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Piezoelectrically actuated RF MEMS switches

A project within the RF MEMS workpackage of the European project Q2M (FP6, STREP).

This project focuses on the utilization of piezoelectric materials in RF MEMS switches. The main obstacle, fabrication incompatibility of different materials due to the high processing temperature of piezoelectric films, is addressed by using a wafer-scale transfer bonding process originally developed at KTH by Dr. Frank Niklaus.

Piezoelectrically actuated RF MEMS switch.
Piezoelectrically actuated RF MEMS switch.

This project is a part of the RF MEMS workpackage of the European project Q2M (Quality to Micromachining, FP6-STREP, coordinated by KTH-Dr. Wouter van der Wijngaart), and carried out in collaboration with: VTT
(Finland), LK Products (Finland), Cranfield University (UK), IBM Zurich Research Center (Switzerland).

Involved people (at KTH)
Farizah Saharil

Project leader (at KTH)
Joachim Oberhammer

Page responsible:Web editors at EECS
Belongs to: Micro and Nanosystems
Last changed: Dec 12, 2018