, "Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer," Journal of microelectromechanical systems, vol. 12, no. 3, s. 296-301, 2003.
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A. Russom et al., "Single nucleotide polymorphism analysis by allele-specific primer extension with real-time bioluminescence detection in a microfluidic device," Journal of Chromatography A, vol. 1014, no. 1-2, s. 37-45, 2003.
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A. Russom et al., "Single-nucleotide polymorphism analysis by allele-specific extension of fluorescently labeled nucleotides in a microfluidic flow-through device," Electrophoresis, vol. 24, no. 1-2, s. 158-161, 2003.
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P. Melvås et al., "A free-hanging strain-gauge for ultraminiaturized pressure sensors," Sensors and Actuators A-Physical, vol. aug-97, s. 75-82, 2002.
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W. van der Wijngaart et al., "A high-stroke, high-pressure electrostatic actuator for valve applications," Sensors and Actuators A-Physical, vol. 100, no. 03-feb, s. 264-271, 2002.
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W. van der Wijngaart, A. Berrier och G. Stemme, "A micropneumatic-to-vibration energy converter concept," Sensors and Actuators A-Physical, vol. 100, no. 1, s. 77-83, 2002.
[149]
P. Melvås, E. Kälvesten och G. Stemme, "A temperature compensated dual beam pressure sensor," Sensors and Actuators A-Physical, vol. 100, no. 1, s. 46-53, 2002.
[150]
P. Griss et al., "Characterization of micromachined spiked biopotential electrodes," IEEE Transactions on Biomedical Engineering, vol. 49, no. 6, s. 597-604, 2002.
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P. Griss et al., "Development of micromachined hollow tips for protein analysis based on nanoelectrospray ionization mass spectrometry," Journal of Micromechanics and Microengineering, vol. 12, no. 5, s. 682-687, 2002.
[152]
H. Andersson, P. Griss och G. Stemme, "Expandable microspheres - surface immobilization techniques," Sensors and actuators. B, Chemical, vol. 84, no. 2-3, s. 290-295, 2002.
[153]
P. Griss, H. Andersson och G. Stemme, "Expandable microspheres for the handling of liquids," Lab on a Chip, vol. 2, no. 2, s. 117-120, 2002.
[154]
C. Jönsson et al., "Immobilized oxazoline-containing ligands in asymmetric catalysis - A review," Bioorganic & Medicinal Chemistry Letters, vol. 12, no. 14, s. 1857-1861, 2002.
[155]
P. Griss, P. Enoksson och G. Stemme, "Micromachined barbed spikes for mechanical chip attachment," Sensors and Actuators A-Physical, vol. 95, no. 03-feb, s. 94-99, 2002.
[156]
A. Ahmadian et al., "SNP analysis by allele-specific extension in a micromachined filter chamber," BioTechniques, vol. 32, no. 4, s. 748-754, 2002.
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H. Andersson et al., "Self-assembled and self-sorted array of chemically active beads for analytical and biochemical screening," Talanta : The International Journal of Pure and Applied Analytical Chemistry, vol. 56, no. 2, s. 301-308, 2002.
[158]
P. Melvås, E. Kälvesten och G. Stemme, "A surface-micromachined resonant-beam pressure-sensing structure," Journal of microelectromechanical systems, vol. 10, no. 4, s. 498-502, 2001.
[159]
H. Andersson et al., "A valve-less diffuser micropump for microfluidic analytical systems," Sensors and actuators. B, Chemical, vol. 72, no. 3, s. 259-265, 2001.
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H. Andersson et al., "Consecutive microcontact printing - ligands for asymmetric catalysis in silicon channels," Sensors and actuators. B, Chemical, vol. 79, no. 1, s. 78-84, 2001.
[161]
K. Kunz, P. Enoksson och G. Stemme, "Highly sensitive triaxial silicon accelerometer with integrated PZT thin film detectors," Sensors and Actuators A-Physical, vol. 92, no. 03-jan, s. 156-160, 2001.
[162]
H. Andersson et al., "Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels," Sensors and actuators. B, Chemical, vol. 75, no. 1-2, s. 136-141, 2001.
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F. Niklaus et al., "Low temperature full wafer adhesive bonding of structured wafers," Sensors and Actuators A-Physical, vol. 92, no. 03-jan, s. 235-241, 2001.
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F. Niklaus et al., "Low-temperature full wafer adhesive bonding," Journal of Micromechanics and Microengineering, vol. 11, no. 2, s. 100-107, 2001.
