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MEMS switch arrays for reconfiguration of telecommunication networks

Large, single chip integrated MEMS switch arrays for the reconfiguration of copper-wire telecommunication networks.

This project focuses on the development of large 20x20 MEMS doubleswitch (DPDT) arrays for reconfiguring the copper-wire telecommunication network. On a chip-size of 14 mm x 14 mm, 400 individually addressable doubleswitches are integrated and packaged on a single chip.

SEM image of the 20x20 array.
SEM image of the 20x20 array.
20x20 array.
20x20 array.

Project sponsors

  • VINNOVA
  • Network Automation AB

Involved people (at KTH):
Stefan Braun (alumni)
Göran Stemme

Project leader (at KTH):
Joachim Oberhammer

Involved industrial partner:
Network Automation AB