Skip to main content

A Scalable Method for the large-area Integration of 2D Materials

Published Feb 10, 2021
2D material deposited on wafer
Illustration of the 2D material transfer. Credit: Arne Quellmalz

Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies. But to exploit this potential we must be able to integrate 2D materials into semiconductor manufacturing lines – a notoriously difficult step. A team of researchers from the department of Micro and Nanosystems now reports a new method to make this work.

Quellmalz, A. et al. Large-area integration of two-dimensional materials and their heterostructures by wafer bonding. Nature Communications 12, 917 (2021).

doi.org/10.1038/s41467-021-21136-0

KTH news: Here the article from KTH news

Page responsible:Web editors at EECS
Belongs to: Micro and Nanosystems
Last changed: Feb 10, 2021