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F. Niklaus et al., "Low-temperature wafer-level transfer bonding," Journal of microelectromechanical systems, vol. 10, no. 4, s. 525-531, 2001.
[166]
P. Melvås, E. Kalvesten och G. Stemme, "Media protected surface micromachined leverage beam pressure sensor," Journal of Micromechanics and Microengineering, vol. 11, no. 6, s. 617-622, 2001.
[167]
P. Griss et al., "Micromachined electrodes for biopotential measurements," Journal of microelectromechanical systems, vol. 10, no. 1, s. 10-16, 2001.
[168]
H. Andersson, W. van der Wijngaart och G. Stemme, "Micromachined filter-chamber array with passive valves for biochemical assays on beads," Electrophoresis, vol. 22, no. 2, s. 249-257, 2001.
[169]
H. Andersson et al., "Patterned self-assembled beads in silicon channels," Electrophoresis, vol. 22, no. 18, s. 3876-3882, 2001.
[170]
F. Niklaus, E. Kälvesten och G. Stemme, "Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays," Journal of Micromechanics and Microengineering, vol. 11, no. 5, s. 509-513, 2001.
[171]
J. Melin et al., "A low-pressure encapsulated deep reactive ion etched resonant pressure sensor electrically excited and detected using 'burst' technology," Journal of Micromechanics and Microengineering, vol. 10, no. 2, s. 209-217, 2000.
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T. Corman et al., "A low-pressure encapsulated resonant fluid density sensor with feedback control electronics," Measurement science and technology, vol. 11, no. 3, s. 205-211, 2000.
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T. Ebefors et al., "A robust micro conveyer realized by arrayed polyimide joint actuators," Journal of Micromechanics and Microengineering, vol. 10, no. 3, s. 337-349, 2000.
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T. Corman et al., "An optical IR-source and CO2-chamber system for CO2 measurements," Journal of microelectromechanical systems, vol. 9, no. 4, s. 509-516, 2000.
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T. Corman et al., "Burst technology with feedback-loop control for capacitive detection and electrostatic excitation of resonant silicon sensors," IEEE Transactions on Electron Devices, vol. 47, no. 11, s. 2228-2235, 2000.
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H. Andersson et al., "Micromachined flow-through filter-chamber for chemical reactions on beads," Sensors and actuators. B, Chemical, vol. 67, no. 1-2, s. 203-208, 2000.
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A. Olsson, G. Stemme och E. Stemme, "Numerical and experimental studies of flat-walled diffuser elements for valve-less micropumps," Sensors and Actuators A-Physical, vol. 84, no. 02-jan, s. 165-175, 2000.
Konferensbidrag
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X. Tian et al., "Low-Temperature Integration of Bulk PZT-5H for Enhancing the Performance of MEMS-Based Piezoelectric Ultrasonic Energy Harvesters," i IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024, 2024, s. 749-752.
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L.-L. Lai et al., "Picoliter-volume refractive index sensor 3D-printed in silica glass on an optical fiber tip," i 2023 Conference on Lasers and Electro-Optics, CLEO 2023, 2023.
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M. Sandell et al., "3 D-printed micrograters for sampling of the blood vessel wall," i 2021 34th IEEE international conference on micro electro mechanical systems (MEMS 2021), 2021, s. 548-550.
[182]
M. Dobielewski, G. Stemme och N. Roxhed, "All-in-one sampler for one-step dried blood spot sample collection," i Proceedings MicroTAS 2021 - 25th International Conference on Miniaturized Systems for Chemistry and Life Sciences, 2021, s. 675-676.
[183]
T. Last, G. Stemme och N. Roxhed, "First micro swirl nozzle for fast drug delivery to the lung," i 2021 34th IEEE nternational conference on micro electro mechanical systems (MEMS 2021), 2021, s. 22-25.
[184]
J. Hauser et al., "On-Chip Assay for Home-Sampling, Mail-Based Shipping and Centralized Laboratory Readout," i MicroTAS 2021 : 25th International Conference on Miniaturized Systems for Chemistry and Life Sciences, 2021, s. 807-808.
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M. Sandell et al., "An Ultraminiaturized MEMS Microbiopsy Tool for Trans Blood Vessel Wall Biopsies," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2020, s. 10-12.
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A. Quellmalz et al., "Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding," i 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems, 2020.
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J. Hauser et al., "Tem grid preparation with minimal user interaction," i MicroTAS 2020 - 24th International Conference on Miniaturized Systems for Chemistry and Life Sciences, 2020, s. 1081-1082.
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J. Hauser, G. Stemme och N. Roxhed, "A blood hematocrit test strip," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 426-428.
