MEMS switch arrays for reconfiguration of telecommunication networks
Large, single chip integrated MEMS switch arrays for the reconfiguration of copper-wire telecommunication networks.
This project focuses on the development of large 20x20 MEMS doubleswitch (DPDT) arrays for reconfiguring the copper-wire telecommunication network. On a chip-size of 14 mm x 14 mm, 400 individually addressable doubleswitches are integrated and packaged on a single chip.
Project sponsors
- VINNOVA
- Network Automation AB
Involved people (at KTH):
Stefan Braun (alumni)
Göran Stemme
Project leader (at KTH):
Joachim Oberhammer
Involved industrial partner:
Network Automation AB