[189]
T. Last, G. Stemme och N. Roxhed, "Demonstration of the First Self-Sealing Aerosol Spray Nozzle for Medical Drug Delivery," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 53-56.
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S. Pagliano et al., "Feedback-Free Electromigrated Tunneling Junctions from Crack-Defined Gold Nanowires," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 365-367.
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A. Enrico et al., "Manufacturing of Sub-20 NM Wide Single Nanowire Devices using Conventional Stepper Lithography," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2019, s. 244-247.
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F. Ribet et al., "Zero-Loss Optical Switch Based on Ionic Liquid Microdroplet Ewod Actuation," i 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, 2019, s. 2290-2293.
[194]
S. J. Bleiker et al., "Adhesive Wafer Bonding for Heterogeneous System Integration," i ECS Meeting Abstracts, 2018.
[195]
J. Hauser, G. Stemme och N. Roxhed, "An autonomous blood microsampling device enabling metered large-volume dried plasma spots (DPS)," i 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2018, 2018, s. 1737-1739.
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F. Ribet et al., "Ionic liquid microdroplet manipulation by electrowetting-on-dielectric for on/off diffusion control," i 2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, s. 1181-1184.
[197]
F. Ribet, G. Stemme och N. Roxhed, "Microneedle-based system for minimally invasive continuous monitoring of glucose in the dermal interstitial fluid," i 2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, s. 408-411.
[198]
C. Errando-Herranz et al., "New dynamic silicon photonic components enabled by MEMS technology," i Proceedings Volume 10537, Silicon Photonics XIII, 2018.
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S. Schröder et al., "A low-cost nitric oxide gas sensor based on bonded gold wires," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 1457-1460.
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S. Schröder et al., "A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 315-318.
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V. Dubois, F. Niklaus och G. Stemme, "Design optimization and characterization of nanogap crack-junctions," i 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS), Las Vegas, USA, 22-26 January 2017, 2017, s. 644-647.
[202]
X. Wang, G. Stemme och N. Roxhed, "High aspect ratio silicon field emitter arrays (FEAs) as miniaturized stable electron source for catheter-based radiotherapy," i Proceedings of IEEE 30th International Conference on Micro Electro Mechanical Systems, 2017.
[203]
M. Laakso et al., "Maskless Manufacturing of Through Glass Vias (TGVs) and Their Test Structures," i Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2017, s. 753-756.
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X. Wang et al., "Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging," i TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, 2017, s. 423-426.
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M. Laakso et al., "Wide temperature range through silicon vias made of Invar and spin-on glass for interposers and MEMS," i 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (Mems), 2016, s. 585-588.
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C. Errando-Herranz et al., "A Low-power MEMS Tunable Photonic Ring Resonator for Reconfigurable Optical Networks," i Proceedings of The 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Estoril, Portugal. Jan 2015, 2015, s. 53-56.
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C. Errando-Herranz et al., "A MEMS tunable photonic ring resonator with small footprint and large free spectral range," i Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on, 2015, s. 1001-1004.
[208]
G. Lenk et al., "Capillary driven and volume-metred blood-plasma separation," i Proceedings 18 th IEEE Transducers, 2015, s. 335-338.
[209]
G. Lenk, G. Stemme och N. Roxhed, "Dry reagent storage in dissolvable films and liquid triggered release for programmed multi-step lab-on-chip diagnostics," i 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2015, s. 451-454.
[210]
F. Forsberg et al., "Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation," i 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2015), 2015, s. 280-283.
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G. Lenk et al., "A Disposable Chip for the Collection of Quantitative Dried Blood Spot Samples," i MSW 2014,15-16 May, Uppsala, Sweden, 2014.
[212]
S. B. Johansson, G. Stemme och N. Roxhed, "A novel constant flow regulation principle for compact breath diagnostics," i 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, s. 935-938.
[213]
G. A. Lenk, G. Stemme och N. Roxhed, "Delay valving in capillary driven devices based on dissolvable thin films," i 18th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2014, 2014, s. 216-218.
[214]
A. C. Fischer et al., "3D printing of silicon micro and nano structures by ion implantation, silicon deposition, and selective silicon etching," i Technical Paper - Society of Manufacturing Engineers, 2013.
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G. Lenk et al., "A Disposable Chip Enabling Metering In Dried Blood Spot Sampling," i Micro TAS 2013, 2013, s. 281-283.
[216]
S. Johansson et al., "A MEMS-based passive hydrocephalus shunt with adaptive flow characteristics," i Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), Barcelona, 2013, 2013.
[217]
S. B. Johansson, G. Stemme och N. Roxhed, "A compact passive air flow regulator for portable breath diagnostics," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 157-160.
[218]
H. K. Gatty et al., "A ppb level, miniaturized fast response amperometric nitric oxide sensor for asthma diagnostics," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 1001-1004.
[219]
G. Stemme och F. Niklaus, "Cost effective MEMS integration for complex device applications," i Conference on Micro- and Nano- Engineering : MNE 2013, London, 2013, s. 17-17.
[220]
G. Lenk et al., "Disposable Chip to Enable Metering in Dried Blood Spot Sampling," i Medicinteknikdagarna, 2013.
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F. Forsberg et al., "Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 342-346.
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Z. Baghchehsaraei et al., "Millimeter-Wave SPST Waveguide Switch Based on Reconfigurable MEMS Surface," i 2013 IEEE MTT-S International Microwave Symposium Digest (IMS), 2013, s. 6697774.
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A. Vastesson et al., "ROBUST MICRODEVICE MANUFACTURING BY DIRECT LITHOGRAPHY AND ADHESIVE-FREE BONDING OF OFF-STOICHIOMETRY THIOL-ENE-EPOXY (OSTE+) POLYMER," i 17th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems & EUROSENSORS XXVII (IEEE TRANSDUCERS 2013), 2013, s. 408-411.
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S. Schröder et al., "Stress-minimized packaging of inertial sensors using wire bonding," i 2013 Transducers & Eurosensors XXVII : The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013, s. 1962-1965.
[225]
H. K. Gatty et al., "Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration," i Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, 2013, s. 381-384.
[226]
S. Schröder et al., "Very high aspect ratio through silicon vias (TSVs) using wire bonding," i Transducers & Eurosensors XXVII : The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013, 2013, s. 167-170.
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A. C. Fischer et al., "Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching," i 12th IEEE Conference on Nanotechnology (IEEE-NANO), 2012, 2012, s. 1-4.
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Z. Baghchehsaraei et al., "MEMS 30 µm-thick W-band Waveguide Switch," i 2012 42ND EUROPEAN MICROWAVE CONFERENCE (EUMC), 2012, s. 1055-1058.
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Z. Baghchehsaraei et al., "MEMS 30μm-thick W-band Waveguide Switch," i European Microwave Week 2012: "Space for Microwaves", EuMW 2012, Conference Proceedings - 7th European Microwave Integrated Circuits Conference, EuMIC 2012, 2012, s. 675-678.
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Z. Baghchehsaraei et al., "MEMS 30μm-thick W-band waveguide switch," i European Microwave Week 2012 : "Space for Microwaves", EuMW 2012, Conference Proceedings - 42nd European Microwave Conference, EuMC 2012, 2012, s. 1055-1058.
[231]
N. Somjit, G. Stemme och J. Oberhammer, "Performance optimization of multi-stage MEMS W-band dielectric-block phase-shifters," i European Microwave Week 2012: "Space for Microwaves", EuMW 2012, Conference Proceedings - 7th European Microwave Integrated Circuits Conference, EuMIC 2012, 2012, s. 433-436.
[232]
N. Somjit, G. Stemme och J. Oberhammer, "Thermal Characteristics and Power-Handling Capability of High-Power Millimeter-Wave MEMS Dielectric-Block Phase Shifters," i Gigahertz Symposium 2012. Stockholm, Sweden. March 6-7 2012, 2012.
[233]
F. Niklaus et al., "Wafer-level heterogeneous 3D integration for MEMS and NEMS," i Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, 2012, s. 247-252.
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A. C. Fischer et al., "high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires," i Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 2012, s. 541-547.
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H. Gradin et al., "A WAFER-LEVEL, HETEROGENEOUSLY INTEGRATED, HIGH FLOW SMA-SILICON GAS MICROVALVE," i 16th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2011), 2011, s. 1781-1784.
[236]
A. C. Fischer et al., "Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires," i Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, 2011, s. 37-40.
[237]
F. Forsberg et al., "HETEROGENEOUS INTEGRATION TECHNOLOGY FOR COMBINATION OF DIFFERENT WAFER SIZES USING AN EXPANDABLE HANDLE SUBSTRATE," i PROC IEEE MICR ELECT : IEEE MICRO ELECTRO MECHANICAL SYSTEMS, 2011, s. 268-271.
[238]
M. A. Lapisa et al., "Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers," i 2011 IEEE 24th International Conference On Micro Electro Mechanical Systems (MEMS), 2011, s. 696-699.
[239]
F. Forsberg et al., "High-Performance Infrared Micro-Bolometer Arrays Manufactured Using Very Large Scale Heterogeneous Integration," i OMN2011 : 16TH INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS, 2011, s. 9-10.
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U. Shah et al., "MULTI-POSITION LARGE TUNING-RANGE DIGITALLY TUNEABLE CAPACITORS EMBEDDED IN 3D MICROMACHINED TRANSMISSION LINES," i IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011, 2011, s. 165-168.
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N. Sandström et al., "ONE STEP INTEGRATION OF GOLD COATED SENSORS WITH OSTE POLYMER CARTRIDGES BY LOW TEMPERATURE DRY BONDING," i 16th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2011), 2011, s. 2778-2781.
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P. Ericsson et al., "Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays," i Infrared Technology and Applications XXXVII : Proc. of SPIE, Vol. 8012, 2011, s. 801216-1-801216-9.
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F. Zimmer et al., "Very large scale heterogeneous system integration for 1-megapixel mono-crystalline silicon micro-mirror array on CMOS driving electronics," i 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011, s. 736-739.
[244]
D. Clausi et al., "WAFER-LEVEL MECHANICAL AND ELECTRICAL INTEGRATION OF SMA WIRES TO SILICON MEMS USING ELECTROPLATING," i 24th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), 2011, s. 1281-1284.
[245]
A. C. Fischer et al., "Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology," i 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE, 2011, s. 348-351.
[246]
K. B. Gylfason et al., "A packaged optical slot-waveguide ring resonator sensor array for multiplex assays in Labs-on-Chip," i Medicinteknikdagarna, Umeå, Sweden, October 6-7, 2010., 2010.
[247]
N. Somjit, G. Stemme och J. Oberhammer, "Comparison of Thermal Characteristics of Novel RF MEMS Dielectric-Block Phase Shifter to Conventional MEMS Phase-Shifter Concepts," i European Microwave Week 2010, EuMW2010 : Connecting the World, Conference Proceedings, 2010, s. 509-512.
[248]
A. C. Fischer et al., "Heterogeneous Integration for Optical MEMS," i 2010 23RD ANNUAL MEETING OF THE IEEE PHOTONICS SOCIETY, 2010, s. 487-488.
[249]
M. Sterner et al., "Integration of microwave MEMS reconfigurable reflective surfaces in rectangular waveguide stubs," i 2010 Asia-Pacific Microwave Conference, APMC 2010, 2010, s. 1825-1828.
[250]
N. Somjit, G. Stemme och J. Oberhammer, "Investigation of Power Handling Capability of Conventional and Novel All-Silicon RF MEMS Phase Shifters," i 11th International Symposium on RF MEMS and RF Microsystems (MEMSWAVE 2010). Otranto, Italy. June 28-30 2010, 2010.
[251]
C. F. Carlborg et al., "LARGE SCALE INTEGRATED 3D MICROFLUIDIC NETWORKS THROUGH HIGH YIELD FABRICATION OF VERTICAL VIAS IN PDMS," i MEMS 2010 : 23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2010), 2010, s. 240-243.
[252]
F. Saharil et al., "LOW-TEMPERATURE CMOS-COMPATIBLE 3D-INTEGRATION OF MONOCRYSTALLINE-SILICON BASED PZT RF MEMS SWITCH ACTUATORS ON RF SUBSTRATES," i MEMS 2010 : 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, s. 47-50.
[253]
A. C. Fischer et al., "Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling," i MEMS 2010 : 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, s. 480-483.
[254]
A. C. Fischer et al., "Low-cost Through Silicon Vias (Tsvs) with wire-bonded metal cores and low capacitive substratecoupling : ," i Proceedings : 8th Micronano System Technology Event (MSW 2010), 2010, s. 30-30.
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D. Hill et al., "Microfluidic and Transducer Technologies for Lab on a Chip Applications," i 2010 ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC), 2010, s. 305-307.
[256]
N. Somjit, G. Stemme och J. Oberhammer, "Novel Low-loss 4.25-Bit All-Silicon Millimeter-Wave MEMS Phase Shifters for High-Performance W-Band Applications," i The 8th Micronano System Workshop. Stockholm, SWE. 04 May 2010 - 05 May 2010, 2010.
[257]
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F. Niklaus et al., "Characterization of transfer bonded silicon bolometer arrays," i INFRARED TECHNOLOGY AND APPLICATIONS XXX, 2004, s. 521-530.
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W. van der Wijngaart, A. S. Ridgeway och G. Stemme, "A MICROMACHINED KMFE GATE VALVE FOR HIGH-FLOW PRESSURE REGULATION APPLICATIONS," i 12th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems Conference (IEEE TRANSDUCERS 2003), 2003, s. 1931-1934.
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Kapitel i böcker
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Icke refereegranskade
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N. Sandström et al., "Lab-on-a-chip microsystems for point-of-care diagnostics," i 1st International scientific conference on Microfluidics in bioanalytical research and diagnostics, 2010, s. 34-35.
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N. Sandström et al., "Microfluidic systems for point-of-care diagnostics," i 8th Micronano System Workshop, MSW 2010, 2010.
[381]
J. Oberhammer et al., "Microwave MEMS Activities at KTH- Royal Institute of Technology," i 8th Micronano System Workshop 2010 (MSW 2010). Stockholm, Sweden. May 4-5, 2010, 2010.
[382]
M. Sterner et al., "Millimeter-Wave RF MEMS Reconfigurable High-Impedance Surfaces for Radar Applications," i GigaHertz Symposium 2010, 2010.
[383]
M. Sterner, G. Stemme och J. Oberhammer, "Nanometer-scale flatness and reliability investigation of stress-compensated symmetrically-metallized monocrystalline-silicon multi-layer membranes," i 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010, s. 959-962.
[384]
F. Forsberg et al., "Quantum-Well Silicon-Germanium Bolometers for Low-Cost Infrared Imagers," i Proceedings : MSW2010, 2010.
[385]
M. Sterner et al., "RF MEMS Tuneable High-Impedance Metamaterial Surfaces for Millimeter-Wave Applications," i Proc. Micro Structure Workshop 2010, 2010.
[386]
M. Sterner et al., "Reliability investigation of stress-compensated metal-coated monocrystalline-silicon membranes for MEMS tuneable high-impedance surfaces," i 11th International Symposium on RF MEMS and RF Microsystems. Otranto, Italy. June 29 - July 1 2010, 2010.
[387]
G. Stemme, "Utveckling av mikroelektromekaniska system (MEMS) i Sverige," i Scandinavian Electronics Event, Elektronikmässan; Älvsjö, Sverige, 13 april 2010, 2010.
[388]
N. Sandström et al., "Electrohydrodynamic Enhanced Transport and Trapping of Airborne Particles to a Microfluidic Air-Liquid Interface," i Micro System Workshop 2008, 2008.
[389]
S. Braun, J. Oberhammer och G. Stemme, "MEMS crossbar switches for telecommunication networks," i Micro System Workshop 08, 2008.
[390]
G. Stemme, "Microfluidic devices for applications in life-science," i Mini-Symposium on Opto-Microfluidics for Large Scale Integration. Windermere, Cumbria, U.K. 21-24 Apr 2008, 2008.
[391]
N. Sandström et al., "Microsystems for Airborne Sample Detection," i Mini-symposium on Opto-Microfluidics for Biological Large Scale Integration, 2008.
[392]
A. Decharat et al., "NOVEL ROOM-TEMPERATURE WAFER-TO-WAFER ATTACHMENT AND SEALING OF CAVITIES USING COLD METAL WELDING," i Proceedings Micro System Workshop MSW08, 2008.
[393]
K. B. Gylfason et al., "Optical slot-waveguide micro-ring resonators for biosensing," i International Label-Free Biosensing Workshop. Enschede, the Netherlands. April 8-9 2008, 2008.
[394]
C. F. Carlborg et al., "Ultrahigh sensitivity slot-waveguide biosensor on a highly integrated chip for simultaneous diagnosis of multiple diseases," i Medicinteknikdagarna, Gothenburg, 2008, 2008.
[395]
T. Frisk et al., "A miniaturised QCM-based integrated electronic nose system," i Medicinteknikdagarna. Örebro, SWE. 2-3 oktober 2007, 2007.
[396]
G. Stemme, "Low-cost MEMS for Applications in Medical Technology," i 33rd International Conference on Micro- and Nano-Engineering (MNE). Copenhagen, Denmark. 23 September - 26 September 2007, 2007.
[397]
G. Stemme, "Medical Technology Devices Based on MEMS Technology," i The 24th Sensor Symposium on Sensors, Micromachines and Applied Systems, October 16-17, 2007, Tokyo, Japan, 2007.
[398]
G. Stemme, "Microfluidic Low-Cost Chip-Based Systems for Medical Applications," i Lab-on-a-Chip World Congress. 15 - 16 May 2007, Edinburgh, Scotland, 2007.
[399]
S. Braun, J. Oberhammer och G. Stemme, "Smart individual switch addressing of 5×5 and 20×20 MEMS double-switch arrays," i TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, 2007, s. 153-156.
[400]
G. Stemme, "Use of a microneedles for Insulin Deliver," i 7th Diabetes Technology Meeting. San Fransisco, USA. October 25 - 27, 2007, 2007.
[401]
G. Stemme et al., "A low-cost disposable nanoliter handling liquid handling system with embedded fluid actuators," i The 6th Micro Structure Workshop. Västerås, Sweden, 2006.
[402]
T. Frisk, W. van der Wijngaart och G. Stemme, "Fast Narcotics Detection With a Microfluidic Sample Interface," i Medicinteknikdagarna, 2006.
[403]
T. Frisk, W. van der Wijngaart och G. Stemme, "Fast Narcotics Detection with a Microfluidic Sample Interface," i Microsystems Technology Workshop, 2006.
[404]
S. Wissmar et al., "SiGe Thermistor Infrared Bolometers," i Proceedings Micro System Workshop MSW, 2006, s. 62.
[405]
G. Stemme, "University MEMS Sensors Research for Industry," i The 5th IEEE Conference on Sensors (IEEE SENSORS 2006). Daegu, Korea. October 22-25 2006, 2006.
[406]
G. Stemme, "MEMS Devices for Bio and Medical Applications," i International Symposium on Bio Micro & Nanosystems, 2005, s. 25-57.
[407]
N. Roxhed, P. Griss och G. Stemme, "Reliable in-vivo penetration and transdermal injection using ultra-sharp hollow microneedles," i Transducers '05, Digest of Technical Papers, Vols 1 and 2 : Digest of Technical Papers, 2005, s. 213-216.
[408]
M. Mowler et al., "A 2-bit Reconfigurable Meander Slot Antenna with High-Displacement Low-Voltage RF MEMS Switches," i Proc. MEMSWave – Workshop on MEMS for Millimeterwave Communication 2004, 2004, s. D20-D24.
[409]
G. Stemme, "Micro and nanotechnology for Biomedical applications," i Nano-micro Interface Symposium. Glasgow, U.K., 2004.
[410]
W. van der Wijngaart, A. Thorsén och G. Stemme, "Seat microvalve nozzle design for optimal gas flow capacity," i Proceedings of the fifth Micro Structure Workshop (MSW), 2004, s. 129-132.
[411]
S. Haasl et al., "Thermal polymer V-shaped actuators for optical alignment applications," i Fifth Micro Structure Workshop, 2004, s. 117-120.
[412]
F. Niklaus, J. Oberhammer och G. Stemme, "Adhesive Wafer Bonding for Packaging Applications," i Workshop on MEMS Sensor Packaging 2003; Copenhagen, Denmark, 20-21 March 2003, 2003.
[413]
G. Stemme, "Sensors for Flow Measurements based on MEMS Technology," i The 4th Symposium on Smart Control of Turbulence; Tokyo, Japan, 2-4 March 2003, 2003, s. 103-113.
[414]
N. Johnsson et al., "Optically excited microresonator for force measurements," i Micro Structure Workshop'98 (MSW), 1998, s. P3.1-P3.3.
Kapitel i böcker
[415]
S. Haasl och G. Stemme, "Physical Sensors : Flow sensors," i Comprehensive Microsystems, Gianchandani, Yogesh; Tabata, Osamu; Zappe, Hans red., Oxford : Elsevier Science, 2008.
Övriga
[416]
J. Hauser et al., "A Microfluidic Device for Patient-Centric Multiplexed Assays with Readout in Centralized Laboratories," (Manuskript).
[417]
A. C. Fischer, G. Stemme och F. Niklaus, "KTH Introduces New TSV-Concept with Wire-Bonded Metal Cores," , 2009.
[418]
S. Pagliano et al., "3D printing by two-photon polymerization of polyimide objects and demonstration of a 3D-printed micro-hotplate," (Manuskript).
[419]
L.-L. Lai et al., "3D printing of glass micro-optics with subwavelength features on optical fiber tips," (Manuskript).
[420]
[421]
[422]
S. Schröder et al., "A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system," (Manuskript).
[423]
J. Hauser et al., "An Autonomous microfluidic device for generating volume-defined dried plasma spots (DPS)," (Manuskript).
[424]
H. K. Gatty, G. Stemme och R. Niclas, "An amperometric hydrogen sulphide sensor applicable for bad breath monitoring," (Manuskript).
[425]
S. Buchmann et al., "Defined neuronal-astrocytic interactions enabled with a 3D printed platform," (Manuskript).
[426]
J. Hauser et al., "High yield passive plasma filtration from human finger prick blood," (Manuskript).
[427]
M. Sandell et al., "Hydraulic micropistons enable high-force operations through miniaturized catheters," (Manuskript).
[428]
J. Oberhammer och G. Stemme, "Low-cost glass-lid packaging by adhesive full-wafer bonding with two-step etched electrical feedthroughs," (Manuskript).
[429]
T. Last et al., "Micro Swirl-Nozzle Enables Portable Delivery ofLarge-Molecule Biopharmaceuticals to the Lung," (Manuskript).
[430]
T. Last et al., "Monolithic Swirl nozzle enables concentrated LNP delivery of aerosols to the lung using portable inhalers," (Manuskript).
[431]
P.-H. Huang et al., "Multiphoton lithography featuring self-forming nanogratings for 3D printing of hierarchical glass structures," (Manuskript).
[432]
S. Haasl et al., "Robust, large-deflection, in-plane thermal polymer V-shaped actuators," (Manuskript).
[433]
[434]
T. Last et al., "Scaling towards diminutive MEMS:Dust-sized spray chips for aerosolized drug delivery to the lung," (Manuskript).
[435]
M. Laakso et al., "Three-dimensional printing of silica-glass structures with submicrometric features," (Manuskript).
[436]
A. Enrico et al., "Ultrafast and resist-free nanopatterning of 2D materials by femtosecond laser irradiation," (Manuskript).
Patent
Patent
[437]
[438]
F. Ottonello Briano et al., "Sensor device and a method of detecting a component in gas," us US10598590B2 (2020-03-24), 2020.
[439]
K. B. Gylfason et al., "A Sensor Device and a Method of Detecting a Component in Gas," us 20180164208B2 (2019-02-19), 2015.
[440]
A. C. Fischer, F. Niklaus och G. Stemme, "A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device," se WO 2012071002A1, 2010.
[441]
[442]
[443]
G. Stemme och F. Niklaus, "Mems components and method for manufacturing same," WO 2007089204A1, 2006.
[444]
G. Stemme och F. Niklaus, "Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such," WO 2007117198A1, 2006.
[445]
[446]
[447]
[448]
G. Stemme, W. van der Wijngaart och A. Ridgeway, "A micromachined knife gate valve for high-flow pressure regulation applications," WO 2004109163A3, 2003.
[449]
F. Niklaus och G. Stemme, "Adhesive sacrificial bonding of spatial light modulators," us 7054052 (2006-05-30), 2003.
[450]
F. Niklaus, G. Stemme och J. Oberhammer, "Method for sealing a microcavity and package comprising at least one microcavity," EP 1540727 (2010-10-20), 2002.
[451]
[452]
G. Stemme och F. Niklaus, "Combining components to form integrated device, especially micro mirror spatial light modulator, comprises an adhesive sacrificial bonding technique," se 523596 (2004-05-04), 2001.
[453]
G. Stemme och P. Griss, "Micro needles and method of manufacture thereof," EP 1416996-B1 (2006-10-18), 2001.
[454]
E. Kaelvesten, P. Melvas och G. Stemme, "Miniaturized pressure sensor," us 7017420-B2 (2006-03-28), 2001.
[455]
G. Stemme et al., "Compensated integrated micro-machined yaw rate sensor," us 6453743-B1 (2002-09-24), 2000.
[456]
[457]
E. Kälvesten, G. Stemme och F. Niklaus, "Method of joining components," us 7067345 (2006-06-27), 2000.
[458]
G. Stemme och E. Kälvesten, "Method of making a pressure sensor comprising a resonant beam structure," us 6182513 (2001-02-06), 1998.
[459]
G. Stemme och E. Kälvesten, "Micromachined gas-filled chambers and method of microfabrication," us 6548322-B1 (2003-04-15), 1998.
[460]
[461]
G. Stemme et al., "Lift force fluid flow sensor for measuring fluid flow velocities," EP 0988555 (2004-12-29), 1997.
[462]
G. Stemme och E. Stemme, "Trycksensor innefattande en tryckkänslig flat kapsel," SE 462874B (1991-01-17), 1989.
[463]
G. Stemme, "Integrated semiconductor circuit and method for producing it, and use of such a circuit for providing a flow meter," se 447318B (1987-02-12), 1985.
Senaste synkning med DiVA:
2024-04-21 03:22:15